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Item type:Item, RFIC TaN/SrTio(3)/TaN MIM capacitors with 35 fF/mu m(2) capacitance density(2006-09-01) ;Huang, C. C. ;Chiang, K. C. ;Kao, H. L. ;Chin, AlbertChen, W. J.A very high density of 35 fF/mu m(2) is measured in a radio frequency (RF) metal-insulator-metal (MIM) capacitor using high-kappa (kappa = 169) SrTiO3 fabricated by very large scale integration (VLSI) back-end integration. A very small capacitance reduction of 4.1% from 100 kHz to 10 GHz, low leakage current of 1 X 10(-7) A/cm(2) at 1 V are simultaneously measured. The small voltage dependence of a capacitance Delta C/C of 637 ppm is also obtained at 2 GHz, which ensures this MIM capacitor useful for high precision circuits operated at a RF regime.Item type:Item, High-performance SrTiO3 MIM capacitors for analog applications(2006-09-01) ;Chiang, K. C. ;Huang, Ching-Chien ;Chen, G. L. ;Chen, Wen JauhKao, H. L.TAN/SrTiO3/TaN capacitors with a capacitance density of 28-35 fF/mu m(2) have been developed by using a high-kappa (kappa = 147-169) SrTiO3 dielectric containing nanometersized microcrystals (3-10 nm). A small capacitance effective thickness was achieved by reducing the interfacial TaON using N+ treatment on the lower TaN electrode during post-deposition annealing. The small (92 ppm/V-2) voltage coefficient of the capacitance and the 3 x 10(-8) A/cm(2) leakage current at 2 V exceed the International Technology Roadmap for Semiconductors' requirements for analog capacitors at year 2018.Item type:Item, High-temperature leakage improvement in metal-insulator-metal capacitors by work-function tuning(2007-03-01) ;Chiang, K. C. ;Cheng, C. H. ;Pan, H. C. ;Hsiao, N.Chou, C. P.Using low-cost and high work-function Ni, a low leakage current of 5 x 10(-6) A/cm(2) at 125 degrees C is obtained in a high 25-fF/mu m(2)-density SrTiO3 metal-insulator-metal (MIM) capacitor processed at 400 degrees C. This is approximately two orders of magnitude better than the same device using a TaN electrode, with added advantages of improved voltage and temperature coefficients of capacitance. This work-function tuning method also has merit for achieving both low thermal leakage and high overall k value beyond previous laminate structure.Item type:Item, A program-erasable high-k Hf0.3N0.2O0.5 MIS capacitor with good retention(2007-10-01) ;Yang, H. J. ;Chin, Albert ;Chen, W. J. ;Cheng, C. F.Huang, W. L.We describe a programmable-erasable MIS capacitor with a single high-kappa Hf0.3N0.2O0.5 dielectric layer. This device showed a capacitance density of similar to 6.6 fF/mu m(2), low program and erase voltages of +5 and -5 V, respectively, and a large Delta V-fb memory window of 1.5 V. In addition, the 25 degrees C data retention was good, as indicated by program and erase decay rates of only 2 and 6.2 mV/dec, respectively. Such device retention is attributed to the deep trapping level of 1.05 eV in the Hf0.3N0.2O0.5.