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Now showing 1 - 9 of 9

Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D Integration
(2018-01-01)
Lu, Cheng-Hsien
;
Kho, Yi-Tung
;
Yang, Yu-Tao
;
Chen, Yu-Pei
;
Chen, Chiao-Pei
In this paper, the four-point bending method experiments were carried out with different polyimides and passivation layers for realization of adhesion property below 400 degrees C. Three types of passivation layers, thermal oxide, tetraethoxysilane (TEOS) oxide, silicon nitride, and three types of polyimides, with hydrophobic silane, with hydrophilic silane and without silane, and annealing temperature were all considered in this paper. Moreover, the relation between adhesion strength and surface roughness is discussed. Finally, a low thermal budget (250-375 degrees C) polyimide/metal hybrid bonding scheme with good stress release was proposed for future hybrid bonding applications.
Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding
(2020-01-01)
Lu, Cheng-Hsien
;
Yang, Yi-Lun
;
Chen, Chiao-Pei
;
Tsai, Bin-Ling
;
Chen, Kuan-Neng
This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.
Fabrication and Thermal Dissipation Properties of Carbon Nanofibers Derived from Electrospun Poly(Amic Acid) Carboxylate Salt Nanofibers
(1970-01-01)
Li, Jia-Wei
;
Chiu, Yu-Jing
;
Chang, Chia-Jui
;
He, Hung-Chieh
;
Tu, Yi-Hsuan
Polyimides (PIs) possess excellent mechanical properties, thermal stability, and chemical resistance and can be converted to carbon materials by thermal carbonization. The preparation of carbon nanomaterials by carbonizing PI-based nanomaterials, however, has been less studied. In this work, the fabrication of PI nanofibers is investigated using electrospinning and their transformation to carbon nanofibers. Poly(amic acid) carboxylate salts (PAASs) solutions are first electrospun to form PAAS nanofibers. After the imidization and carbonization processes, PI and carbon nanofibers can then be obtained, respectively. The Raman spectra reveal that the carbon nanofibers are partially graphitized by the carbonization process. The diameters of the PI nanofibers are observed to be smaller than those of the PAAS nanofibers because of the formation of the more densely packed structures after the imidization processes; the diameters of the carbon nanofibers remain similar to those of the PI nanofibers after the carbonization process. The thermal dissipation behaviors of the PI and carbon nanofibers are also examined. The infrared images indicate that the transfer rates of thermal energy for the carbon nanofibers are higher than those for the PI nanofibers, due to the better thermal conductivity of carbon caused by the covalent sp(2) bonding between carbon atoms.
Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration
(2019-07-01)
Lu, Cheng-Hsien
;
Jhu, Shu-Yan
;
Chen, Chiao-Pei
;
Tsai, Bin-Ling
;
Chen, Kuan-Neng
A low-temperature wafer-level polyimide/metal asymmetric hybrid bonding structure using Cu/Sn metal and low-curing temperature polyimide is proposed in this paper. The Cu/Sn and polyimide can be bonded simultaneously at 250 degrees C. An ultrathin nickel (Ni) buffer layer was used to prevent intermetallic compound (IMC) formation during the deposition process of Sn. Moreover, the asymmetric bonding process could not only optimize the metal and polymer deposition processes but also achieve ultrathin bonding. Furthermore, to solve the issue of surface roughness, the window of polymerto- solder (P/S) thickness ratio from 1.51 to 2.66 was also demonstrated to show the tolerance of polymer hybrid bonding. The specific contact resistances of the bonded structures were generally maintained between 10-7 and 10(-8) Omega-cm(2), which indicate excellent electrical performance. As a result, the proposed wafer-level asymmetric hybrid bonding is a promising method for future 2.5-D and 3-D integration.
