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收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

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🏛️國立陽明交通大學機構典藏

Access type: Open accessSubject: search.filters.subject.bonding strength

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    Experimental study on shear splitting failure of full-scale composite concrete encased steel beams
    (2002-09-01)
    Weng, CC
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    Yen, SI
    ;
    Jiang, MH
    ;
    土木工程學系
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    Department of Civil Engineering
    Presented herein is an experimental study that focuses on the shear splitting failure of composite concrete encased steel beams. Nine full-scale specimens were constructed and tested in this study. Significant horizontal cracks along the interface of steel flange and concrete, referred to as the shear splitting failure, appeared in five tested specimens. Observations from the experiments indicate that the steel flange width ratio, defined as the ratio of steel flange width to gross section width, has a dominant effect on the shear splitting failure of composite beams. The test results reveal that the shear splitting failure occurs when the steel flange width ratio of a composite beam reaches 0.67. The test results also show that the application of shear studs has a positive effect on preventing this type of failure for beams with large steel flange ratio. In addition to the experimental study, a new method for predicting the failure mode of composite beams is proposed. The proposed method gives satisfactory predictions as compared to the test results. Finally, a new equation is derived for the design of the stirrups to prevent shear splitting failure of naturally bonded composite beams.
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    Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers
    (2003-09-01)
    Liang, MW
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    Hsieh, TE
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    Chang, SY
    ;
    Chuang, TH
    ;
    材料科學與工程學系
    The multilayer thin-film systems of Cu/Ti/Si and Au/Cu/Al2O3 were diffusion-soldered at temperatures between 250degreesC and 400degreesC by inserting a Sn thin-film interlayer. Experimental results showed that a double layer of intermetallic compounds (IMCs) eta-(Cu0.99Au0.01)(6)Sn(5/)delta-(Au0.87Cu0.13)Sn was formed at the interface. Kinetics analyses revealed that the growth of intermetallics was diffusion-controlled. The activation energies as calculated from Arrhenius plots of the growth rate constants for (Cu0.99Au0.01)(6)Sn-5 and (Au0.87Cu0.13)Sn are 16.9 kJ/mol and 53.7 kJ/mol, respectively. Finally, a satisfactory tensile strength of 132 kg/cm(2) could be attained under the bonding condition of 300degreesC for 20 min.
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    Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints
    (2009-03-01)
    Lin, K. S.
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    Huang, H. Y.
    ;
    Chou, C. P.
    ;
    機械工程學系
    ;
    Department of Mechanical Engineering
    The present study details the microstructure evolution of the interfacial intermetallic compounds (IMCs) layer formed between the Sn-xAg-0.5Cu (x = 1, 3, and 4 wt.%) solder balls and electroless Ni-P layer, and their bond strength variation during aging. The interfacial IMCs layer in the as-reflowed specimens was only (Cu,Ni)(6)Sn(5) for Sn-xAg-0.5Cu solders. The (Ni,Cu)(3)Sn(4) IMCs layer formed when Sn-4Ag-0.5Cu and Sn-3Ag-0.5Cu solders were used as aging time increased. However, only (Cu,Ni)(6)Sn(5) IMCs formed in Sn-1Ag-0.5Cu solders, when the aging time was extended beyond 1500 h. Two factors are expected to influence bond strength and fracture modes. One of the factors is that the interfacial (Ni,Cu)(3)Sn(4) IMCs formed at the interface and the fact that fracture occurs along the interface. The other factor is Ag(3)Sn IMCs coarsening in the solder matrix, and fracture reveals the ductility of the solder balls. The above analysis indicates that during aging, the formation of interfacial (Ni,Cu)(3)Sn(4) IMCs layers strongly influences the pull strength and the fracture behavior of a solder joint. This fact demonstrates that interfacial layers are key to understanding the changes in bonding strength. Additionally, comparison of the bond strength with various Sn-Ag-Cu lead-free solders for various Ag contents show that the Sn-1Ag-0.5Cu solder joint is not sensitive to extended aging time.