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Investigation of Efficiency Droop for UV-LED with N-type AlGaN Layer
(2012-01-01)
Tu, Po-Min
;
Chang, Jet-Rung
;
Huang, Shih-Cheng
;
Yang, Shun-Kuei
;
Lin, Ya-wen
The efficiency droop in InGaN-based 380nm UV light emitting device (LED) with n-GaN and n-AlGaN underlayer grown on sapphire substrate by metal-organic chemical vapor deposition (MOCVD) was investigated. From simulation result of high resolution x-ray diffraction (HRXRD) omega-2 theta. curve by using dynamical diffraction theory, the Al composition in the n-AlGaN layer was determined to be about 3%. The experimental results of temperature dependent photoluminescence (PL) demonstrated that the internal quantum efficiency (IQE) of n-GaN and n-AlGaN UV-LEDs are 43% and 39%, respectively, which are corresponding to an injected carrier density of 8.5 x 10(17) #/cm(3). It could be explained that the crystal quality of n-GaN is better than of n-AlGaN. In addition, the observation of pit density from atomic force microscopy (AFM) surface morphology is consistent with the interpretation. It was well-known that the pits appearing on the surface in the virtue of the threading dislocations. Thus, it means that defects induce the non-radiative centers and deteriorate the IQE of the UV-LED with n-AlGaN underlayer. Therefore, the light output power of n-GaN UV-LED is slightly higher below the forward current of 250 mA. Nevertheless, the output power was enhanced about 22% as the injection current was increased to 600 mA. Furthermore, the external quantum efficiency (EQE) of n-AlGaN UV-LED was nearly retained at the 600 mA (only 20% droop), whereas the UV-LED with n-GaN exhibits as high as 33%. We attributed this improvement to the less self-absoption by replacing n-GaN underlayer with n-AlGaN.
Nearly Dislocation-free Ge/Si Heterostructures by Using Nanoscale Epitaxial Growth Method
(2012-01-01)
Luo, Guang-Li
;
Ko, Chih-Hsin
;
Wann, Clement H.
;
Chung, Cheng-Ting
;
Han, Zong-You
The selective growth of germanium into nanoscale trenches on silicon substrates was investigated. These nanoscale trenches-the smallest size of which was 50 nm-were fabricated using the state-of-the-art shallow trench isolation technique. The quality of the Ge films was evaluated using transmission electron microscopy. It was found that the formation of threading dislocations (TDs) was effectively suppressed when using this deposition technique. It was considered that for the Ge grown in nanoscale Si areas (e. g., several tens of nanometers), the TDs were readily removed during cyclic thermal annealing, predominantly because their gliding distance to the SiO2 sidewalls was very short. Therefore, nanoscale epitaxial growth technology can be used to deposit Ge films on lattice-mismatched Si substrates with a reduced defect density. (C) 2011 Published by Elsevier B.V. Selection and/or peer-review under responsibility of Garry Lee
Growing GaN LEDs on amorphous SiC buffer with variable C/Si compositions
(2016-01-22)
Cheng, Chih-Hsien
;
Tzou, An-Jye
;
Chang, Jung-Hung
;
Chi, Yu-Chieh
;
Lin, Yung-Hsiang
The epitaxy of high-power gallium nitride (GaN) light-emitting diode (LED) on amorphous silicon carbide (a-SixC1-x) buffer is demonstrated. The a-SixC1-x buffers with different nonstoichiometric C/Si composition ratios are synthesized on SiO2/Si substrate by using a low-temperature plasma enhanced chemical vapor deposition. The GaN LEDs on different SixC1-x buffers exhibit different EL and C-V characteristics because of the extended strain induced interfacial defects. The EL power decays when increasing the Si content of SixC1-x buffer. The C-rich SixC1-x favors the GaN epitaxy and enables the strain relaxation to suppress the probability of Auger recombination. When the SixC1-x buffer changes from Si-rich to C-rich condition, the EL peak wavelengh shifts from 446 nm to 450 nm. Moreover, the uniform distribution contour of EL intensity spreads between the anode and the cathode because the traping density of the interfacial defect gradually reduces. In comparison with the GaN LED grown on Sirich SixC1-x buffer, the device deposited on C-rich SixC1-x buffer shows a lower turn-on voltage, a higher output power, an external quantum efficiency, and an efficiency droop of 2.48 V, 106 mW, 42.3%, and 7%, respectively.
