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國立陽明交通大學機構典藏
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顯示 1 到 14 筆資料,總共 14 筆
公開日期
標題
作者
2016
Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D Integration
Liang, Hao-Wen
;
Yu, Ting-Yang
;
Chang, Yao-Jen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-八月-2018
Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer Layer
Yu, Ting-Yang
;
Liang, Hag-Wen
;
Chang, Yao-Jen
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications
Huang, Yen-Jun
;
Chen, Hsiu-Chi
;
Yu, Ting-Yang
;
Lai, Bo-Hung
;
Shih, Yu-Chiao
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
Yang, Yu-Tao
;
Yu, Ting-Yang
;
Kuo, Shu-Chiao
;
Huang, Tai-Yuan
;
Yang, Kai-Ming
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
Chen, Hsiu-Chi
;
Kho, Yi-Tung
;
Huang, Yen-Jun
;
Hsieh, Yu-Sheng
;
Chang, Yao-Jen
;
Tang, Ya-Sheng
;
Yu, Ting-Yang
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
High Transmittance and Broaden Bandwidth through the Morphology of Anti-Reflective Layers on THz Polarizer with Si Substrate
Chi, Nai-Chen
;
Yu, Ting-Yang
;
Tsai, Hsin-Cheng
;
Wang, Shiang-Yu
;
Luo, Chih-Wei
;
Chen, Kuan-Neng
;
電子物理學系
;
電子工程學系及電子研究所
;
奈米科學及工程學士學位學程
;
Department of Electrophysics
;
Department of Electronics Engineering and Institute of Electronics
;
Undergraduate Honors Program of Nano Science and Engineering
1-一月-2017
High Transmittance Broadband THz Polarizer Using 3D-IC Technologies
Chi, Nai-Chen
;
Yu, Ting-Yang
;
Tsai, Hsin-Cheng
;
Wang, Shiang-Yu
;
Luo, Chih-Wei
;
Yang, Yu-Tao
;
Chen, Kuan-Neng
;
電機學院
;
電子工程學系及電子研究所
;
College of Electrical and Computer Engineering
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2015
High Transmittance Silicon Terahertz Polarizer Using Wafer Bonding Technology
Yu, Ting-Yang
;
Tsai, Hsin-Cheng
;
Wang, Shiang-Yu
;
Luo, Chih-Wei
;
Chen, Kuan-Neng
;
電子物理學系
;
電子工程學系及電子研究所
;
Department of Electrophysics
;
Department of Electronics Engineering and Institute of Electronics
1-八月-2020
Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
Chou, Tzu-Chieh
;
Yang, Kai-Ming
;
Li, Jian-Chen
;
Yu, Ting-Yang
;
Yang, Yu-Tao
;
Hu, Han-Wen
;
Liu, Yu-Wei
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
交大名義發表
;
National Chiao Tung University
1-九月-2017
Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration
Yang, Yu-Tao
;
Chou, Tzu-Chieh
;
Yu, Ting-Yang
;
Chang, Yu-Wei
;
Huang, Tai-Yuan
;
Yang, Kai-Ming
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2019
Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere
Chou, Tzu-Chieh
;
Yang, Kai-Ming
;
Li, Jian-Chen
;
Yu, Ting-Yang
;
Chung, Ying-Ting
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
交大名義發表
;
National Chiao Tung University
1-十二月-2017
Robust terahertz polarizers with high transmittance at selected frequencies through Si wafer bonding technologies
Yu, Ting-Yang
;
Chi, Nai-Chen
;
Tsai, Hsin-Cheng
;
Wang, Shiang-Yu
;
Luo, Chih-Wei
;
Chen, Kuan-Neng
;
電子物理學系
;
電子工程學系及電子研究所
;
Department of Electrophysics
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2018
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
Pan, Yu-Ming
;
Yang, Yu-Tao
;
Chou, Tzu-Chieh
;
Yu, Ting-Yang
;
Yang, Kai-Ming
;
Ko, Cheng-Ta
;
Chen, Yu-Hua
;
Tseng, Tzyy-Jang
;
Chen, Kuan-Neng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
1-一月-2017
Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
Ko, Cheng-Ta
;
Yang, Kai-Ming
;
Lin, Jim-Wein
;
Wang, Chih-Lun
;
Chou, Tzu-Chieh
;
Yang, Yu-Tao
;
Yu, Ting-Yang
;
Chen, Yu-Hua
;
Chen, Kuan-Neng
;
Tseng, Tzyy-Jang
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics