會議論文;;Conferences Paper

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Copper-to-copper direct bonding using different (111) surface ratios of nanotwinned copper films
(2019-01-01)
Huang, J. W.
;
Shie, K. C.
;
Liu, H. C.
;
Li, Y. J.
;
Cheng, H. Y.
Copper-to-copper direct bonding emerges to be the most important technique for fine pitch packaging in microelectronic devices. Low temperature Cu-to-Cu direct bonding by using highly (111)-oriented nanotwinned Cu (nt-Cu) has been achieved because Cu (111) surface has higher surface diffusiyities. To investigate the bonding effect by using different surface ratio nt-Cu, electroplating under different conditions was performed. The results indicate that bonding with higher (111)-surface ratio copper films would obtain a higher bonding strength of 15% w hen bonding at 300 degrees C.