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收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

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1993 - 19956

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🏛️國立陽明交通大學機構典藏

Access type: Open accessAuthor: search.filters.author.CHANG, EY

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Now showing 1 - 6 of 6
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    A PSEUDOMORPHIC GAINP/INP MESFET WITH IMPROVED DEVICE PERFORMANCE
    (1993-12-01)
    LIN, KC
    ;
    HSIN, YM
    ;
    CHANG, CY
    ;
    CHANG, EY
    ;
    材料科學與工程學系
    A high band-gap GaInP epitaxial material was grown on InP to increase the Schottky barrier height of the InP MESFET. The Schottky gate materials used in this study were Au and Pt,Si. The pseudomorphic GaInP/InP MESFET with Au gate has a Schottky barrier height of 0.54 eV and the reverse leakage current of the device is 10(-2) times lower than the conventional InP MESFET. The extrinsic and intrinsic transconductance of the pseudomorphic MESFET were 66.7 and 104.2 mS/mm respectively for the 5 mu m gate length GaInP/InP MESFET.
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    CATION SOURCE DEPENDENCE OF GA0.5IN0.5P GROWTH-RATE BY LOW-PRESSURE METALORGANIC CHEMICAL-VAPOR-DEPOSITION
    (1994-06-15)
    WU, JW
    ;
    CHANG, CY
    ;
    LIN, KC
    ;
    CHAN, SH
    ;
    CHEN, HD
    The Ga0.5In0.5P epilayer was grown by low-pressure metalorganic chemical vapor deposition. Trimethylgallium and triethylgallium were used as the gallium source's, while trimethylindium and ethyldimethylindium were used as the indium sources. The use of triethylgallium incorporated with trimethylindium enhanced the growth rate of Ga0.5In0.5P as compared to incorporation with ethyldimethylindium. While the use of trimethylgallium incorporated with ethyldimethylindium enhanced the growth rate of Ga0.5In0.5P significantly, as compared to incorporation with trimethylindium.
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    TIWN SCHOTTKY CONTACTS TO N-GA(0.51)IN(0.49)P
    (1994-08-01)
    LIN, KC
    ;
    CHANG, EY
    ;
    WANG, SP
    ;
    LAI, YL
    ;
    CHANG, CY
    The study of the applicability of TiW nitrides (TiWNx) as the Schottky contact metals to the n-type Ga0.51In0.49P has been made. The Ga0.51In0.49P epitaxial layer is successfully grown on the GaAs substrate by low-pressure metalorganic chemical vapor deposition (LP-MOCVD) to form a lattice-matched heterostructure. The RF-magnetron sputtering system is utilized for nitride deposition. Thermal stability of the nitride films is studied with the aid of a rapid thermal annealing system. The material properties are characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). With sufficient nitrogen content, the Schottky contacts showed excellent electrical and physical characteristics even after a high-temperature annealing. The barrier heights, ranging from 0.81 to 1.05 eV, depend on the content of nitrogen and the rapid thermal annealing (RTA) annealing condition. The XRD and AES results indicate no interaction occurring at the TiWNx/GaInP interface of both as-deposited and annealed samples. The outstanding characteristics of the Schottky contact are attributed to the high band-gap nature of the GaInP and the incorporation of nitrogen into the TiW films.
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    SUBMICRON T-SHAPED GATE HEMT FABRICATION USING DEEP-UV LITHOGRAPHY
    (1994-08-01)
    CHANG, EY
    ;
    LIN, KC
    ;
    LIU, EH
    ;
    CHANG, CY
    ;
    CHEN, TH
    A new combination of low/high/low sensitivity trilayer (PMMA/PMIPK/PMMA) resist system was used for deep UV lithography to fabricate submicron T-shaped gate. Gate length as narrow as 0.2 mum is achieved. The GaAs HEMT's with 0.3 mum T-shaped Ti/Pt/Au gate is fabricated using this technology. The HEMT demonstrated a 0.6 dB noise figure and 13 dB associated gain at 10 GHz. This deep UV lithography process provides a high throughput and low cost alternative to E-beam lithography for submicron T-gate fabrication.
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    REACTIVE ION ETCHING OF GAINP, GAAS, AND ALGAAS
    (1995-04-01)
    WU, JW
    ;
    CHANG, CY
    ;
    CHANG, EY
    ;
    CHANG, SH
    ;
    LIN, KC
    We have investigated the reactive ion etching of GaInP, GaAs, and AlGaAs. High etching selectivity of GaAs to AlGaAs (or to GaInP) can be achieved due to the formation of aluminum fluoride (AlF3) and indium fluoride (InF3) using a BCl3/SF6 mixture. By using a CH4/H-2 mixture, a polymer film is accumulated on the GaAs surface after reactive ion etching. This polymer film inhibits the reactive ion etching of GaAs. There is no polymer film accumulated on the surface of GaInP. The polymer deposited on the surface of GaInP is removed as the etching products are being removed. Hence, a high etching selectivity of GaInP to GaAs can be achieved by using a CH4/H-2 mixture.
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    BACK-GATING EFFECTS ON THE GA0.1IN0.8P/INP/INGAAS HIGH-ELECTRON-MOBILITY TRANSISTOR
    (1995-07-01)
    LIN, KC
    ;
    CHANG, CY
    ;
    WU, CC
    ;
    CHEN, HD
    ;
    CHEN, PA
    Pseudomorphic GaInP/InP/InGaAs high electron mobility transistors (HEMT) with improved Schottky contacts and excellent electrical characteristics are grown by low-pressure metal-organic chemical vapor deposition (LP-MOCVD) on the InP substrate. These HEMTs with 1.71 mu m gate length have an average extrinsic transconductance of 225 mS/mm. The back-gating effects of this device structure are investigated for the first time in this structure. Both positive and negative bias are applied to the ohmic and Schottky back-gate contacts of these devices. The positive back-gate bias has no effect on the drain current or the output transconductances of these devices. The effect of the negative back-gate bias is very similar to that when negative bias is applied on the gate of these HEMTs.