<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css">

學術出版;;Publications

Permanent URI for this communityhdl:11536/1

收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

Browse

Filters

20052

Settings

🏛️國立陽明交通大學機構典藏

Author: search.filters.author.Chang, EYSubject: search.filters.subject.HBT

Search Results

Now showing 1 - 2 of 2
  • Thumbnail Image
    Item type:Item,
    A gold-free fully copper-metallized InP heterojunction bipolar transistor using non-alloyed ohmic contact and platinum diffusion barrier
    (2005)
    Chang, SW
    ;
    Chang, EY
    ;
    Lee, CS
    ;
    Chen, KS
    ;
    Tseng, CW
    A gold-free, fully Cu-metallized InP heterojunction bipolar transistor using non-alloyed Ti/Pt/Cu and Pt/Ti/Pt/Cu ohmic contacts and platinum diffusion barrier has been successfully fabricated. The InGaAs/Ti/Pt/Cu ohmic structure was stable after annealing up to 350 degrees C as judged from the Auger depth profiles. A current-accelerated stress test was conducted on the device with a current density J(C) = 80kA/cm(2) for 24h, and the current gain showed no degradation after the current stress. The devices were also thermally annealed at 200 degrees C for 3 h and showed almost no change in the electrical parameters after the heat treatment. The results show that the Au-free, fully Cu-metallized InP heterojunction bipolar transistor (HBT) can be realized using non-alloyed ohmic contacts and Pt diffusion barrier.
  • Thumbnail Image
    Item type:Item,
    Gold-free fully cu-metallized InGaP/GaAs heterojunction bipolar transistor
    (2005-01-01)
    Chang, SW
    ;
    Chang, EY
    ;
    Biswas, D
    ;
    Lee, CS
    ;
    Chen, KS
    A gold-free, fully Cu-metallized InGaP/GaAs heterejunction bipolar transistor using platinum as the diffusion barrier has been successfully fabricated. The HBT uses Pd/Ge and Pt/Ti/Pt/Cu for n-type and p(+)-type ohmic contacts, respectively, and Ti/Pt/Cu for interconnect metals with platinum as the diffusion barrier. The Ti/Pt/Cu structure was stable during annealing up to 350degreesC judging from the X-ray diffraction (XRD) data and sheet resistance. A current-accelerated stress test was conducted on the device with a current density J(C) = 140 kA/cm(2) for 24 h, and the current gain showed no degradation. The devices were also thermally annealed at 250degreesC,for 24 h and showed little change. We have successfully demonstrated that an Au-free, fully Cu-metallized HBT can be realized using Pt as the diffusion barrier and Pd/Ge and Pt/Ti/Pt/Cu as the ohmic contacts.