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Item type:Item, Significant Improvement of GaN Crystal Quality with Ex-situ Sputtered AlN Nucleation Layers(2016-01-01) ;Chen, Shuo-Wei ;Yang, Young ;Wen, Wei-Chih ;Li, HengLu, Tien-ChangEx-situ sputtered AlN nucleation layer has been demonstrated effective to significantly improve crystal quality and electrical properties of GaN epitaxy layers for GaN based Light-emitting diodes (LEDs). In this report, we have successfully reduced X-ray (102) FWHM from 240 to 110 arcsec, and (002) FWHM from 230 to 101 arcsec. In addition, reverse-bias voltage (Vr) increased around 20% with the sputtered AlN nucleation layer. Furthermore, output power of LEDs grown on sputtered AlN nucleation layer can be improved around 4.0% compared with LEDs which is with conventional GaN nucleation layer on pattern sapphire substrate (PSS).Item type:Item, High-Efficiency InGaN/GaN Core-Shell Nanorod Light-Emitting Diodes With Low-Peak Blueshift and Efficiency Droop(2017-03) ;Tzou, An-Jye ;Hsieh, Dan-Hua ;Hong, Kuo-Bin ;Lin, Da-WeiHuang, Jhih-KaiIn this study, novel three-dimensional (3-D) nanoscale structures and methodology are demonstrated for application in high-efficiency core-shell nanorod (NR) light-emitting diodes (LEDs). The key to our successful growth of the structures is the introduction of passivation, which can be used to selectively grow active layers in desired structures. Through the fabrication methodology, core-shell NR green LEDs exhibiting large nonpolar active region and homogeneous indium distributions without a point tip shape were achieved. Stable light emission at a central wavelength of 518 nm was achieved as the injected current increased to more than 40 mA. The improved NR LEDs exhibited a stable luminescence emission wavelength (blueshift of 62 nm) and low-efficiency droop (18.1%) at 200 mA. Our scheme is scalable and compatible with current technologies, which provides a new perspective for developing high-performance, 3-D nanoscale optoelectronic devices.Item type:Item, High light-extraction GaN-based vertical LEDs with double diffuse surfaces(2006-11-01) ;Lee, Ya-Ju ;Kuo, Hao-Chung ;Lu, Tien-Chang ;Wang, Shing-Chung光電工程學系High light-extraction (external quantum efficiency similar to 40%) 465-nm GaN-based vertical light-emitting diodes (LEDs) employing double diffuse surfaces were fabricated. This novel LED structure includes one top transmitted diffuse surface and another diffuse omnidirectional reflector (ODR) on the bottom of a LED chip. The diffusive ODR consists of a roughened p-type GaN layer, an indium-tin-oxide (ITO) low refractive index layer, and an Al layer. The surface of the p-type GaN-layer was naturally roughened while decreasing the growth temperature to 800 degrees C. After flip-bonding onto a Si substrate by AuSn eutectic metal and laser lift-off processes to remove the sapphire substrate, an anisotropic etching by dilute potassium hydroxide (KOH) was employed on the N-face n-GaN layer to obtain transmitted diffuse surfaces with hexagonal-cone morphology. The double diffused surfaces LEDs show an enhancement of 56% and 236% in light output power compared to single side diffused surface and conventional LEDs, respectively. The devices also show a low leakage current in the order of magnitude of 10(-8) A at -5 V and a calculated external quantum efficiency of about 40%. The high scattering efficiency of. double diffused surfaces could be responsible for the enhancement in the device light output power.Item type:Item, High brightness GaN-based light-emitting diodes(2007-06-01) ;Lee, Ya-Ju ;Lu, Tien-Chang ;Kuo, Hao-Chung ;Wang, Shing-Chung光電工程學系This paper reviews our recent progress of GaN-based high brightness light-emitting diodes (LEDs). Firstly, by adopting chemical wet etching patterned sapphire substrates in GaN-based LEDs, not only could increase the extraction quantum efficiency, but also improve the internal quantum efficiency. Secondly, we present a high light-extraction 465-nm GaN-based vertical light-emitting diode structure with double diffuse surfaces. The