AlN Surface Passivation of GaN-Based High Electron Mobility Transistors by Plasma-Enhanced Atomic Layer Deposition
(2017-04-27)
Tzou, An-Jye
;
Chu, Kuo-Hsiung
;
Lin, I-Feng
;
Ostreng, Erik
;
Fang, Yung-Sheng
We report a low current collapse GaN-based high electron mobility transistor (HEMT) with an excellent thermal stability at 150 degrees C. The AlN was grown by N-2-based plasma enhanced atomic layer deposition (PEALD) and shown a refractive index of 1.94 at 633 nm of wavelength. Prior to deposit AlN on III-nitrides, the H-2/NH3 plasma pretreatment led to remove the native gallium oxide. The X-ray photoelectron spectroscopy (XPS) spectroscopy confirmed that the native oxide can be effectively decomposed by hydrogen plasma. Following the in situ ALD-AlN passivation, the surface traps can be eliminated and corresponding to a 22.1% of current collapse with quiescent drain bias (V-DSQ) at 40 V. Furthermore, the high temperature measurement exhibited a shift-free threshold voltage (V-th), corresponding to a 40.2% of current collapse at 150 degrees C. The thermal stable HEMT enabled a breakdown voltage (BV) to 687 V at high temperature, promising a good thermal reliability under high power operation.
Suppressing Non-Uniform Tunneling in InAs/GaSb TFET With Dual-Metal Gate
(2016-03-01)
Hsu, Ching-Yi
;
Chang, Chun-Yen
;
Chang, Edward Yi
;
Hu, Chenming
;
材料科學與工程學系
Non-uniformity in electric field causes early onset of tunneling near the edge of InAs/GaSb hetero-junction tunneling field-effect transistors. When a small area, often an edge, of the tunneling junction has a lower turn-on voltage, the steep switching characteristic is degraded. Fermi pinning at InAs surface greatly worsen the uniformity. We propose a dual-metal gate structure to address the non-uniformity issue. With proper choice of work functions, the dual-metal gate structure can effectively suppress the early onset of edge tunneling and significantly improve the subthreshold swing.
High-performance InGaN-based green light-emitting diodes with quaternary InAlGaN/GaN superlattice electron blocking layer
(2016-05-30)
Tzou, An-Jye
;
Lin, Da-Wei
;
Yu, Chien-Rong
;
Li, Zhen-Yu
;
Liao, Yu-Kuang
In this study, high-performance InGaN-based green light-emitting diodes (LEDs) with a quaternary InAlGaN/GaN superlattice electron blocking layer (QSL-EBL) have been demonstrated. The band structural simulation was employed to investigate the electrostatic field and carriers distribution, show that the efficiency and droop behavior can be intensively improved by using a QSL-EBL in LEDs. The QSL-EBL structure can reduce the polarization-related electrostatic fields in the multiple quantum wells (MQWs), leading to a smoother band diagram and a more uniform carriers distribution among the quantum wells under forward bias. In comparison with green LEDs with conventional bulk-EBL structure, the light output power of LEDs with QSL-EBL was greatly enhanced by 53%. The efficiency droop shows only 30% at 100 A/cm(2) comparing to its peak value, suggesting that the QSL-EBL LED is promising for future white lighting with high performance. (C) 2016 Optical Society of America
An Investigation of Carbon-Doping-Induced Current Collapse in GaN-on-Si High Electron Mobility Transistors
(2016-06-01)
Tzou, An-Jye
;
Hsieh, Dan-Hua
;
Chen, Szu-Hung
;
Liao, Yu-Kuang
;
Li, Zhen-Yu
This paper reports the successful fabrication of a GaN-on-Si high electron mobility transistor (HEMT) with a 1702 V breakdown voltage (BV) and low current collapse. The strain and threading dislocation density were well-controlled by 100 pairs of AlN/GaN superlattice buffer layers. Relative to the carbon-doped GaN spacer layer, we grew the AlGaN back barrier layer at a high temperature, resulting in a low carbon-doping concentration. The high-bandgap AlGaN provided an effective barrier for blocking leakage from the channel to substrate, leading to a BV comparable to the ordinary carbon-doped GaN HEMTs. In addition, the AlGaN back barrier showed a low dispersion of transiently pulsed I-D under substrate bias, implying that the buffer traps were effectively suppressed. Therefore, we obtained a low-dynamic on-resistance with this AlGaN back barrier. These two approaches of high BV with low current collapse improved the device performance, yielding a device that is reliable in power device applications.
