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A Study of the Relationship Between Endurance and Retention Reliability for a HfOx-Based Resistive Switching Memory
(2020-09-01)
Chung, Wei-Min
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Chang, Yao-Feng
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Hsu, Yu-Lin
;
Chen, Y. -C. Daphne
;
Lin, Chao-Cheng
This study determines the relationship between retention and endurance reliability for a HfOx-based resistive random access memory (ReRAM). A TiN (15 nm) / HfOx (6 nm) / Ti (10 nm) / TiN (40 nm) stacked structure is fabricated and tested to verify its basic characteristics and reliability. The high resistance states (HRS) retention behavior is characterized and is found to degrade over 100x on the endured bits because there is a sequential high temperature procedure. The degradation is reduced slightly to a similar to 30x drop for the endured devices with one single refresh cycle. During the endurance and retention test procedures, the HRS resistance decreases because neutral oxygen vacancy filaments grow and this cannot be reversed. The I-V characteristics for endured devices are also determined. The results show that isothermal treatment causes a gradual SET and RESET process with multiple feasible states. The thermally induced filament degradation model (isolated filament vs. continuous filament) is verified by the relationship between retention and endurance reliability. Design guidance is recommended for an improvement in ReRAM reliability.
Annealing effects on resistive switching of IGZO-based CBRAM devices
(2020-10-01)
Gan, Kai-Jhih
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Liu, Po-Tsun
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Ruan, Dun-Bao
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Chiu, Yu-Chuan
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Sze, Simon M.
In this study, the impact of post-oxide deposition annealing on performance of IGZO-based conductive-bridging random access memory (CBRAM) is reported. It is found that besides the distinct reduction in resistive switching parameters of SET/RESET voltages, their dispersions, and the resistance ratio of high-resistance state to low-resistance state can be improved after N-2 annealing. The annealing effects on enhancing of the resistive switching properties are investigated by x-ray photoelectron spectra. It can be considered that the formation of the filament is better controlled by the increase of oxygen vacancies in the switching layer, which is the main reason for the improvement of resistive switching characteristics.
A characteristic improved technique and analysis with plasma treatment to the electrode on oxide-based resistive random access memory
(2020-03-15)
Lin, Chih-Yang
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Chang, Ting-Chang
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Pan, Chih-Hung
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Chen, Min-Chen
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Xu, You-Lin
A technique was proposed to concentrate the distribution of set voltages. After a plasma treatment, the stability of the high-resistive state (HRS) increased, and the distribution of set voltages was more concentrated at 0.8 V, with a sufficient HRS/LRS resistive ratio (similar to 100x). In addition, the surface of the TiN electrode became rougher, causing oxygen to enter the TiN electrode and form a TiON layer, which acts as an oxygen reservoir. The reservoir is confirmed and the conduction model is supported by both electrical and material analyses. We propose that the observed improvement is due to the difference in the TiN electrode surface. (C) 2019 Published by Elsevier B.V.
Effect of thermal treatment on resistive switching characteristics in Pt/Ti/Al2O3/Pt devices
(2008-12-25)
Lin, Chih-Yang
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Lee, Dai-Ying
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Wang, Sheng-Yi
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Lin, Chun-Chieh
;
Tseng, Tseung-Yuen
Resistive switching characteristics of Pt/Ti/Al2O3/Pt memory devices annealed at various temperatures including 400 degrees C, 500 degrees C and 600 degrees C for 1 h under ambient condition were investigated in the study. The Al2O3 thin films annealed at up to 600 degrees C for 1 h remain amorphous phase based on the X-ray diffraction (XRD) analyses. As increasing annealing temperature, the forming voltage (activating the pristine device) of the memory device decreases in contrast to the rising trend of the turn-on voltage (switching from high to low resistance state). However, the turn-off voltage (switching from low to high resistance state) is almost uninfluenced by thermal annealing. These phenomena might be attributed to the interdiffusion between Ti and Al2O3, based on the analyzed results of secondary ion mass spectroscopy (SIMS) and high resolution transmission electron microscope (HR-TEM). Moreover, the thermal annealing process eventually creates high conducting paths with a high density of oxygen vacancies between the two electrodes. (c) 2008 Elsevier B.V. All rights reserved.
Reproducible resistive switching behavior in sputtered CeO2 polycrystalline films
(2008-12-25)
Lin, Chih-Yang
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Lee, Dai-Ying
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Wang, Sheng-Yi
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Lin, Chun-Chieh
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Tseng, Tseung-Yuen
Sputter-deposited CeO2 film in the metal-insulator-metal structure exhibits repeatable resistive switching behavior under voltage sweep. Based on the X-ray diffraction patterns and the cross-sectional scanning electron microscope image, the CeO2 film is polycrystalline with columnar grains perpendicular to the bottom electrode. Moreover, due to the symmetric device structure of Pt/CeO2/Pt, the resistive switching behavior is independent of bias polarity so that both positive and negative voltages can switch the device from high conducting state (ON-state) into low conducting state (OFF-state) and then back to ON-state, which is named non-polar resistive switching. The resistance ratio between two memory states is about five orders of magnitude, which is stable over 10(4) S at 0.3 V stress. in addition, the resistance ratio decreases with increasing the current compliance during forming process. The stability of ON-state, OFF-state, and as-deposited film state (the state before performing forming process) against temperature is also investigated in this study, showing that the OFF-state is less stable. (C) 2008 Elsevier B.V. All rights reserved.
