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Variations of V-t Retention Loss in a SONOS Flash Memory Due to a Current-Path Percolation Effect
(2011-04-01)
Chou, Y. L.
;
Chung, Y. T.
;
Wang, Tahui
;
Ku, S. H.
;
Zou, N. K.
Discrete nitride program charge loss in a small-area SONOS Flash memory cell during retention is observed. Our measurement shows that a retention V-t of a programmed SONOS cell exhibits a stepwise evolution with retention time. Individual single-program charge-loss-induced threshold voltage shifts (Delta V-t) are characterized. We find the following: 1) The magnitude of Delta V-t exhibits an exponential distribution, which is believed due to a current-path percolation effect caused by random program charges and substrate dopants, and 2) program-state V-t retention loss has large variations in different cells and P/E cycles due to the percolation effect. We develop a Monte Carlo analysis to take into account the distribution of Delta V-t and a tunneling front model to study the spread of a retention V-t distribution in a SONOS Flash memory.
Electric Field Induced Nitride Trapped Charge Lateral Migration in a SONOS Flash Memory
(2017-01)
Liu, Yu-Heng
;
Jiang, Cheng-Min
;
Chen, Wei-Chun
;
Wang, Tahui
;
Tsai, Wen-Jer
We investigated electric field-induced trapped electron lateralmigration in a SONOS flash cell. The threshold voltage shift (Delta V-t) andgate-induceddrain leakage(GIDL) current were measured to monitor nitride electron movement in retention. We applied different voltages to the gate and the source/drain in retention to vary the vertical and lateral electric fields. Our study shows that: 1) GIDL current can be used tomonitor trapped charge lateralmigration and 2) nitride charge lateral migration exhibits strong dependence on the lateral electric field. Based on measured temperature and field dependence, a nitride trapped charge emission process via thermally assisted tunneling is proposed for electron lateral migration. The emission rates of thermally assisted tunneling, direct trap-to-band tunneling and Frenkel-Poole emission were compared.
Electric Field Induced Nitride Trapped Charge Lateral Migration in a SONOS Flash Memory
(2017-01)
Liu, Yu-Heng
;
Jiang, Cheng-Min
;
Chen, Wei-Chun
;
Wang, Tahui
;
Tsai, Wen-Jer
We investigated electric field-induced trapped electron lateralmigration in a SONOS flash cell. The threshold voltage shift (Delta V-t) andgate-induceddrain leakage(GIDL) current were measured to monitor nitride electron movement in retention. We applied different voltages to the gate and the source/drain in retention to vary the vertical and lateral electric fields. Our study shows that: 1) GIDL current can be used tomonitor trapped charge lateralmigration and 2) nitride charge lateral migration exhibits strong dependence on the lateral electric field. Based on measured temperature and field dependence, a nitride trapped charge emission process via thermally assisted tunneling is proposed for electron lateral migration. The emission rates of thermally assisted tunneling, direct trap-to-band tunneling and Frenkel-Poole emission were compared.
STUDY OF GATE-INJECTION OPERATED SONOS-TYPE DEVICES USING THE GATE-SENSING AND CHANNEL-SENSING (GSCS) METHOD
(2009)
Du, Pei-Ying
;
Lue, Hang-Ting
;
Wang, Szu-Yu
;
Huang, Tiao-Yuan
;
Hsieh, Kuang-Yeu
SONOS devices using gate injection programming and erasing have better cycling endurance because the gate oxide is not stressed by PIE operations. This work studies the gate injection behavior in detail using the recently developed gate-sensing and channel-sensing (GSCS) technique. GSCS accurately locates the charge centroid during programming/erasing and reliability tests. For the first time, we can track the charge centroid for gate-injection "top BE-SONOS" and various SONOS-type devices. Our results indicate that the charge centroid after electron gate injection is close to the nitride center, irrespective of various nitride thickness and top dielectric. Moreover, there is electron and hole vertical mismatch after hole gate injection. Comparing the results from SONS, we can clearly prove that electrons are mainly distributed inside the bulk nitride instead of the interfaces between oxide and nitride. For SNOS and SNS, where there is electron and hole injection simultaneously, two-region approximation can give us more detailed information about electron and hole capture. By comparing experimental data with theoretical modeling, we have shown that nitride 7nm or thicker captures all the injected electrons up to total charge area density similar to 10(13)cm(-2).
