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On-chip ESD protection design by using polysilicon diodes in CMOS process
(2001-04-01)
Ker, MD
;
Chen, TY
;
Wang, TH
;
Wu, CY
;
電子工程學系及電子研究所
A novel on-chip electrostatic discharge (ESD) protection design by using polysilicon diodes as the ESD clamp devices in CMOS process is first proposed in this paper, Different process splits have been experimentally evaluated to find the suitable doping concentration for optimizing the polysilicon diodes for both on-chip ESD protection design and the application requirements of the smart-card ICs. The secondary breakdown current (It2) of the polysilicon diodes under the forward- and reverse-bias conditions has been measured by the transmission-line-pulse (TLP) generator to investigate its ESD robustness, Moreover, by adding an efficient VDD-to-VSS clamp circuit into the IC, the human-body-model (HBM) ESD robustness of the IC with polysilicon diodes as the ESD clamp devices has been successfully improved from the original similar to 300 V to become greater than or equal to3 kV, This design has been practically applied in a mass-production smart-card IC.
Investigation and Design of On-Chip Power-Rail ESD Clamp Circuits Without Suffering Latchup-Like Failure During System-Level ESD Test
(2008-11-01)
Ker, Ming-Dou
;
Yen, Cheng-Cheng
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
On-chip power-rail electrostatic discharge (ESD) protection circuit designed with active ESD detection function is the key role to significantly improve ESD robustness of CMOS integrated circuits (ICs). Four power-rail ESD clamp circuits with different ESD-transient detection circuits were fabricated in a 0.18-mu m CMOS process and tested to compare their system-level ESD susceptibility, which are named as power-rail ESD clamp circuits with typical RC-based detection, PMOS feedback, NMOS+PMOS feedback, and cascaded PMOS feedback in this work. During the system-level ESD test, where the ICs in a system have been powered up, the feedback loop used in the power-rail ESD clamp circuits provides the lock function to keep the ESD-clamping NMOS in a "latch-on" state. The latch-on ESD-clamping NMOS, which is often drawn with a larger device dimension to sustain high ESD level, conducts a huge current between the power lines to perform a latchup-like failure after the system-level ESD test. A modified power-rail ESD clamp circuit is proposed to solve this problem. The proposed power-rail ESD clamp circuit can provide high enough chip-level ESD robustness, and without suffering the latchup-like failure during the system-level ESD test.
Electrostatic discharge protection design for mixed-voltage CMOS I/O buffers
(2002-08-01)
Ker, MD
;
Chuang, CH
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
A new electrostatic discharge (ESD) protection circuit, using the stacked-nMOS triggered silicon controlled rectifier (SNTSCR) as the ESD clamp device, is designed to protect the mixed-voltage I/O buffers of CMOS ICs. The new proposed ESD protection circuit, which combines the stacked-nMOS structure with the gate-coupling circuit technique into the SCR device, is fully compatible to general CMOS processes without causing the gate-oxide reliability problem. Without using the thick gate oxide, the experimental results in a 0.35-mum CMOS process have proven that the human-body-model ESD level of the mixed-voltage I/O buffer can be successfully increased from the original similar to2 kV to >8 kV by using this proposed ESD protection circuit.
Design and analysis of on-chip ESD protection circuit with very low input capacitance for high-precision analog applications
(2002-09-01)
Ker, MD
;
Chen, TY
;
Wu, CY
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
An ESD protection design is proposed to solve the ESD protection challenge to the analog pins for high-frequency or current-mode applications. By including an efficient power-rails clamp circuit into the analog I/O pin, the device dimension (W/L) of ESD clamp device connected to the I/O pad in the analog ESD protection circuit can be reduced to only 50/0.5 (mum/mum) in a 0.35-mum silicided CMOS process, but it can sustain the human-body-model (machine-model) ESD level of up to 6 kV (400 V). With such a smaller device dimension, the input capacitance of this analog ESD protection circuit can be significantly reduced to only similar to1.0 pF (including the bond pad capacitance) for high-frequency applications. A design model to find the optimized layout dimensions and spacings on the input ESD clamp devices has been also developed to keep the total input capacitance almost constant (within 1% variation), even if the analog input signal has a dynamic range of 1 V.
Substrate-triggered SCR device for on-chip ESD protection in fully silicided sub-0.25-mu m CMOS process
(2003-02-01)
Ker, MD
;
Hsu, KC
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
The turn-on mechanism of a silicon-controlled rectifier (SCR) device is essentially a current triggering event. While a current is applied to the, base or - substrate of the SCR device, it can be quickly triggered, into its latching state. In this paper, a novel design concept to turn on the SCR device by applying the substrate-triggered technique is first proposed for effective on-chip electrostatic discharge (ESD) protection. This novel substrate-triggered SCR device has the advantages of controllable switching voltage and adjustable holding voltage and is compatible with, general CMOS processes without extra process modification such as the silicide-blocking mask and ESD implantation. Moreover, the substrate-triggered SCR, devices can be stacked in ESD protection circuits to avoid the translient-induced latch-up issue. The turn-on time of the proposed substrate-triggered SCR devices, can be reduced from 27.4 to 7.8 ns by the substrate-triggering, technique. The substrate-triggered SCR device with a small active area of only 20 mum x 20 mum can sustain the HBM ESD stress of 6.5 kV in a fully silicided 0.25-mum CMOS process.
