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High-density MIM capacitors using Al2O3 and AlTiOx dielectrics
(2002-04-01)
Chen, SB
;
Lai, CH
;
Chin, A
;
Hsieh, JC
;
Liu, J
We have investigated the electrical characteristics of Al2O3 and AlTiOx MIM capacitors from IF (100 KHz) to RF (20 GHz) frequency range. Record high capacitance density of 0.5 and 1.0 muF/cm(2) are obtained for Al2O3 and AlTiOx MIM capacitors, respectively, and the fabrication process is compatible to existing VLSI backend integration. However, the AlTiOx MIM capacitor has very large capacitance reduction as increasing frequencies. In contrast, good device integrity has been obtained for Al2O3 MIM capacitor as evidenced from the small frequency dependence, low leakage current, good reliability, small temperature coefficient, and low loss tangent.
Frequency-dependent capacitance reduction in high-k AlTiOx and Al2O3 gate dielectrics from IF to RF frequency range
(2002-04-01)
Chen, SB
;
Lai, CH
;
Chan, KT
;
Chin, A
;
Hsieh, JC
We have characterized the capacitance and loss tangent for high-k Al2O3 and AlTiOx gate dielectrics from IF (100 KHz) to RF (20 GHz) frequency range. Nearly the same rate of capacitance reduction as SiO2 was demonstrated individually by the proposed Al2O3 and AlTiOx gate dielectrics as frequency was increased. Moreover, both dielectrics preserve the higher k better than SiO2 from 100 KHz to 20 GHz. These results suggest that both Al2O3 and AlTiOx are suitable for next generation MOSFET application into RF frequency regime.
RF noise in 0.18-mu m and 0.13-mu m MOSFETs
(2002-12-01)
Huang, CH
;
Lai, CH
;
Hsieh, JC
;
Liu, J
;
Chin, A
We have studied the gate finger number and gate ength dependence on minimum noise figure (NFmin) in deep submicrometer MOSFETs. A lowest NFmin. of 0.93 dB is measured in 0.18-mum MOSFET at 5.8 GHz as increasing finger number to 50 fingers, but increases abnormally when above 50. The scaling gate length to 0.13 mum shows larger NFmin than the 0.18-mum case at the same finger number. From the analysis of a well-calibrated device model, the abnormal finger number dependence is due to the combined effect of reducing gate resistance and increasing substrate loss as increasing finger number. The scaling to 0.13-mum MOSFET gives higher NFmin due to the higher gate resistance and a modified T-gate structure proposed to optimize the NFmin for further scaling down of the MOSFET.
High-density MIM canpacitors using AlTaOx dielectrics
(2003-05-01)
Yang, MY
;
Huang, CH
;
Chin, A
;
Zhu, CX
;
Li, MF
The authors have obtained good MIM capacitor integrity of high-capacitance density of 10 fF/mum(2) using high-k AlTaOx fabricated at 400degreesC. In addition, small voltage dependence of capacitance of < 600, ppm (quadratic voltage coefficient of only 130 ppm/V-2). is obtained at 1 GHz using their mathematical derivation from measured high-frequency S parameters. These good results ensure the high-k AlTaOx. MIM capacitor technology is useful for high-precision circuits operated at the RF frequency regime.
Very high density RF MIM capacitors (17 fF/mu m(2) using high-kappa Al2O3 doped Ta2O5 dielectrics
(2003-10-01)
Yang, MY
;
Huang, CH
;
Chin, A
;
Zhu, CX
;
Cho, BJ
Using high-kappa, Al2O3 doped Ta2O5 dielectric, we have obtained record high MINI capacitance density of 17 fF/mum(2) at 100 KHz, small 5% capacitance reduction to RF frequency range, and low leakage current density of 8.9 x 10(-7) A/cm(2). In combination of both high capacitor density and low leakage current density, a very low leakage current of 5.2 x 10(-12) A is calculated for a typical large 10 pF capacitor used in RF IC that is even smaller than that of a deep sub-mum MOSFET. This very high capacitance density with good MINI capacitor characteristics can significantly reduce the chip size of RF ICs.
Integrated antennas on Si with over 100 GHz performance, fabricated using an optimized proton implantation process
(2003-11-01)
Chan, KT
;
Chin, A
;
Lin, YD
;
Chang, CY
;
Zhu, CX
We have improved the performance of integrated antennas on Si for possible application in wireless communications and wireless interconnects. For practical VLSI integration, we have reduced the antenna size and optimized the proton implantation to a low energy of similar to 4 MeV with a depth of similar to 175 mum. To avoid any possible contamination, the ion implantation is applied after device fabrication. Excellent performance such as very low RF power loss up to 50 GHz, record high 103 GHz antenna resonance, and sharp 5 GHz bandwidth have been achieved.
High performance CPW and microstrip ring resonators on silicon substrates
(2004-09-20)
Chen, CC
;
Hung, BF
;
Chin, A
;
McAlister, SP
;
電子工程學系及電子研究所
High performance CPW and novel microstrip ring resonators at similar to30 GHz and 40 GHz have been fabricated on Si substrates, using an optimized proton-implantation process. Very good insertion loss and resonator characteristics, close to those from ideal electromagnetic simulations, were measured. In contrast, the ring resonators on VLSI-standard Si, without implantation, have worse transmission and reflection loss, thus prohibiting applications in RF circuits. (C) 2004 Wiley Periodicals, Inc.
Very high density RF MIM capacitor compatible with VLSI
(2005)
Chiang, KC
;
Lai, CH
;
Chin, A
;
Kao, HL
;
McAlister, SP
We have fabricated RF MIM capacitors, using high-kappa TiTAO as the dielectric, which show a record high density of 20 fF/mu m(2). In addition, the capacitors display a small capacitance reduction of only 3.6% over the 100 kHz to 20 GHz range, a low leakage current of 8 pA and a high Q of 120. This was for a typical large 8 pF TiTaO MINI capacitor. The small voltage dependence of the capacitance (Delta C/C) of 770 ppm at 2 GHz, shows that these MIM capacitors are useful for high-precision RF circuits.
AC power loss and signal coupling in very large scale integration backend interconnects
(2006-04-01)
Chen, CC
;
Kao, HL
;
Liao, CC
;
Chin, A
;
McAlister, SP
Both the coupling and AC power losses in integrated circuit interconnects in the radio-frequency regime have been measured. The AC power loss decreases with decreasing length, decreasing spacing, and increasing inter metal dielectric (IMD) thickness of parallel metal lines. The unwanted signal coupling and cross-talk monotonically decrease with increasing spacing and decreasing length of the parallel metal lines. However, increasing the IMD thickness from 0.7 to 6 mu m improves the low frequency performance but not the maximum operation frequency. Using a high-resistivity Si (HRS) substrate the AC power loss is significantly reduced but is traded off with an increase in coupling loss. The most effective method of reducing both the AC power and coupling losses is the combined use of three dimensional (3D) integration and an HRS, which gives larger than 1-2 orders of magnitude improvement, up to 20 GHz.

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