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🏛️國立陽明交通大學機構典藏

Author: search.filters.author.Chen, LJHas files: No

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Now showing 1 - 4 of 4
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    Item type:Item,
    Chemical mechanical polishing for selective CVD-W
    (1997-10-30)
    Wang, MT
    ;
    Yeh, WK
    ;
    Tsai, MS
    ;
    Tseng, WT
    ;
    Chang, TC
    This work investigates chemical mechanical polishing (CMP) for W-filled contact holes, vias, and trenches by selective chemical vapor deposition. A novel process that combines the CMP technique with selective chemical vapor deposition of tungsten (CVD-W) was employed to remove nail heads due to overgrowth and W-particles on the surface of dielectric due to selectivity loss. The overfilled nail heads and the selectivity loss can be completely removed with very low down-pressure (3 psi) in a very short polishing time (30 s). This indicates that the novel process is very promising for ULSI multilevel interconnection application. The removal rate selectivities of W to thermal oxide, PECVD-TEOS, and BPSG were found to be 47:1, 30:1 and 15:1, respectively, while the selectivities of W to the barrier metals of TiW, Ti and Ta were determined to be 0.6:1, 6:1 and 28:1, respectively. (C) 1997 Elsevier Science S.A.
  • Thumbnail Image
    Item type:Item,
    Chemical mechanical polishing for selective CVD-W
    Wang, MT
    ;
    Yeh, WK
    ;
    Tsai, MS
    ;
    Tseng, WT
    ;
    Chang, TC
    This work investigates chemical mechanical polishing (CMP) for W-filled contact holes, vias, and trenches by selective chemical vapor deposition. A novel process that combines the CMP technique with selective chemical vapor deposition of tungsten (CVD-W) was employed to remove nail heads due to overgrowth and W-particles on the surface of dielectric due to selectivity loss. The overfilled nail heads and the selectivity loss can be completely removed with very low down-pressure (3 psi) in a very short polishing time (30 s). This indicates that the novel process is very promising for ULSI multilevel interconnection application. The removal rate selectivities of W to thermal oxide, PECVD-TEOS, and BPSG were found to be 47:1, 30:1 and 15:1, respectively, while the selectivities of W to the barrier metals of TiW, Ti and Ta were determined to be 0.6:1, 6:1 and 28:1, respectively. (C) 1997 Elsevier Science S.A.
  • Thumbnail Image
    Item type:Item,
    Chemical mechanical polishing for selective CVD-W
    Wang, MT
    ;
    Yeh, WK
    ;
    Tsai, MS
    ;
    Tseng, WT
    ;
    Chang, TC
    This work investigates chemical mechanical polishing (CMP) for W-filled contact holes, vias, and trenches by selective chemical vapor deposition. A novel process that combines the CMP technique with selective chemical vapor deposition of tungsten (CVD-W) was employed to remove nail heads due to overgrowth and W-particles on the surface of dielectric due to selectivity loss. The overfilled nail heads and the selectivity loss can be completely removed with very low down-pressure (3 psi) in a very short polishing time (30 s). This indicates that the novel process is very promising for ULSI multilevel interconnection application. The removal rate selectivities of W to thermal oxide, PECVD-TEOS, and BPSG were found to be 47:1, 30:1 and 15:1, respectively, while the selectivities of W to the barrier metals of TiW, Ti and Ta were determined to be 0.6:1, 6:1 and 28:1, respectively. (C) 1997 Elsevier Science S.A.
  • Thumbnail Image
    Item type:Item,
    Effects of isolation materials on facet formation for silicon selective epitaxial growth
    (1997-10-20)
    Tseng, HC
    ;
    Chang, CY
    ;
    Pan, FM
    ;
    Chen, JR
    ;
    Chen, LJ
    Effects of isolation materials on facet formation for low temperature Si selective epitaxial growth (SEG) using Si2H6 have been demonstrated by ultrahigh vacuum-chemical molecular epitaxy (UHV-CME) system. The activation energy of the Si epitaxial growth is 47.35 Kcal/mol. The isolation material includes silicon nitride, wet oxide, and tetraethylorthosilicate (TEOS) oxide. Different isolation materials have different faceting behaviors for the Si epilayer. A silicon nitride mask and a wet oxide mask result in a preferred faceting plane of (111) and (311), respectively. Using a TEOS oxide mask, we obtain a low temperature Si SEG layer without facet and twin formation, The preferred faceting plane orientation for different isolation materials is ascribed to the difference in the interface free energy between the Si layer and the isolation material. (C) 1997 American Institute of Physics.