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收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

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    High-Performance Gate-First Epitaxial Ge n-MOSFETs on Si With LaAlO3 Gate Dielectrics
    (2010-12-01)
    Chen, W. B.
    ;
    Cheng, C. H.
    ;
    Chin, Albert
    ;
    光電學院
    ;
    電子工程學系及電子研究所
    This brief presents high-performance Ge n-MOSFETs with good high-field mobility of 218 cm(2)/V . s at 0.5 MV/cm, low subthreshold swing (SS) of 108 mV/dec, small equivalent oxide thickness (EOT) of 1.6 nm, low 7 x 10(-10) A/mu m OFF-state leakage, small bias temperature instability of 31 mV at 1.2 V overdrive and 85 degrees C, and full process compatibility with current very large-scale integration fabrication. These are one of the best SS and high-field mobility data among gate-first Ge n-MOSFETs using epitaxial Ge on 6-in Si wafer and proper high-kappa LaAlO3 dielectric without using an interfacial layer. Using a different high-kappa HfAlO gate dielectric, the Ge n-MOSFETs showed poor leakage, large flatband voltage shift, and degraded EOT.
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    Effect of NH3 Plasma Nitridation on Hot-Carrier Instability and Low-Frequency Noise in Gd-Doped High-kappa Dielectric nMOSFETs
    (2011-03-01)
    Chen, Yu-Ting
    ;
    Chen, Kun-Ming
    ;
    Lin, Cheng-Li
    ;
    Yeh, Wen-Kuan
    ;
    Huang, Guo-Wei
    The effects of post-NH3 plasma nitridation on device's hot-carrier instability and low-frequency noise in the Hf-based high-kappa/metal-gate n-channel metal-oxide-semiconductor field-effect transistors (nMOSFETs) with gadolinium (Gd) cap layers are investigated. With postnitridation, the direct-current and 1/f noise characteristics can be improved apparently. Moreover, a hot-carrier stressing-induced threshold voltage shift can be also suppressed despite of a similar transconductance degradation when comparing with that in the device without nitridation. With the charge-pumping and low-frequency noise measurements, we find that the bulk-and interfacial-trap densities can be reduced with nitrogen incorporation. The reduction of bulk and interfacial traps can be contributed to the suppression of Gd diffusion into a high-kappa layer. In this paper, appropriate post-NH3 plasma nitridation can improve the device performance and reliability and low-frequency noise for a gate-first high-kappa/metal-gate nMOSFET with a Gd cap layer.
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    Ultra-Low Power Green Electronic Devices
    (2015)
    Yi, S. H.
    ;
    Chin, Albert
    ;
    電子工程學系及電子研究所
    ;
    Department of Electronics Engineering and Institute of Electronics
    Power consumption is the crucial challenge for electronics. To lower the DC leakage power (P-DC), we applied the high-kappa gate dielectric to CMOS from the physics of Q equivalent to CV. More than 2 orders of magnitude lower P-DC is obtained at small 0.5 similar to 0.9 nm equivalent-oxide-thickness (EOT). The high-kappa dielectric also increases the charge controllability of flash memory and decrease the V-T disturbance by nearly cells, which improves cell density and cost. The AC power (P-AC) can be lowered by using high-mobility Ge CMOS at a lower V-D and 3D IC with a small capacitance, from basic physics of P-AC equivalent to CV(D)(2)f/2.