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收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

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Author: search.filters.author.Chu, David T.Subject: search.filters.subject.intermetallic compounds

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    Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
    (2016-01-01)
    Lin, Jie-An
    ;
    Lin, Chung-Kuang
    ;
    Liu, Chen-Min
    ;
    Huang, Yi-Sa
    ;
    Chen, Chih
    Electromigration tests of SnAg solder bump samples with 15 m bump height and Cu under-bump-metallization (UBM) were performed. The test conditions were 1.45 x 10(4) A/cm(2) at 185 degrees C and 1.20 x 10(4) A/cm(2) at 0 degrees C. A porous Cu3Sn intermetallic compound (IMC) structure was observed to form within the bumps after several hundred hours of current stressing. In direct comparison, annealing alone at 185 degrees C will take more than 1000 h for porous Cu3Sn to form, and it will not form at 170 degrees C even after 2000 h. Here we propose a mechanism to explain the formation of this porous structure assisted by electromigration. The results show that the SnAg bump with low bump height will become porous-type Cu3Sn when stressing with high current density and high temperature. Polarity effects on porous Cu3Sn formation is discussed.