external quantum efficiency was demonstrated to be about 40%. The high performance LED was achieved mainly due to the strong guided-light scattering efficiency while employing double diffuse surfaces.Item type:Item, Study of GaN-based light-emitting diodes grown on chemical wet-etching-patterned sapphire substrate with V-shaped pits roughening surfaces(2008-05-01) ;Lee, Ya-Ju ;Kuo, Hao-Chung ;Lu, Tien-Chang ;Wang, Shing-ChungNg, Kar WaiWe investigate the mechanism responding for performance enhancement of gallium nitride (GaN)-based light-emitting diode (LED) grown on chemical wet-etching-patterned sapphire substrate (CWE-PSS) with V-Shaped pit features on the top surface. According to temperature-dependent photoluminescence (PL) measurement and the measured external quantum efficiency, the structure can simultaneously enhance both internal quantum efficiency and light extraction efficiency. Comparing to devices grown on planar sapphire substrate, the threading dislocation defects of LED grown on CWE-PSS are reduced from 1.28 x10(9)/cm(2) to 3.62 x10(8)/cm(2), leading to a 12.5% enhancement in internal quantum efficiency. In terms of the theoretical computing of radiation patterns, the V-Shaped pits roughening surface can be thought of as a strong diffuser with paraboloidal autocorrelation function, increasing the escape probability of trapped photons and achieving a 20% enhancement in light extraction efficiency. Moreover, according to the measurement of optical diffraction power, CWE-PSS demonstrated superior guided light extraction efficiency than that of planar sapphire substrate, thus an extra 7.8% enhancement in light extraction efficiency was obtained. Therefore, comparing to the conventional LED, an overall 45% enhancement in integrated output power was achieved.Item type:Item, Nano-processing techniques applied in GaN-Based light-emitting devices with self-assembly Ni nano-masks(2008-05-01) ;Chiu, Ching-Hua ;Lo, Ming-Hua ;Lu, Tien-Chang ;Yu, PeichenHuang, H. W.We have developed a simple method to fabricate nanoscale masks by using self-assembly Ni clusters formed through a rapid thermal annealing (RTA) process. The density and dimensions of the Ni nano-masks could be precisely controlled. The nano-masks were successfully applied to GaN-based light-emitting diodes (LEDs) with nano-roughened surface, GaN nanorods, and GaN-based nanorod LEDs to enhance light output power or change structure properties. The GaN-based LED with nano-roughened surface by Ni nano-masks and excimer laser etching has increased 55% light output at 20 mA when compared to that without the nano-roughened process. The GaN nanorods fabricated by the Ni nano-masks and ICP-RIE dry etching showed 3.5 times over the as-grown sample in photoluminescence (PL) intensity. The GaN-based nanorod LEDs assisted by photo-enhanced chemical (PEC) wet oxidation process were also demonstrated. The electroluminescence (EL) intensity of the GaN-based nanorod LED with PEC was about 1.76 times that of the as-grown LED. The fabrication, structure properties, physical features, and the optical and electrical properties of the fabricated devices will be discussed.Item type:Item, Study of InGaN-GaN Light-Emitting Diodes With Different Last Barrier Thicknesses(2010-06-15) ;Chen, Jun-Rong ;Lu, Tien-Chang ;Kuo, Hao-Chung ;Fang, K. L.Huang, K. F.This work reports a theoretical and experimental study on the device performance of blue InGaN-GaN light-emitting diodes (LEDs) with different last barrier thicknesses. The experimental results show that the employment of a 25-nm-thick p-type GaN last barrier in GaN LEDs can improve the light output power from 35.6 to 40.2 mW at 50 mA. By using advanced device simulation, it is shown that the effective energy barrier created by the p-type AlGaN electron blocking layer (EBL) is significantly decreased due to the band bending at the interface between GaN last barrier and AlGaN EBL. The use of a p-type GaN last barrier before the growth of AlGaN EBL can provide a higher energy barrier to suppress the electron overflow and then enhance the light output power.