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收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

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Author: search.filters.author.Kuo, Chien-NanSubject: search.filters.subject.broadband

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Now showing 1 - 4 of 4
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    A Low-Cost Broadband Bondwire Interconnect for THz Heterogeneous System Integration
    (2015)
    Li, Chun-Hsing
    ;
    Lai, Chih-Wei
    ;
    Yan, Tzu-Chao
    ;
    Kuo, Chien-Nan
    ;
    電機工程學系
    A low-cost broadband bondwire interconnect is proposed for THz heterogeneous system integration. A transversal path composed of two transmission lines and a bondwire is introduced to effectively reduce the bondwire effect of an original signal path consisted of a single bondwire only. Simulation results indicate that the return loss and insertion loss can be better than 15 dB and 2.3 dB from dc to 456 GHz, respectively. Measured interconnect loss is around 0 dB to 1.5 dB from 320 to 340 GHz.
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    Item type:Item,
    A Low-Cost DC-to-84-GHz Broadband Bondwire Interconnect for SoP Heterogeneous System Integration
    (2013-12-01)
    Li, Chun-Hsing
    ;
    Ko, Chun-Lin
    ;
    Kuo, Chien-Nan
    ;
    Kuo, Ming-Ching
    ;
    Chang, Da-Chiang
    A low-cost broadband bondwire interconnect is proposed for heterogeneous system integration. Transmission lines are incorporated with bondwires to form a two-path structure, which can effectively reduce the bondwire effect. Theoretical analysis is provided using a graphical method and it shows that the interconnect can give widest operation bandwidth from dc up to a maximum frequency f(max) if the length of the transmission lines is designed at an optimal electrical length theta(max) . In particular, theta(max) only depends on the characteristic impedance of the transmission lines. The achievable f(max) is limited by the bondwire inductance, i.e., smaller bondwire inductance is preferred to have wider operation bandwidth. An interconnect from a 0.18-mu m CMOS chip to a glass-integrated-passive-device carrier is designed to verify the proposed concept. Measured results show that the insertion loss and the return loss can be better than 3.0 and 13.4 dB, respectively, from dc to 84 GHz. The proposed interconnect shows around 3.2 times bandwidth of a single bondwire alone. To the best of authors' knowledge, this work demonstrates the bondwire interconnect with the widest operation bandwidth for heterogeneous system integration by using system-on-package reported thus far.
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    3 similar to 11-GHz CMOS UWB LNA using dual feedback for broadband matching
    (2006-01-01)
    Fu, Chang-Tsung
    ;
    Kuo, Chien-Nan
    ;
    電子工程學系及電子研究所
    ;
    Department of Electronics Engineering and Institute of Electronics
    A 1.5V, 3 similar to 11GRz CMOS UWB LNA using dual feedback loops is reported. Using shunt capacitive feedback and series transformer feedback the broadband matching condition is achieved with high flat gain. Fabricated in 0.18um CMOS process, the measurement result demonstrates power gain of 11dB and maximum NF less than 5.6dB throughout the frequency range from 3.1 to 10.6 GHz with power consumption of 10.6mW.
  • Thumbnail Image
    Item type:Item,
    3 similar to 11-GHz CMOS UWB LNA using dual feedback for broadband matching
    (2006)
    Fu, Chang-Tsung
    ;
    Kuo, Chien-Nan
    ;
    電子工程學系及電子研究所
    ;
    Department of Electronics Engineering and Institute of Electronics
    A 1.5V, 3 similar to 11GHz CMOS UWB LNA using dual feedback loops is reported. Using shunt capacitive feedback and series transformer feedback the broadband matching condition is achieved with high flat gain. Fabricated in 0.18um CMOS process, the measurement result demonstrates power gain of 11dB and maximum NF less than 5.6 dB throughout the frequency range from 3.1 to 10.6 GHz with power consumption of 10.6 mW.