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公開日期標題作者
1-六月-2004Fabrication of sub-60-nm contact holes in silicon dioxide layersKo, FH; You, HC; Chu, TC; Lei, TF; Hsu, CC; Chen, HL; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
3-四月-2006Fullerene-incorporation for enhancing the electron beam resist performance for contact hole patterning and fillingYou, HC; Ko, FH; Lei, TF; 材料科學與工程學系奈米科技碩博班; 電子工程學系及電子研究所; Graduate Program of Nanotechnology , Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-十一月-2002Improving the electrical integrity of Cu-CoSi2 contacted n(+)p junction diodes using nitrogen-incorporated Ta films as a diffusion barrierYang, WL; Wu, WF; You, HC; Ou, KL; Lei, TF; Chou, CP; 機械工程學系; 電子物理學系; Department of Mechanical Engineering; Department of Electrophysics
2006Physical characterization and electrical properties of sol-gel-derived zirconia filmsYou, HC; Fu-Hsiang, K; Lei, TF; 材料科學與工程學系奈米科技碩博班; 電子工程學系及電子研究所; Graduate Program of Nanotechnology , Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-三月-2005Resist nano-modification technology for enhancing the lithography and etching performanceYou, HC; Ko, FH; Lei, TF; 材料科學與工程學系奈米科技碩博班; 電子工程學系及電子研究所; Graduate Program of Nanotechnology , Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
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