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Effect of thermal treatment on resistive switching characteristics in Pt/Ti/Al2O3/Pt devices
(2008-12-25)
Lin, Chih-Yang
;
Lee, Dai-Ying
;
Wang, Sheng-Yi
;
Lin, Chun-Chieh
;
Tseng, Tseung-Yuen
Resistive switching characteristics of Pt/Ti/Al2O3/Pt memory devices annealed at various temperatures including 400 degrees C, 500 degrees C and 600 degrees C for 1 h under ambient condition were investigated in the study. The Al2O3 thin films annealed at up to 600 degrees C for 1 h remain amorphous phase based on the X-ray diffraction (XRD) analyses. As increasing annealing temperature, the forming voltage (activating the pristine device) of the memory device decreases in contrast to the rising trend of the turn-on voltage (switching from high to low resistance state). However, the turn-off voltage (switching from low to high resistance state) is almost uninfluenced by thermal annealing. These phenomena might be attributed to the interdiffusion between Ti and Al2O3, based on the analyzed results of secondary ion mass spectroscopy (SIMS) and high resolution transmission electron microscope (HR-TEM). Moreover, the thermal annealing process eventually creates high conducting paths with a high density of oxygen vacancies between the two electrodes. (c) 2008 Elsevier B.V. All rights reserved.
Reproducible resistive switching behavior in sputtered CeO2 polycrystalline films
(2008-12-25)
Lin, Chih-Yang
;
Lee, Dai-Ying
;
Wang, Sheng-Yi
;
Lin, Chun-Chieh
;
Tseng, Tseung-Yuen
Sputter-deposited CeO2 film in the metal-insulator-metal structure exhibits repeatable resistive switching behavior under voltage sweep. Based on the X-ray diffraction patterns and the cross-sectional scanning electron microscope image, the CeO2 film is polycrystalline with columnar grains perpendicular to the bottom electrode. Moreover, due to the symmetric device structure of Pt/CeO2/Pt, the resistive switching behavior is independent of bias polarity so that both positive and negative voltages can switch the device from high conducting state (ON-state) into low conducting state (OFF-state) and then back to ON-state, which is named non-polar resistive switching. The resistance ratio between two memory states is about five orders of magnitude, which is stable over 10(4) S at 0.3 V stress. in addition, the resistance ratio decreases with increasing the current compliance during forming process. The stability of ON-state, OFF-state, and as-deposited film state (the state before performing forming process) against temperature is also investigated in this study, showing that the OFF-state is less stable. (C) 2008 Elsevier B.V. All rights reserved.
Improved resistive switching properties of Ti/ZrO2/Pt memory devices for RRAM application
(2011-07-01)
Wang, Sheng-Yu
;
Tsai, Chen-Han
;
Lee, Dai-Ying
;
Lin, Chih-Yang
;
Lin, Chun-Chieh
In this study, we have investigated the effect of current compliance during forming process on resistive switching (RS) characteristics of the Ti/ZrO2/Pt device. The higher the current compliance is, the larger RS operation voltage is needed. The Ti/ZrO2/Pt device with high device yield can be operated over 10,000 RS cycles by sweeping dc voltage. and the on and off two memory states exhibit good stability under 0.3 V stress voltage. Moreover, the data retention of both memory states is over 10(5) s. As applying +6-V 10-ns and -3-V 10-ns voltage pulses on the device, there are operation errors observed during continuous write-read-erase-read cycles until increasing the pulse width to 50 ns. Nondestructive readout tests are also performed on the Ti/ZrO2/Pt device before and after 10(3) pulse cycles without any obvious degradation observed. Compared with reported ZrO2-based memory devices, our Ti/ZrO2/Pt device exhibits better RS properties and has a high potential for memory application. (C) 2011 Elsevier B.V. All rights reserved.
Peroxide induced volatile and non-volatile switching behavior in ZnO-based electrochemical metallization memory cell
(2017-09-20)
Simanjuntak, Firman Mangasa
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Chandrasekaran, Sridhar
;
Pattanayak, Bhaskar
;
Lin, Chun-Chieh
;
Tseng, Tseung-Yuen
We explore the use of cubic-zinc peroxide (ZnO2) as a switching material for electrochemical metallization memory (ECM) cell. The ZnO2 was synthesized with a simple peroxide surface treatment. Devices made without surface treatment exhibits a high leakage current due to the self-doped nature of the hexagonal-ZnO material. Thus, its switching behavior can only be observed when a very high current compliance is employed. The synthetic ZnO2 layer provides a sufficient resistivity to the Cu/ZnO2/ZnO/ITO devices. The high resistivity of ZnO2 encourages the formation of a conducting bridge to activate the switching behavior at a lower operation current. Volatile and non-volatile switching behaviors with sufficient endurance and an adequate memory window are observed in the surface-treated devices. The room temperature retention of more than 10(4) s confirms the non-volatility behavior of the devices. In addition, our proposed device structure is able to work at a lower operation current among other reported ZnO-based ECM cells.
Role of nanorods insertion layer in ZnO-based electrochemical metallization memory cell
(2017-12-01)
Simanjuntak, Firman Mangasa
;
Singh, Pragya
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Chandrasekaran, Sridhar
;
Lumbantoruan, Franky Juanda
;
Yang, Chih-Chieh
An engineering nanorod array in a ZnO-based electrochemical metallization device for nonvolatile memory applications was investigated. A hydrothermally synthesized nanorod layer was inserted into a Cu/ZnO/ITO device structure. Another device was fabricated without nanorods for comparison, and this device demonstrated a diode-like behavior with no switching behavior at a low current compliance (CC). The switching became clear only when the CC was increased to 75 mA. The insertion of a nanorods layer induced switching characteristics at a low operation current and improve the endurance and retention performances. The morphology of the nanorods may control the switching characteristics. A forming-free electrochemical metallization memory device having long switching cycles (> 10(4) cycles) with a sufficient memory window (10(3) times) for data storage application, good switching stability and sufficient retention was successfully fabricated by adjusting the morphology and defect concentration of the inserted nanorod layer. The nanorod layer not only contributed to inducing resistive switching characteristics but also acted as both a switching layer and a cation diffusion control layer.
Nonpolar Bistable Resistive Switching Behaviors of Bismuth Titanate Oxide Thin Film
(2009)
Lin, Meng-Han
;
Wu, Ming-Chi
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Lin, Chun-Chieh
;
Tseng, Tseung-Yuen
;
電子工程學系及電子研究所
Nonpolar bistable resistive switching behaviors of sol-gel derived bismuth titanate oxide (BTO) thin film are investigated in this study. The BTO thin film memory device without thermal treatment shows higher resistance ratio (similar to 10(4)) than the other annealed devices. The resistive switching behavior of the Pt/BTO/LNO/Pt device is reproducible and can be traced over 100 times. Both low resistance state (ON-state) and high resistance state (OFF-state) are stable over 10(4) s under 0.3 V voltage stress at room temperature (RT) and 85 degrees C. The retention behaviors of both memory states in the Pt/BTO/LNO/Pt device are very stable over 2 x 10(6) s at RT and 85 degrees C, showing that the BTO thin film memory device is a good candidate for nonvolatile memory application

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