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Balanced Noise Design of Dual-Band 2.4/5-GHz pHEMT LNAs
(2020-01-01)
Meng, Chinchun
;
Chang, Wei-Ling
;
Hsiao, Yu-Chih
;
Li, Meng-Che
;
Chien, Hsin-Yi
This paper presents dual-band 2.4/5-GHz dual-band pHEMT LNAs based on a balanced noise design approach using 0.15 m pHEMT technology. A dual-band LNA has two input match frequencies without simultaneous noise match at these two frequencies especially when the extrinsic loss caused by the inductor is absent. Noise parameters as a function of frequencies for a dual-band FET LNA based on the balanced noise performance are developed. The fully integrated pHEMT LNA achieves power gain of 18 dB at 2.4 GHz and 12 dB at 5 GHz and noise figure about 3 dB at 2.4 GHz and 5 GHz, respectively, at 12.6 mA and 3 V. The pHEMT LNA with a bondwire inductor at input match demonstrates a distinct balanced noise performance.
Monolithic 3D SRAM-CIM Macro Fabricated with BEOL Gate-All-Around MOSFETs
(2019-01-01)
Hsueh, Fu-Kuo
;
Lee, Chun-Ying
;
Xue, Cheng-Xin
;
Shen, Chang-Hong
;
Shieh, Jia-Min
For the first time, below 400 degrees C-fabricated gate-all-around (GAA) transistor fabrication process was demonstrated with monolithic computing-in-memory (CIM) circuit. Key enablers are plasma-assisted atomic layer etching (PA-ALE), plasma immersion ion implantation (PIII) and far-infrared laser activation (FIR-LA). The 3D stackable single-grained Si GAA MOSFETs thus fabricated exhibit record-high I-on/I-off ratio (similar to 10(8)) with low I-off (pFETs<10(-2) nA/mu m). Moreover, the stackability of the GAA MOSFETs and the differential output of dual-mode 10T SRAM readout enable 2x throughput in the CIM circuitry.
Study of Charge Trapping Effects on AlGaN/GaN HEMTs Under UV Illumination With Pulsed I-V Measurement
(2020-06-01)
Nagarajan, Venkatesan
;
Chen, Kun-Ming
;
Chen, Bo-Yuan
;
Huang, Guo-Wei
;
Chuang, Chia-Wei
The charge trapping effects on AlGaN/GaN HEMTs under UV illumination are investigated using the pulsed current-voltage (I-V) measurement method. The test samples are unpassivated Schottky-gate HEMTs and metal-insulator-semiconductor HEMTs (MIS-HEMTs) with SiN gate dielectric. For HEMTs, the dominant charge trapping sources are the surface trap states, whereas, for MIS-HEMTs, they are trap states in the SiN gate dielectric and GaN buffer. When these devices are shined with the UV light, the drain current increases apparently in both samples owing to the generated photocurrent. By combining the UV illumination and pulsed I-V measurement, we find out the UV light has less effect on the surface charge trapping in the unpassivated HEMTs. Moreover, in MIS-HEMTs, we observe the charge trapping in the SiN gate dielectric becomes more serious under UV illumination, whereas the charge trapping in the GaN buffer is suppressed significantly. These findings are important for designing a GaN-based HEMT for photonic applications. In addition, the different responses of the surface-, buffer-, and gate-dielectric-related charge trapping to the UV light suggest that it would be easier to distinguish the trap types by introducing the UV illumination during the pulse measurement.
Low-Frequency Noise Characterization of AlGaN & x002F;GaN HEMTs and MIS-HEMTs Under UV Illumination
(2020-01-01)
Nagarajan, Venkatesan
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Chen, Kun-Ming
;
Lin, Hsin-Yi
;
Hu, Hsin-Hui
;
Huang, Guo-Wei
The low-frequency noise characteristics of AlGaN & x002F;GaN HEMTs and MIS-HEMTs are investigated in the dark condition and under UV illumination. The test devices with a 3-& x03BC;m-thick GaN buffer and a 25-nm-thick Al_0.22Ga_0.78N barrier layer were fabricated on the silicon wafer. For MIS-HEMTs, a 25-nm-thick SiN layer was deposited as a gate dielectric. The measured low-frequency noises show a 1 & x002F;f spectrum and can be described by the carrier number fluctuation model. Different noise responses to the UV light between HEMTs and MIS-HEMTs were observed. By comparing the noise data in dark and under UV illumination, the noise sources under the gate and in the ungated gate-drain access region have been identified. From these results, we can find a design guideline to improve the noise and reliability of GaN-based devices for optoelectronic applications.
