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Now showing 1 - 6 of 6

Reduction of resistivity of electroplated copper by rapid thermal annealing
(2002-06-01)
Chang, SC
;
Shieh, JM
;
Dai, BT
;
Feng, MS
;
材料科學與工程學系
Reduction of resistivities of copper films, electroplated by superior electrolytes with capabilities of gap filling sub-150 nm damascenes, was demonstrated to be below 2.1 muOmega cm by rapid thermal annealing at 400degrees C in 30 s. In as-deposited copper films, the charge transfer polarization resistances and the incorporation effects of additives determined their resistivity and the dosage of impurities. In addition, the activation energy for grain growth slightly increased from similar to0.33 eV for additive-free electrolytes, to similar to0.4 eV for the superior electrolytes, and the process time was significantly shorter than several hours in conventional furnace processes. (C) 2002 The Electrochemical Society.
Superpolishing for planarizing copper damascene interconnects
(2003-05-01)
Chang, SC
;
Shieh, JM
;
Dai, BT
;
Feng, MS
;
Li, YH
We demonstrate a superpolishing electrolyte, which consists of acid additives in conventional Cu polishing electrolytes (H3PO4), for efficiently planarizing Cu damascene features. The significant additive concentration gradient in features, resulting in a selective Cu dissolution rate within features, is explored as a major mechanism that yields such electrolytes with high planarization efficiency. Moreover, another additive, polyethylene glycol as a suppressor, is also employed to reduce oxygen bubbling on polished films. Consequently, a smooth surface with a complete step height elimination is obtained in a 70 mm trench after electropolishing. (C) 2003 The Electrochemical Society.
Pattern-dependent copper microcorrosion from CMP
(2004)
Chen, KW
;
Wang, YL
;
Chang, L
;
Chang, SC
;
Li, FY
After chemical mechanical planarization (CMP) processes, copper microcorrosion was found in a specific pattern, which consisted of two sides of small trench islands connected by a long underlayer metal line. The depth of the copper recess was strongly dependent on the length of the underlayer metal line as well as the size of the trench islands. This phenomenon was different from typical photocorrosion; it was suggested to be induced by the additional electrochemical potential from the connection of the trench islands. Auger analysis proves that higher copper oxidation rate occurred on the specific pattern compared to those without connection. In addition, the pattern-dependent microcorrosion was identified by blocking the connection of the trench islands. A proposed model was given to account for the enhanced copper corrosion from the specific patterns during CMP. (C) 2004 The Electrochemical Society.
Micro-photoluminescence from V-shape inverted pyramid in HVPE grown GaN film
(2002)
Lee, CK
;
Chen, YB
;
Chang, SC
;
Pan, CL
;
Wang, SC
We report the room-temperature micro-luminescence images from V-shaped inverted pyramids in undoped GaN films grown on (0001) sapphire substrate by hybrid vapor phase epitaxy. As the excitation laser spot at 325 nm was translated from the surface toward the center of the inverted pyramid along its slope, the center wavelength of the PL peak shows a trend of monotonic red-shift of from 373.9 nm to 379.1 nm. This could be attributed to the 3-dimensional release of stress and associated decrease of build-in piezoelectric field in the V-defects. A distinct and strong emission at 386.7 nm was observed at the apex of the V-defect. This could be originated from the threading dislocation at the onset of the defect.
A platform-based MPEG-4 Advanced Video Coding (AVC) decoder with block level pipelining
(2003)
Wang, SH
;
Peng, WH
;
He, YW
;
Lin, GY
;
Lin, CY
We present a baseline MPEG-4 AVC (Advanced Video Coding) decoder based on an optimized platform-based design methodology. With this methodology, we jointly optimize the software and hardware design of the decoder. Overall decoding throughput is increased by synchronizing the software and the dedicated co-processors. The synchronization is achieved at macroblock-level pipelining. In addition, we optimize the decoder software by enhancing the frame buffer management, boundary padding, and content aware inverse transform. To speed up motion compensation and inverse transform, which are the most computationally intensive modules, two dedicated acceleration modules are realized. For comparison, the proposed prototype decoder and MPEG-4 AVC reference decoder are evaluated on an ARM platform, which is one of most popular portable devices. Our experiments show that the throughput of the MPEG-4 reference decoder can be improved by 6 to 7 times. On an ARM966 board, the optimized software without hardware acceleration can achieve a decoding rate up to 5 frames per second (fps) for QCIF video sequences. With the dedicated accelerators, the overall throughput is increased by about 30% to reach 6.6 fps on the average and is up to 10.3 fps for slow motion video sequences.
A platform-based de-blocking filter design with bus-interleaved architecture for H.264
(2005)
Chang, SC
;
Peng, WH
;
Wang, SH
;
Chiang, TH
;
交大名義發表
In this paper, we present an ARM platform-based architecture design for de-blocking filter in H.264. According to statistical analysis, we propose an adaptive transmission scheme to reduce the bus workload. Moreover, we develop a bus-interleaved architecture to reduce the processing latency. As compared to the state-of-the-art designs, our scheme offers 3x to 14x performance improvement. Furthermore, we have proved our design using an ARM emulation board.

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