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1-九月-2012A 7.4-mW 200-MS/s Wideband Spectrum Sensing Digital Baseband Processor for Cognitive RadiosYu, Tsung-Han; Yang, Chia-Hsiang; Cabric, Danijela; Markovic, Dejan; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2013Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Yu, Tsung-Han; Chiang, Cheng-Hao; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013Electrical Investigation and Reliability of 3D Integration Platform using Cu TSVs and Micro-Bumps with Cu/Sn-BCB Hybrid BondingChang, Yao-Jen; Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chiang, Cheng-Hao; Fu, Huan-Chun; Yu, Tsung-Han; Fan, Cheng-Han; Lo, Wei-Chung; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2011An Energy-Efficient VLSI Architecture for Cognitive Radio Wideband Spectrum SensingYu, Tsung-Han; Yang, Chia-Hsiang; Markovic, Dejan; Cabric, Danijela; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2008Microlens array by ink-jet technology for LCD backlight applicationsHung, Chien-Hsiang; Yu, Tsung-Han; Cheng, Jung-An; Chang, Chi-Hsien; Hsiau, Yi-Hau; Tien, Chung-Hao; Li, Tsung-Yang; Mo, Chi-Neng; 光電工程學系; Department of Photonics
1-四月-2009Microlens Arrays by Direct-Writing Inkjet Print for LCD Backlighting ApplicationsTien, Chun-Hao; Hung, Chien-Hsiang; Yu, Tsung-Han; 光電工程學系; 顯示科技研究所; Department of Photonics; Institute of Display
1-六月-2015Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O ApplicationChang, Yao-Yen; Ko, Cheng-Ta; Yu, Tsung-Han; Hsieh, Yu-Sheng; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-三月-2012Power and Area Minimization of Reconfigurable FFT Processors: A 3GPP-LTE ExampleYang, Chia-Hsiang; Yu, Tsung-Han; Markovic, Dejan; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2013三維異質整合技術之低溫混合接合於發光二極 體元件應用游宗翰; Yu, Tsung-Han; 陳冠能; Chen, Kuan-Neng; 電子工程學系 電子研究所
顯示 1 到 9 筆資料，總共 9 筆