Impact of V-pass Interference on Charge-Trapping NAND Flash Memory Devices
(2015-06-01)
Hsiao, Yi-Hsuan
;
Lue, Hang-Ting
;
Chen, Wei-Chen
;
Chang, Kuo-Pin
;
Tsui, Bing-Yue
The impact of adjacent word-line\'s pass gate voltage interference on charge-trapping (CT) NAND Flash is extensively studied in this paper. From our previous work with a 38-nm half-pitch BE-SONOS NAND Flash device, we found that the threshold voltage significantly decreases with increasing pass gate voltage during reading. This observation is in contrary to the common belief that the CT NAND devices are immune to interference. In this paper, we further evaluate the pass gate voltage interference on 3-D CT NAND Flash, which is the most promising path for the future NAND Flash industry. Owing to the superior gate control ability in the double-gate architecture, the commonly observed pass gate voltage interference due to pitch scaling is suppressed. Stronger gate control ability also restrains the impact of field penetration in devices with narrow channel width. In 3-D CT NAND Flash, the thinner channel can also provide better gate control ability, which, in turn, results in smaller pass gate voltage interference.
A study of gate-sensing and channel-sensing (GSCS) transient analysis method - Part II: Study of the intra-nitride behaviors and reliability of SONOS-type devices
(2008-08-01)
Du, Pei-Ying
;
Lue, Hang-Ting
;
Wang, Szu-Yu
;
Huang, Tiao-Yuan
;
Hsieh, Kuang-Yeu
For the first time, we can directly investigate the charge transport and intra-nitride behaviors of SONOS-type devices by exploiting the gate-sensing and channel-sensing (GSCS) method. Our results clearly indicate that for electron injection (+FN program), the electron centroid migrates from the bottom toward the nitride center, whereas for hole injection (-FN erase), holes first recombine with the bottom electrons and then gradually move upward. For the electron de-trapping processes under -V(G) stressing, the trapped electrons de-trap first from the bottom portion of nitride. We also develop a method to distinguish the electron de-trapping and hole injection erasing methods by comparing the erasing current density (J) versus the bottom oxide electric field (E). At short-term high-temperature baking, the electrons move from the top portion toward the bottom portion, and this intra-nitride transport becomes more significant for a thicker nitride. On the other hand, after long-term baking, the charge loss mainly comes from the bottom portion of nitride.
A Novel Hot-Electron Programming Method in a Buried Diffusion Bit-Line SONOS Memory by Utilizing Nonequilibrium Charge Transport
(2009-02-01)
Wang, Tahui
;
Tang, Chun-Jung
;
Li, C. -W.
;
Lee, Chih Hsiung
;
Ou, T. -F
We propose a new hot-electron programming method with a low drain-to-source voltage in a buried-diffusion (BD) bit-line SONOS memory array. In this method, channel electrons are preaccelerated in a cell preceding a program cell. For a small bit-line width, some energetic electrons will traverse an n(+) BD region and enter a program cell with residual energy due to nonequilibrium transport. Our measurement result shows that this residual energy can significantly enhance hot-electron programming efficiency even at a V(ds) of 2.5 V. The concept of this method is verified by means of a Monte Carlo analysis. Our study shows that this method is more effective as a bit-line width reduces.
Pulse-IV Characterization of Charge-Transient Behavior of SONOS-Type Devices With or Without a Thin Tunnel Oxide
(2009-04-01)
Du, Pei-Ying
;
Lue, Hang-Ting
;
Wang, Szu-Yu
;
Huang, Tiaci-Yuan
;
Hsieh, Kuang-Yeu
The transient behavior of SONOS-type devices was investigated for the first time using pulse-IV technique. Three kinds of SONOS devices are studied: SONS (without top oxide), SONoS (with a thin top oxide), and SoNOS (with a thin bottom oxide). Devices with or without a thin tunnel oxide were able to provide very fast charge injection/detrapping, but their charge-transient behavior cannot be accurately monitored by conventional DC-IV method. By using specific pulse-IV setup for memory, we can measure the drain current response immediately after programming and erasing, as well as the fast charge relaxation under various reliability tests. The program and erase transient behavior shows that all devices are easily programmed and erased within 1 mu s at low gate voltages (< 6 V). Moreover, SONS shows the fastest program and erase speeds because of the absence of tunnel oxide, and silicon nitride has very low barrier height that offers fast injection. We have also examined the charge relaxation under various field and temperature conditions and found that the charge loss mainly came from external charge injection during retention, not from detrapping through thermionic emission.
Program Trapped-Charge Effect on Random Telegraph-Noise Amplitude in a Planar SONOS Flash Memory Cell
(2009-11-01)
Ma, H. C.
;
Chou, Y. L.
;
Chiu, J. P.
;
Wang, Tahui
;
Ku, S. H.
Program-charge effects in a SONOS Flash cell on the amplitude of random telegraph noise (RTN) are investigated. We measure RTN in 45 planar SONOS cells and 40 floating-gate (FG) cells in erase state and program state, respectively. We find that a SONOS cell has a wide spread in RTN amplitudes after programming, while an FG cell has identical RTN amplitudes in erase and program states at the same read-current level. A 3-D atomistic simulation is performed to calculate RTN amplitudes. Our result shows that the wide spread of program-state RTN amplitudes in a SONOS cell is attributed to a current-path-percolation effect caused by random discrete nitride charges.

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