Porous Polyimide and Carbon Nanotubes: Solvent Vapor-Induced Transformation in the Nanochannels of Anodic Aluminum Oxide Templates
(2019-04-01)
He, Hung-Chieh
;
Tu, Yi-Hsuan
;
Li, Jia-Wei
;
Lin, Yu-Liang
;
Chen, Jiun-Tai
Polyimides (PIs) have attracted wide attention because of their exceptional thermal stability and applications in areas such as printed circuit boards and multichip modules. It remains a great challenge, however, to control the morphologies and properties of PI-based nanomaterials, especially porous PI-based nanotubes. In this work, a versatile method to fabricate porous PI nanotubes via the template method is developed, with a solvent vapor-induced transformation process. First, polyamic acid (PAA) solutions are used as precursors and infiltrated into the nanochannels of anodic aluminum oxide templates, forming PAA nanotubes. After the samples are annealed in tetrahydrofuran or dimethylformamide vapors, depression of the PAA tubes occurs, causing the formation of pores. The porous PAA nanotubes can be further converted to porous PI and carbon nanotubes by imidization and carbonization processes, respectively. The pore sizes of the porous nanomaterials can be controlled by changing the type of the annealing solvent and the solvent annealing time.
Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration
(2019-03-01)
Lu, Cheng-Hsien
;
Kho, Yi-Tung
;
Chen, Chiao-Pei
;
Tsai, Bin-Ling
;
Chen, Kuan-Neng
This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 degrees C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.
Effect of phosphate surface pretreatment on corrosion resistance and adhesion of PI coating on Mg-5 wt.% Sn alloy
(2015-06-18)
Lee, Hsiao-Chien
;
Huang, Yi-Chia
;
Liu, Tzeng-Feng
;
Whang, Wha-Tzong
;
Chao, Chuen-Guang
In this study, phosphate surface pretreatment (PSPT) and poly[pyromellitic dianhydride-co-4,4MODIFIER LETTER PRIME-oxydianiline] polyimide (PMDA-ODA PI) coating were used to provide corrosion protection for Mg-5 wt.% Sn alloy. PSPT enhanced the adhesion of PI coating by mechanical interlocking and chemical anchoring. Surface roughness was increased and provided stronger mechanical interlocking. Phosphates were formed on the alloy surface to act as anchor groups. Energy dispersive X-rayspectrometer and X-ray photoelectron spectroscopy results indicated that bonds formed between anchor groups and PI coating. The bonds provided chemical anchoring and enhanced the adhesion of PI coating. The increase of corrosion resistance of PI coating on Mg-5 wt.% Sn alloy (E-corr = -0.86V/SCE, [GRAPHICS] mu A cm(-2) and corrosion rate far less than [GRAPHICS] showed the bonds were stable enough to stand the attack of electrolyte and inhibit the electrochemical reaction at the interface.
Rubbing-induced molecular alignment on a rubbed alkyl-branched polyimide film
(1995)
Huang, JY
;
Li, JS
;
Chen, SH
;
交大名義發表
;
光電工程學系
Rubbing-induced molecular alignment on an alkyl-branched polyimide film with varying unidirectional rubbing strength has been investigated with the use of optical phase retardation measurement, atomic force microscopy (AFM), and second-harmonic generation (SHG). Our AFM images suggest that the rubbing-induced micro-groove should play a minor role in aligning liquid crystal (LC) molecules. The polar angle of the polar head group of a LC monolayer on an alkyl-branched polyimide film was found to vary with the rubbing strength. The results obtained from various experimental techniques can be reconciled with a simple molecular model proposed in this paper.
Medical displays by using plasma-beam-alignment technology
(2008-01-01)
Lee, Chin-Yang
;
Liu, Chi-Hung
;
Chen, Chih-Wei
;
Miki, Saodo
;
Chen, Huang-Ming Philip
Novel anode layer plasma within minimum chamber space was developed for non-contact alignment process. The plasma-treated polyimide (PI) surface showed no particle contamination and no micro-scratches. Surface morphology was investigated by using scanning electron microscope (SEM), an atomic force microscope (AFM), and X-ray photoemission spectroscopy. The different oxygen-to-carbon ratio ([O]/[C] ratio) for XPS spectra indicated a composition change after plasma treatment. Surface pretilt angles were varied from 0 to 2.1 degrees under different plasma exposure times. Finally, a prototype 20.8-in. QXGA IPS-mode gray-scale medical liquid-crystal display was successfully demonstrated with high contrast ratio, excellent uniformity, and wide viewing angle using this new plasma-beam-alignment technique.

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