Color-conversion efficiency enhancement of quantum dots via selective area nano-rods light-emitting diodes
(2016-08-22)
Liu, Che-Yu
;
Chen, Tzu-Pei
;
Kao, Tsung Sheng
;
Huang, Jhih-Kai
;
Kuo, Hao-Chung
A large enhancement of color-conversion efficiency of colloidal quantum dots in light-emitting diodes (LEDs) with novel structures of nanorods embedded in microholes has been demonstrated. Via the integration of nano-imprint and photolithography technologies, nanorods structures can be fabricated at specific locations, generating functional nanostructured LEDs for high-efficiency performance. With the novel structured LED, the color-conversion efficiency of the existing quantum dots can be enhanced by up to 32.4%. The underlying mechanisms can be attributed to the enhanced light extraction and nonradiative energy transfer, characterized by conducting a series of electroluminescence and time-resolved photoluminescence measurements. This hybrid nanostructured device therefore exhibits a great potential for the application of multi-color lighting sources. (C) 2016 Optical Society of America
Efficiency droop behavior improvement through barrier thickness modification for GaN-on-silicon light-emitting diodes
(2015-03-05)
Tzou, An-Jye
;
Lin, Bing-Cheng
;
Lee, Chia-Yu
;
Lin, Da-Wei
;
Liao, Yu-Kuang
Crack-free GaN-based light-emitting diodes (LEDs) were grown on 150-mm-diameter Si substrates by using low-pressure metal-organic chemical vapor deposition. The relationship between the LED devices and the thickness of quantum barriers (QBs) was investigated. The crystal quality and surface cracking of GaN-on-Si were greatly improved by an AlxGa1-xN buffer layer composed of graded Al. The threading dislocation density of the GaN-on-Si LEDs was reduced to < 7 x 10(8) cm(-2), yielding LEDs with high internal quantum efficiency. Simulation results indicated that reducing the QB thickness improved the carrier injection rate and distribution, thereby improving the droop behavior of the LEDs. LEDs featuring 6-nm-thick QBs exhibited the lowest droop behavior. However, the experimental results showed an unanticipated phenomenon, namely that the peak external quantum efficiency (EQE) and light output power (LOP) gradually decreased with a decreasing QB thickness. In other words, the GaN-on-Si LEDs with 8-nm-thick QBs exhibited low droop behavior and yielded a good peak EQE and LOP, achieving a 22.9% efficiency droop and 54.6% EQE. (C) 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
Characterizing the electrical properties of raised S/D junctionless thin-film transistors with a dual-gate structure
(2014-12-11)
Cheng, Ya-Chi
;
Chen, Hung-Bin
;
Su, Jun-Ji
;
Shao, Chi-Shen
;
Wang, Cheng-Ping
This letter demonstrates a p-type raised source-and-drain (raised S/D) junctionless thin-film transistors (JL-TFTs) with a dual-gate structure. The raised S/D structure provides a high saturation current (> 1 mu A/mu m). The subthreshold swing (SS) is 100 mV/decade and the drain-induced barrier lowering (DIBL) is 0.8 mV/V, and the I-on/I-off current ratio is over 10(8) A/A for L-g = 1 mu m. Using a thin channel structure obtains excellent performance in the raised S/D structure. Besides the basic electrical characteristics, the dual-gate structure can also be used to adjust V-th in multi-V-th circuit designs. This study examines the feasibility of using JL-TFTs in future three-dimensional (3D) layer-to-layer stacked high-density device applications.

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