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Item type:Item, THE BEHAVIOR OF BILATERAL LATCH-UP TRIGGERING IN VLSI ELECTROSTATIC DISCHARGE DAMAGE PROTECTION CIRCUITS(1993-11-01) ;HUANG, HS ;CHANG, CY ;HSU, CC ;CHEN, KLLIN, JKA new latch-up phenomenon that shows symmetrical diac I-V characteristics has been discovered recently. Electrical measurements show that a diac parasitic semiconductor-controlled-rectifier (SCR) device can exist between two adjacent electro static discharge damage (ESD) protection circuits or output buffers. The SCR consists of two parasitic P-N-P-N paths and can easily induce a localized SCR latch-up between two adjacent input or output terminals. This is not similar to traditional latch-up that creates a parasitic P-N-P-N path between power supply and ground pins, but is a new bilateral latch-up path between two adjacent input and output pins. A new latch-up failure mode due to this diac structure, which creates a bilateral path during temperature humidity bias (THB) testing, is discussed. Some suggestions regarding the improvement of this diac latch-up degradation are proposed. Advanced analyses and modeling are also presented in this paper. The modified diac latch-up lumped element model successfull explains this phenomenon.Item type:Item, A STUDY ON BILATERAL LATCH-UP SELF-TRIGGERING IN COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR PROTECTION CIRCUITS(1994-01-01) ;HUANG, HS ;CHANG, CY ;CHEN, KL ;LIU, IOHSU, CCThe results of serial studies on the behavior of bilateral latch-up in complementary metal-oxide-semiconductor field effect transistor (CMOS) protection circuits are presented. Bilateral latch-up self-triggering resulting from serial resistance or serial inductance on V-dd or V-ss is discussed. Optimizing the layout and design of output buffers to improve product performance and reliability is also recommended. The studies on the behavior of bilateral latch-up in CMOS protection circuits are increasingly important since low-power applications are the future trend.Item type:Item, NEW LARGE-ANGLE TILT IMPLANTED DRAIN STRUCTURE - SURFACE COUNTER-DOPED-LIGHTLY DOPED DRAIN FOR HIGH HOT-CARRIER RELIABILITY(1994-07-01) ;CHOU, JW ;CHANG, CY ;HUANG, C ;HO, LTKO, JA new surface counterdoped-lightly doped drain (SCD-LDD) structure with large angle tilt (LAT) implantation is proposed in this study. This structure introduces an additional larger tilt angle and lower-energy BF2 implant after the n- implant, which counterdopes the n- surface concentration to achieve a gate/n- fully overlapped, buried and sloped n- region inside the gate edge. As a result, the lateral electric fields inside the gate edge are reduced and pushed deeper into the substrate. In addition to a reduction in substrate current, this profile also suppresses hot carrier injection by driving the current away from the surface and the maximum electric field; then it shifts the avalanche region further into the bulk Si. This consequently produces a more effective enhancement of hot carrier reliability than that of conventional LDD's and controlled large-angle-tilt implanted drains (LATID's) for submicron VLSI circuits under 5 V operation. In conclusion, this SCD-LDD provides one more degree of freedom in optimizing the n- region doping profiles as a new LATID structure.