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收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

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🏛️國立陽明交通大學機構典藏

Author: search.filters.author.Fan, Shib-KangSubject: search.filters.subject.digital microfluidics

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  • Thumbnail Image
    Item type:Item,
    Connecting interface for modularization of digital microfluidics
    (2008-01-01)
    Yang, Hanping
    ;
    Fan, Shib-Kang
    ;
    Hsu, Wensyang
    ;
    機械工程學系
    ;
    奈米科技中心
    Here, interconnection technique to link digital microfluidic chips is proposed. Three kinds of digital microfluidic modules with connecting interface, including flexible module and two types of connector modules, are designed and fabricated. Since these modules are fabricated on a compliant polymer-based substrate (ITO PET), chip-to-chip droplet transportation even at different planes can be achieved by the proposed technique. A low-temperature fabrication process is developed for the polymer substrates, where the SU-8 acts as the insulator. Droplet transportation through electrowetting on curved surface is confirmed by testing on the bended flexible modules with different curvatures from 0 to 0.06 mm(-1) at around 70 V-AC. Then the droplet transportations between flexible and connector modules are investigated. It is found that the gap size between two modules and the sidewall profiles at interface affect the droplet transportation directly. For the gap size around 50 mu m with a smooth perpendicular sidewall profile, 80 V-AC is shown to actuate droplet of 1.5 mu l, 2.5 mu l, or 3.5 mu l to cross over the interface successfully.
  • Thumbnail Image
    Item type:Item,
    Connecting interface for modularization of digital microfluidics - art. no. 68860L
    (2008)
    Yang, Hanping
    ;
    Fan, Shib-Kang
    ;
    Hsu, Wensyang
    ;
    機械工程學系
    ;
    Department of Mechanical Engineering
    Here, interconnection technique to link digital microfluidic chips is proposed. Three kinds of digital microfluidic modules with connecting interface, including flexible module and two types of connector modules, are designed and fabricated. Since these modules are fabricated on a compliant polymer-based substrate (ITO PET), chip-to-chip droplet transportation even at different planes can be achieved by the proposed technique. A low-temperature fabrication process is developed for the polymer substrates, where the SU-8 acts as the insulator. Droplet transportation through electrowetting on curved surface is confirmed by testing on the bended flexible modules with different curvatures from 0 to 0.06 mm(-1) at around 70 V-AC. Then the droplet transportations between flexible and connector modules are investigated. It is found that the gap size between two modules and the sidewall profiles at interface affect the droplet transportation directly. For the gap size around 50 mu m with a smooth perpendicular sidewall profile, 80 V-AC is shown to actuate droplet of 1.5 mu l, 2.5 mu l, or 3.5 mu l to cross over the interface successfully.