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🏛️國立陽明交通大學機構典藏

Author: search.filters.author.Chen, Chiao-PeiSubject: search.filters.subject.X-ray photoelectron spectroscopy (XPS)

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    Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding
    (2020-01-01)
    Lu, Cheng-Hsien
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    Yang, Yi-Lun
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    Chen, Chiao-Pei
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    Tsai, Bin-Ling
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    Chen, Kuan-Neng
    This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.
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    Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration
    (2019-03-01)
    Lu, Cheng-Hsien
    ;
    Kho, Yi-Tung
    ;
    Chen, Chiao-Pei
    ;
    Tsai, Bin-Ling
    ;
    Chen, Kuan-Neng
    This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 degrees C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.