V-band Sub-Harmonic Gate-Pumped Resistive Mixer With a 180 degrees Hybrid Using an In-Phase Power Divider Merging With an Out-Of-Phase Marchand Balun
(2019-01-01)
Chang, Wei Ling
;
Meng, Chinchun
;
Huang, Guo-Wei
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
A high isolation gate-pumped resistive sub-harmonic mixer with a miniature 180 degrees hybrid is demonstrated using 90 nm CMOS process. An in-phase power divider and an out-of-phase Marchand balun form a reduced-size 180 degrees hybrid with shared coupled lines. For a sub-harmonic mixer, the input matches at LO/RF ports of the 180 degrees hybrid are achieved using high/low coupling coefficients of the shared equal-length coupled lines. Moreover, isolations between RF and LO ports are achieved at all frequencies because a Marchand balun maintains balanced signals and a power divider provides in-phase equal magnitude signals at all frequencies. The sub-harmonic mixer achieves a conversion gain around 0-3 dB from 58-67 GHz with 0 dBm LO pumping power. The LO-to-RF isolation is better than 36 dB within the operating bandwidth.
pHEMT Single-Voltage-Supply Direct-Conversion Receiver With a 3-10 GHz LC Ladder LNA
(2019-01-01)
Hsiao, Yu-Chih
;
Meng, Chinchun
;
Wang, Chia-Ling
;
Huang, Guo-Wei
;
電子工程學系及電子研究所
A 3-10 GHz single-voltage-supply pHEMT direct-conversion receiver with a wideband LC-ladder inductively source-degenerated common-source low-noise amplifier is demonstrated in this paper. A wideband LR-CR LO generator is applied to the Gilbert mixers. The measurement results shows 13 similar to 15 dB conversion gain and 6-10 dB noise figure in the 3-10 GHz operating frequency range while the LO power is about 8 dBm and IF=300 MHz. The current consumption of the receiver is 70 mA at 3.3 V supply voltage.
DC and high-frequency characteristics of trigate polycrystalline-silicon thin-film transistors with different layout geometries
(2019-04-01)
Chen, Bo-Yuan
;
Chen, Kun-Ming
;
Shiao, Yu-Shao Jerry
;
Lin, Chuang-Ju
;
Huang, Guo-Wei
In this paper, we present the dc and high-frequency characteristics of trigate polycrystalline-silicon (poly-Si) thin-film transistors (TFTs) for RF applications. Trigate TFTs were fabricated using a 3D-IC process and designed with a multi-finger gate and multi-channel configuration. To obtain an optimal device design guideline, different source/drain (S/D) extension dimensions and channel layouts are investigated. We find that devices with a shorter or wider extension have higher cutoff frequencies (f(T)) and maximum oscillation frequencies (f(max)) owing to their lower S/D resistances. In addition, the high-frequency performance can be further improved by adopting the tapered channel structure, where the channel width increases gradually from the source to the drain. For the optimal device designs, the values of f(T) and f(max) are around 25 GHz and 30 GHz, respectively. The high f(T) and f(m)(ax) as well as excellent gate controllability in our devices indicate the trigate poly-Si TFT could be a suitable candidate for low-cost RFIC applications. (C) 2019 The Japan Society of Applied Physics
Temperature Insensitive PA Bias Circuit With Digital Control Interface Using InGaP/GaAs HBT Technology
(2015-01-01)
Chang, Wei-Ling
;
Meng, Chinchun
;
Wong, Shyh-Chyi
;
Chien, Hwey
;
Huang, Guo-Wei
This paper demonstrates a new temperature insensitive bias circuit using a Wilson current mirror for the InGaP/GaAs HBT power amplifier. The Wilson current mirror has a high impedance node for connecting an on/off digital interface and a stable voltage node for injection of feedback signals to achieve a temperature insensitive bias. The fabricated output stage of the power amplifier with the feedback through the Wilson current source shows a stable bias current with current variation from 186 mA to 182 mA for the temperature range from 25 degrees C to 200 degrees C. A bias circuit without the feedback through the Wilson current source is also fabricated for comparison and shows a strong bias current variation over temperature.
5-6 GHz 9.4 mW CMOS Direct-Conversion Passive-Mixer Receiver With Low-Flicker-Noise Corner
(2012-01-01)
Hsiao, Yu-Chih
;
Meng, Chinchun
;
Syu, Jin-Siang
;
Lin, Chung-Yo
;
Wong, Shyh-Chyi
This paper demonstrates a low-power and low-flicker-noise direct-conversion receiver using double-balanced passive mixer. The deep-n-well vertical-NPN bipolar junction transistor is placed as at the input stage of the IF amplifier to reduce the flicker noise in the 0.18 um standard CMOS process. As a result, conversion gain achieves 50-dB gain when the LO power is 10 dBm and the noise figure is 7-dB at 100 kHz. The totally power consumption is 9.4 mW at 1.8 V voltage supply.
2-GHz 1.35-dB NF pHEMT Single-Voltage-Supply Process-Independent Low-Noise Amplifier
(2018-01-01)
Syu, Jin-Siang
;
Meng, Chinchun
;
Yang, Chun
;
Huang, Guo-Wei
;
電子工程學系及電子研究所
A 2-GHz single-voltage-supply 0.15-mu m depletion-mode (D-mode) pseudomorphic high electron-mobility transistor (pHEMT) low-noise amplifier (LNA) is demonstrated with a proposed process-independent self-biasing scheme. The current-reused technique is also employed to achieve a common-source common-drain two-stage LNA under a dc current of 10.85 mA at a 3-V supply. As a result, the proposed LNA achieves 20-dB power gain and 1.35-dB noise figure (NF) at 2 GHz while the minimum NF=1.3 dB occurs at 2.4 GHz.

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