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公開日期標題作者
2015Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder DiametersHsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 交大名義發表; 材料科學與工程學系; National Chiao Tung University; Department of Materials Science and Engineering
1-一月-2014Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump InterconnectionsHuang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.; 材料科學與工程學系; Department of Materials Science and Engineering
2016Electromigration in microbumps with Cu-Sn intermetallic compoundsChu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2014Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigrationLin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 電機學院; College of Electrical and Computer Engineering
12-四月-2018A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumpsChang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye; 材料科學與工程學系; Department of Materials Science and Engineering
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