Switching Failure Mechanism in Zinc Peroxide-Based Programmable Metallization Cell
(2018-10-19)
Simanjuntak, Firman Mangasa
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Chandrasekaran, Sridhar
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Lin, Chun-Chieh
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Tseng, Tseung-Yuen
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電子工程學系及電子研究所
The impact of peroxide surface treatment on the resistive switching characteristics of zinc peroxide (ZnO2)-based programmable metallization cell (PMC) devices is investigated. The peroxide treatment results in a ZnO hexagonal to ZnO2 cubic phase transformation; however, an excessive treatment results in crystalline decomposition. The chemically synthesized ZnO2 promotes the occurrence of switching behavior in Cu/ZnO2/ZnO/ITO with much lower operation current as compared to the Cu/ZnO/ITO (control device). However, the switching stability degrades as performing the peroxide treatment for a longer time. We suggest that the microstructure of the ZnO2 is responsible for this degradation behavior and fine tuning on ZnO2 properties, which is necessary to achieve proper switching characteristics in ZnO2-based PMC devices.
Improved resistive switching properties of Ti/ZrO2/Pt memory devices for RRAM application
(2011-07-01)
Wang, Sheng-Yu
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Tsai, Chen-Han
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Lee, Dai-Ying
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Lin, Chih-Yang
;
Lin, Chun-Chieh
In this study, we have investigated the effect of current compliance during forming process on resistive switching (RS) characteristics of the Ti/ZrO2/Pt device. The higher the current compliance is, the larger RS operation voltage is needed. The Ti/ZrO2/Pt device with high device yield can be operated over 10,000 RS cycles by sweeping dc voltage. and the on and off two memory states exhibit good stability under 0.3 V stress voltage. Moreover, the data retention of both memory states is over 10(5) s. As applying +6-V 10-ns and -3-V 10-ns voltage pulses on the device, there are operation errors observed during continuous write-read-erase-read cycles until increasing the pulse width to 50 ns. Nondestructive readout tests are also performed on the Ti/ZrO2/Pt device before and after 10(3) pulse cycles without any obvious degradation observed. Compared with reported ZrO2-based memory devices, our Ti/ZrO2/Pt device exhibits better RS properties and has a high potential for memory application. (C) 2011 Elsevier B.V. All rights reserved.
Resistive switching behavior of Ga doped ZnO-nanorods film conductive bridge random access memory
(2018-08-30)
Singh, Pragya
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Simanjuntak, Firman Mangasa
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Kumar, Amit
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Tseng, Tseung-Yuen
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電子工程學系及電子研究所
The influence of Ga dopant on resistive switching behavior of ZnO-nanorods film conducting bridge random access memory was investigated. Using a hydrothermal process, we grew vertically well-aligned and uniform Ga doped ZnO (GZO)-NRs films on transparent glass substrates to fabricate Cu/TiW/GZO-NRs/Indium Tin Oxide/Glass devices. The GZO-NRs film provides a diffusion path for the Cu ions to form a conducting bridge; thus, reducing the formation of a branched filament. The Ga dopant induces a significant improvement in switching distribution of high resistance states (HRS) and low resistance states (LRS). The 1.5 mol% Ga doped device exhibits good retention up to 10(4) s and high HRS/LRS ratio of 30 times. Therefore, our proposed device structure may be a good candidate for future conductive-bridge resistive random access memory application.
Mechanism and characterizations studies of resistive switching effects on a thin FeOx-transition layer of the Ti/TiN/SiO2/FeOx/FePt structure by thermal annealing treatments
(2011-12-15)
Chang, Yao-Feng
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Feng, Li-Wei
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Chang, Ting-Chang
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
We investigated annealing effects on the bipolar resistive switching characteristics and mechanism of the thin FeOx transition layer in a Ti/TiN/SiO2/FeOx/FePt structure by depositing a plasma-enhanced tetraethyl orthosilicate oxide onto the Fe-contented electrode. The electrical results show that the values of operation voltage, variation of electrical parameters and retention properties could be improved with the increasing thermal treatment budget. Tunneling electron microscope, X-ray diffraction, Auger electron spectroscopy and X-ray photon-emission spectra depth profiles were examined for cross-section image, crystallinity and composition analyses of the transition layer. In order to investigate the resistive switching mechanism and characterizations in Ti/TiN/SiO2/FeOx/FePt structure, the electrical parameters were extracted during set and reset process. The retention property at room temperature and 85 C was improved after the thermal treatment and maintains both resistance states over 6 x 10(4) s implies promising potential for future memory application. (C) 2011 Elsevier B.V. All rights reserved.
In-situ TEM observation of Multilevel Storage Behavior in low power FeRAM device
(2017-04-01)
Chiu, Chung-Hua
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Huang, Chun-Wei
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Hsieh, Ying-Hui
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Chen, Jui-Yuan
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Chang, Chia-Fu
The quest for non-volatile memories has attracted tremendous attention, especially in mature ferroelectric random access memory (FeRAM) with properties of high read/write speed and low power consumption. Strain engineering of multiferroic BiFeO3 (BFO) has recently become the subject of broad research interest because of its intriguing properties. In this study, we demonstrate the switchable diode characteristics in highly strained BFO thin films. Using a unique in situ electrical transmission electron microscopy (TEM), we verify the correlation between ferroelectric resistive switching with multilevel states and polarization reversal. Structural investigation confirms that the phase transition from mixed phase to pure T-like phase, accompanying with the polarization reversal by external bias, is the origin of the multilevel states. The switchable diode with multilevel resistive switching can be explained in terms of the variation of the barrier height, governed by ferroelectric polarization and polarity of the external bias. This research model, i.e., engineering of the room inside, can offer an approach toward high-density memories.

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