<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css">

學術出版;;Publications

Permanent URI for this communityhdl:11536/1

收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

Browse

🏛️國立陽明交通大學機構典藏

Author: search.filters.author.Chen, ChihSubject: search.filters.subject.electroplating

Search Results

Now showing 1 - 2 of 2
  • Thumbnail Image
    Item type:Item,
    Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
    (1970-01-01)
    Wang, I-Ju
    ;
    Ku, Ching-Shun
    ;
    Tu-Ngoc Lam
    ;
    Huang, E-Wen
    ;
    Tu, K. N.
    We have examined the effect of different bath temperatures on residual stress of both the random-oriented Cu films and the highly (111)-oriented nanotwinned Cu films by synchrotron radiation x-ray measurements. The bath temperature varied from 15 degrees C to 40 degrees C. The results indicate that the average residual stress in the highly (111)-oriented nanotwinned films is higher than that in the randomly oriented Cu films. However, the stress in the highly (111)-oriented Cu decreases with increasing bath temperature. The average residual stress can be reduced from 253 MPa electroplated at 15 degrees C to 95 MPa under a bath temperature of 35 degrees C. We could successfully tune and measure residual stress of the Cu thin films. The films with low residual stress prevent warpage from occurring on the substrate and lower the processing failure in copper direct bonding and other processes that need alignment.
  • Thumbnail Image
    Item type:Item,
    Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(IMPACT-IAAC 2016)
    (2016)
    Chang, Liang-Hsien
    ;
    Chen, Chih
    ;
    Hu, Dyi-Chung
    ;
    Tain, Ray
    ;
    Chen, Y. H.
    Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, which are thought to be mutually exclusive. According to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu using direct current with suitable additives on PCB substrates. Current density and the plating bath are variables. After copper electroplating, XRD, FIB, EBSD were used to observe the microstructure of the films. We found that the as-deposited Cu has > 30% (111)-oriented nt-Cu on the polymer substrate. The microstructures of the highly (111)-oriented nt-Cu will be presented.