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Author: search.filters.author.Li, MF

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Now showing 1 - 10 of 35
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    A high-density MIM capacitor (13 fF/mu m(2)) using ALD HfO2 dielectrics
    (2003-02-01)
    Yu, XF
    ;
    Zhu, CX
    ;
    Hu, H
    ;
    Chin, A
    ;
    Li, MF
    Metal-insulator-metal (MIM) capacitors with a different thickness of HfO2 have been investigated. The results show that both the capacitance density and voltage coefficients of capacitance (VCCs) increase with decreasing the HfO2 thickness. In addition, it is also found that the VCCs decrease logarithmically with increasing the thickness Of HfO2. Furthermore, the MIM capacitor with 10-nm HfO2 shows a record high capacitance density of 13 fF/mum(2) and a VCC of 607 ppm/V, which can meet the requirement of the International Technology Roadmap for Semiconductors. It can also provide a low leakage current of 5.95 x 10-(8)A/cm(2) at room temperature at I V, low tangent values below 0.05, and a small frequency dependence as well. All these indicate that it is very suitable for use in silicon integrated circuit applications.
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    Fully silicided NiSi gate on La2O3 MOSFETs
    (2003-05-01)
    Lin, CY
    ;
    Ma, MW
    ;
    Chin, A
    ;
    Yeo, YC
    ;
    Zhu, CX
    We have fabricated the fully silicided NiSi on La2O3 for n- and p-MOSFETs. For 900 degreesC fully silicided CoSi2 on La2O3 gate dielectric with 1.5 mn EOT, the, gate dielectric has large leakage current by possible excess Co diffusion at high silicidation temperature. In sharp contrast, very low gat e leakage current density of 2 x 10(-4) A/cm(2) at 1 V is measured for 400 degreesC formed fully silicided NiSi and comparable with Al gate. The extracted work function of NiSi was 4.42 eV, and the corresponding threshold voltages are 0.12 and -0.70 V for respective n- and p-MOSFETs. Electron and hole mobilities of 156 and 44 cm(2)/V-s are obtained for respective n- and p-MOSFETs, which are comparable with the HfO2 MOSFETs without using H-2 annealing.
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    High-density MIM canpacitors using AlTaOx dielectrics
    (2003-05-01)
    Yang, MY
    ;
    Huang, CH
    ;
    Chin, A
    ;
    Zhu, CX
    ;
    Li, MF
    The authors have obtained good MIM capacitor integrity of high-capacitance density of 10 fF/mum(2) using high-k AlTaOx fabricated at 400degreesC. In addition, small voltage dependence of capacitance of < 600, ppm (quadratic voltage coefficient of only 130 ppm/V-2). is obtained at 1 GHz using their mathematical derivation from measured high-frequency S parameters. These good results ensure the high-k AlTaOx. MIM capacitor technology is useful for high-precision circuits operated at the RF frequency regime.
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    PVD HfO2 for high-precision MIM capacitor applications
    (2003-06-01)
    Kim, SJ
    ;
    Cho, BJ
    ;
    Li, MF
    ;
    Yu, XF
    ;
    Zhu, CX
    Metal-insulator-metal (MIM) capacitors are fabricated using sputtered HfO2 with Ta and TaN for top and bottom electrodes, respectively. High-capacitance densities from 4.7 to 8.1 fF/mum(2) have been achieved while maintaining the leakage current densities around 1 x 10(-8) A/cm(2) within the normal circuit bias conditions. A guideline for the insulator thickness and its dielectric constant has been obtained by analyzing the tradeoff between the linearity coefficient and the capacitance density.
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    Lanthanide (Tb)-doped HfO2 for high-density MIM capacitors
    (2003-07-01)
    Kim, SJ
    ;
    Cho, BJ
    ;
    Li, MF
    ;
    Zhu, CX
    ;
    Chin, A
    A high-density metal-insulator-metal (MIM) capacitor with a lanthanide-doped HfO2 dielectric prepared by physical vapor deposition (PVD) is presented for the first time. A significant improvement was shown in both the voltage coefficient of capacitance (VCC) and the leakage current density of MIM capacitor, yet the high capacitance density of HfO2 dielectrics was maintained by achieving the doping of Tb with an optimum concentration in HfO2. This technique allows utilizing thinner dielectric film in MIM capacitors and achieving a capacitance density as high as 13.3 fF/mum(2) with leakage current and VCC values that fully meet requirements from year 2005 for radio frequency (RF) bypass capacitors applications.