Latchup-free ESD protection design with complementary substrate-triggered SCR devices
(2003-08-01)
Ker, MD
;
Hsu, KC
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
The turn-on mechanism of silicon-controlled rectifier (SCR) devices is essentially a current triggering event. While a current is applied to the base or substrate of an SCR device, it can be quickly triggered on into its latching state. In this paper, latchup-free electrostatic discharge (ESD) protection circuits which are combined with the substrate-triggered technique and an SCR device, are proposed. A complementary circuit style with the substrate-triggered SCR device is designed to discharge both the pad-to-V-SS and pad-to-V-DD ESD stresses. The novel complementary substrate-triggered SCR devices have the advantages of controllable switching voltage, adjustable holding voltage, faster turn-on speed, and compatible to general CMOS process without extra process modification such as the silicide-blocking mask and ESD implantation. The total holding voltage of the substrate-triggered SCR device can be linearly increased by adding the stacked diode string to avoid the transient-induced latchup issue in the ESD protection circuits. The on-chip ESD protection circuits designed with the proposed complementary substrate-triggered SCR devices and stacked diode string for the input/output pad and power pad have been successfully verified in a 0.25-mum salicided CMOS process with the human body model (machine model) ESD level of similar to7.25 kV (500 V) in a small layout area.
SCR device with double-triggered technique for on-chip ESD protection in sub-quarter-micron silicided CMOS processes
(2003-09-01)
Ker, MD
;
Hsu, KC
;
電機學院
;
College of Electrical and Computer Engineering
Turn-on efficiency is the main concern for silicon-controlled rectifier (SCR) devices used as on-chip electrostatic discharge (ESD) protection circuit, especially in deep sub-quarter-micron CMOS processes with much thinner gate oxide. A novel double-triggered technique is proposed to speed up the turn-on speed of SCR devices for using in on-chip ESD protection circuit to effectively protect the much thinner gate oxide in sub-quarter-micron CMOS processes. From the experimental results, the switching voltage and turn-on time of such double-triggered SCR (DT_SCR) device has been confirmed to be significantly reduced by this double-triggered technique.
ESD protection design to overcome internal damage on interface circuits,of a CMOS IC with multiple separated power pins
(2004-09-01)
Ker, MD
;
Chang, CY
;
Chang, YS
;
電機學院
;
College of Electrical and Computer Engineering
This paper reports a real case of electrostatic discharge (ESD) improvement on a complementary metal oxide semiconductor integrated circuit IC product with multiple separated power pins. After ESD stresses, the internal damage have been found to locate at, the interface circuit connecting between different circuit blocks with different power supplies. Some ESD designs have been implemented to rescue this IC product to meet the required ESD specification. By adding only an extra ESD clamp N-channel metal oxide semiconductor with a channel width of 10 mum between the interface node and the ground line, the human-body-model (HBM) ESD level of this IC product can be improved from the original 0.5 to 3 kV. By connecting the separated vertical sync signal (VSS) power lines through the ESD conduction circuit to a common VSS ESD bus realized by the seal ring, the HBM ESD level of the enhanced version IC product with 12 separated power supplies pairs can be significantly improved from original 1 kV up to > 5 kV, without noise coupling issue.
On-chip ESD protection design with substrate-triggered technique for mixed-voltage I/O circuits in subquarter-micrometer CMOS process
(2004-10-01)
Ker, MD
;
Lin, KH
;
Chuang, CH
;
電機學院
;
College of Electrical and Computer Engineering
A new electrostatic discharge (ESD) protection design, by using the substrate-triggered stacked-nMOS device, is proposed to protect the mixed-voltage I/O circuits of CMOS ICs. The substrate-triggered technique is applied to lower the trigger voltage of the stacked-nMOS device to ensure effective ESD protection for the mixed-voltage I/O circuits. The proposed ESD protection circuit with the substrate-triggered technique is fully compatible to general CMOS process without causing the gate-oxide reliability problem. Without using the thick gate oxide, the new proposed design has been fabricated and verified for 2.5/3.3-V tolerant mixed-voltage I/O circuit in a 0.25-mum salicided CMOS process. The experimental results have confirmed that the human-body-model ESD level of the mixed-voltage I/O buffers can be successfully improved from the original 3.4 to 5.6 kV by using this new proposed ESD protection circuit.
Design on power-rail ESD clamp circuit for 3.3-V I/O interface by using only 1-V/2.5-V low-voltage devices in a 130-nm CMOS process
(2006-10-01)
Ker, Ming-Dou
;
Chen, Wen-Yi
;
Hsu, Kuo-Chun
;
電機學院
;
College of Electrical and Computer Engineering
A new power-rail electrostatic discharge (ESD) clamp circuit for application in 3.3-V mixed-voltage input-output (I/O) interface is proposed and verified in a 130-nm 1-V/2.5-V CMOS process. The devices in this power-rail ESD clamp circuit are all 1-V or 2.5-V low-voltage nMOS/pMOS devices, which are specially designed without suffering the gate-oxide reliability issue under 3.3-V I/O interface applications. A special ESD detection circuit realized with the low-voltage devices is designed and added in the power-rail ESD clamp circuit to improve ESD robustness of ESD clamp devices by substrate-triggered technique. The experimental results verified in a 130-nm CMOS process have proven the excellent effectiveness of this new proposed power-rail ESD clamp circuit.

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