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🏛️國立陽明交通大學機構典藏

Author: search.filters.author.Kuo, Chien-NanSubject: search.filters.subject.bondwire

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    A Low-Cost Broadband Bondwire Interconnect for Heterogeneous System Integration
    (2013)
    Li, Chun-Hsing
    ;
    Ko, Chun-Lin
    ;
    Kuo, Chien-Nan
    ;
    Kuo, Ming-Ching
    ;
    Chang, Da-Chiang
    A low-cost broadband interconnect, composed of bondwires and transmission lines, is proposed for heterogeneous system integration. By designing the length and the characteristic impedance of the transmission lines, the bondwire effect can be reduced to provide an interconnect with good return loss and low insertion loss. In this work, the chip and the carrier are realized in 90-nm CMOS and GIPD process, respectively. Measured results show that the return loss and the insertion loss are better than 10 dB and 1.1 dB, respectively, from DC to 45.2 GHz.
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    Item type:Item,
    A High Q On-Chip Bondwire Transformer and Its Application to Low Power Receiver Front-End Design
    (2013)
    Li, Chun-Hsing
    ;
    Kuo, Chien-Nan
    ;
    Kuo, Ming-Ching
    ;
    電子工程學系及電子研究所
    ;
    Department of Electronics Engineering and Institute of Electronics
    This work presents a high Q on-chip bondwire transformer and its application to a low power receiver front-end design. The proposed bondwire transformer has the advantage of high quality factor, less sensitivity to the bonding height variation, and working as a balun to conduct single-to-differential conversion. Furthermore, the chip area under the bondwire transformer can be reused by the mixer and buffer circuits to reduce the cost. The receiver front-end is realized in 1P6M 0.18 mu m CMOS technology. The measured input return loss, the conversion gain, the noise figure, and the input third-order intercept point are 12.7 dB, 20.5 dB, 9.8 dB, and -4.0 dBm, respectively, at 2.1 GHz. The power consumption is only 1.1 mW from a 1 V supply.