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    High-performance microwave coplanar bandpass and bandstop filters on Si substrates
    (2003-09-01)
    Chan, KT
    ;
    Chin, A
    ;
    Li, MF
    ;
    Kwong, DL
    ;
    McAlister, SP
    High-performance bandpass and bandstop microwave coplanar filters, which operate from 22 to 91 GHz, have been fabricated on Si substrates. This was achieved using an optimized proton implantation process that converts the standard low-resistivity (similar to10 Omega (.) cm) Si to a semi-insulating state. The bandpass filters consist of coupled lines to form a series resonator, while the bandstop filter was designed in a double-folded short-end stub structure. For the bandpass filters at 40 and 91 GHz, low insertion loss was measured, close to electromagnetic simulation values. We also fabricated excellent bandstop filters with very low transmission loss of similar to1 dB and deep band rejection at both 22 and 50 GHz. The good filter performance was confirmed by the higher substrate impedance to ground, which was extracted from the well-matched S-parameter equivalent-circuit data.
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    Very high density RF MIM capacitors (17 fF/mu m(2) using high-kappa Al2O3 doped Ta2O5 dielectrics
    (2003-10-01)
    Yang, MY
    ;
    Huang, CH
    ;
    Chin, A
    ;
    Zhu, CX
    ;
    Cho, BJ
    Using high-kappa, Al2O3 doped Ta2O5 dielectric, we have obtained record high MINI capacitance density of 17 fF/mum(2) at 100 KHz, small 5% capacitance reduction to RF frequency range, and low leakage current density of 8.9 x 10(-7) A/cm(2). In combination of both high capacitor density and low leakage current density, a very low leakage current of 5.2 x 10(-12) A is calculated for a typical large 10 pF capacitor used in RF IC that is even smaller than that of a deep sub-mum MOSFET. This very high capacitance density with good MINI capacitor characteristics can significantly reduce the chip size of RF ICs.
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    Integrated antennas on Si with over 100 GHz performance, fabricated using an optimized proton implantation process
    (2003-11-01)
    Chan, KT
    ;
    Chin, A
    ;
    Lin, YD
    ;
    Chang, CY
    ;
    Zhu, CX
    We have improved the performance of integrated antennas on Si for possible application in wireless communications and wireless interconnects. For practical VLSI integration, we have reduced the antenna size and optimized the proton implantation to a low energy of similar to 4 MeV with a depth of similar to 175 mum. To avoid any possible contamination, the ion implantation is applied after device fabrication. Excellent performance such as very low RF power loss up to 50 GHz, record high 103 GHz antenna resonance, and sharp 5 GHz bandwidth have been achieved.
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    Fully silicided NiSi and germanided NiGe dual gates on SiO2 n- and p-MOSFETs
    (2003-12-01)
    Yu, DS
    ;
    Wu, CH
    ;
    Huang, CH
    ;
    Chin, A
    ;
    Chen, WJ
    We have fabricated the fully silicided NiSi and germanided NiGe dual gates n- and p-MOSFETs on 1.9 nm thick SiO2 gate dielectric. The extracted work functions of fully NiSi and NiGe gates from thickness-dependent flat band voltage were 4.55 and 5.2 eV respectively, which may provide possible wide work function tuning using NiSi1-xGex. In additional to the lower gate current than Al gate n- and p-MOSFETs, the fully silicided NiSi and germanided NiGe gates MOSFETs show electron and hole mobilities close to universal mobility values with special advantage of process compatible to current VLSI fabrication line.
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    High-performance MIM capacitor using ALD high-k HfO2-Al2O3 laminate dielectrics
    (2003-12-01)
    Ding, SJ
    ;
    Hu, H
    ;
    Lim, HF
    ;
    Kim, SJ
    ;
    Yu, XF
    For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO2-Al2O3 laminate dielectric' using atomic im layer deposition (ALD) technique. Our data indicates that the laminate NUM capacitor can provide high capacitance density of 12.8 fF/ mum(2) from 10 kHz up to 20 GHz, very low leakage current of 3.2 x 10(-8) A/cm(2) at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic. one of 1830 PPM/V-2, temperature coefficient of capacitance of 182 ppm/degreesC, and high breakdown field of similar to6 MV/cm as well as promising reliability. As a result, the HfO2-Al2O3 laminate is a very promising candidate for next generation MINI capacitor for radio frequency and mixed signal integrated circuit applications.