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Evaluation of Monolithic 3-D Logic Circuits and 6T SRAMs With InGaAs-n/Ge-p Ultra-Thin-Body MOSFETs
(2016-03-01)
Yu, Kuan-Chin
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
This paper evaluates monolithic 3-D logic circuits and 6T SRAMs composed of InGaAs-n/Ge-p ultra-thin-body MOSFETs while considering interlayer coupling through TCAD mixed-mode model. This paper indicates that monolithic 3-D InGaAs/Ge logic circuits provide equal leakage and better delay performance compared with planar 2-D structure through optimized 3-D layout. The monolithic 3-D InGaAs/Ge 6T SRAMs can simultaneously improve the cell stability and performance through optimized 3-D layout. We suggest two 3-D SRAM layout designs for high performance and low power applications, respectively. Moreover, with optimized 3-D layout designs, InGaAs/Ge logic circuits exhibit larger delay improvement, and the 6T SRAMs exhibit larger read access time and time-to-write improvement compared with Si counterparts.
Impact of Random Variations on Cell Stability and Write-Ability of Low-Voltage SRAMs Using Monolayer and Bilayer Transition Metal Dichalcogenide (TMD) MOSFETs
(2016-07)
Yu, Chang-Hung
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This letter evaluates and analyzes the impacts of random variations on cell stability and write-ability of low-voltage SRAMs using monolayer and bilayer transition metal dichalcogenide (TMD) devices based on ITRS 2028 (5.9 nm) node with the aid of atomistic TCAD mixed-mode simulations. Our study indicates that, for 6T SRAM, the monolayer/bilayer TMD devices may fail to provide the 6 sigma yield requirement for read static noise margin (RSNM) due to severe metal-gate work function variation in spite of their excellent electrostatics, and hence circuit techniques, such as bootstrapped dynamic power rails or the standard 8T cell, are needed. Besides, R-SD as a major concern of TMDs should be less of an issue for near-/sub-threshold SRAMs for ultra low-power applications. For the standard 8T cell structure, the RSNMs of both monolayer and bilayer 8T SRAMs improve significantly, and the bilayer 8T SRAM exhibits better write static noise margin (WSNM). In addition, write-assist techniques (including negative bit-line, boosted word-line, and lower cell supply) for improving WSNM are examined and shown to be more effective for monolayer 8T SRAMs than the bilayer counterparts.
Impacts of NBTI and PBTI on Ultra-Thin-Body GeOI 6T SRAM Cells
(2015)
Hu, Vita Pi-Ho
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
This paper investigates the impacts of Negative and Positive Bias Temperature Instabilities (NBTI and PBTI) on the stability and performance of Ultra-Thin-Body (UTB) GeOI 6T SRAM cells compared with the SOI counterparts. Worst case stress scenarios for Read and Write operations are analyzed. For UTB GeOI SRAM cells, PBTI dominates the degradations in RSNM, HSNM, cell Read access time, and Time-to-Write, while for UTB SOI SRAM cells, NBTI dominates the degradations in RSNM, HSNM, and Time-to-Write. WSNM only slightly degrades due to NBTI/PBTI. Threshold voltage design and Word-Line Under-Drive (WLUD) Read-Assist techniques are analyzed to compensate the stability degradation due to NBTI/PBTI for UTB GeOI SRAM cells. Compared with the nominal UTB GeOI SRAM cells with low Vth design, UTB GeOI SRAM cells with high Vth design suffer less NBTI/PBTI degradations and exhibit significant improvement in RSNM and HSNM, and comparable performance compared with the nominal UTB SOI SRAM cells.
Evaluation of Read-and Write-Assist Circuits for GeOI FinFET 6T SRAM Cells
(2014-01-01)
Hu, Vita Pi-Ho
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電機工程學系
This paper evaluates the impacts of Read- and Write-Assist circuits on the GeOI FinFET 6T SRAM cells compared with the SOI counterparts. The Word-Line Under-Drive (WLUD) Read-Assist is more efficient to improve the Read Static Noise Margin (RSNM) and Read VMIN of FNSP GeOI FinFET SRAM cells compared with the SOI counterparts. GeOI FinFET SRAM cells with WLUD show smaller cell Read accesstime compared with the SOI FinFET SRAM cells at both 25 degrees C and 125 degrees C. Negative Bit-Line (NBL) Write-Assist is more efficient to improve the Write Static Noise Margin (WSNM) than VCS (cell supply) lowering for both GeOI and SOI FinFET SRAM cells. NBL Write-Assist shows larger WSNM improvement for GeOI FinFET SRAM cells than the SOI counterparts at 125 degrees C.
Analysis of GeOI FinFET 6T SRAM Cells With Variation-Tolerant WLUD Read-Assist and TVC Write-Assist
(2015-06-01)
Hu, Vita Pi-Ho
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
This paper analyzes the impacts of read-assist and write-assist circuits on GeOI FinFET 6T SRAM cells considering intrinsic random variations, process corner, and temperature variation. The word-line under-drive (WLUD) read-assist is more efficient to improve the read static noise margin and read V-MIN of fast-N slow-P corner GeOI FinFET SRAM cells compared with the Silicon-On-Insulator (SOI) counterparts. GeOI FinFET SRAM cells with WLUD show less cell read access-time degradation compared with the SOI counterparts at both 25 degrees C and 125 degrees C. With transient voltage collapse (TVC) write-assist, the write-ability and variation tolerance of GeOI and SOI FinFET SRAM cells are improved. The temperature dependence of data retention time is different between the GeOI and SOI FinFET SRAM cells. The maximum TVC write-assist pulsewidth constrained by the data retention failure is smaller in GeOI FinFET SRAMs at 25 degrees C and becomes comparable at 125 degrees C compared with the SOI FinFET SRAMs.
Device Design and Analysis of Logic Circuits and SRAMs for Germanium FinFETs on SOI and Bulk Substrates
(2013)
Hu, Vita Pi-Ho
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
A comparative analysis of Germanium-on-Insulator FinFET (GeOl FinFET) and Germanium on bulk substrate FinFET (Ge bulk FinFET) at device and circuit level with respect to Si counterparts is presented. GeOI FinFET shows larger leakage current than Ge bulk FinFET due to the parasitic bipolar effect triggered by the band-to-band tunneling (BTBT) leakage. The effectiveness of different dual-Vt technology options including increasing channel doping, increasing gate length and drain-side underlap for leakage reduction is analyzed for GeOl and Ge bulk FinFET circuits and SRAMs. An optimum asymmetrie underlap design in SRAM using asymmetrie underlap pull-up and access transistors (PUAX-asym) is proposed. GeOl and Ge bulk FinFETs with asymmetrie underlap design show significant improvement in leakage-delay performance and stability in logic circuits and SRAM cells.
Threshold Voltage Design and Performance Assessment of Hetero-Channel SRAM Cells
(2013-01-01)
Hu, Vita Pi-Ho
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
;
電子工程學系及電子研究所
Optimized threshold voltage (Vt) design to enhance the variation immunity of high-performance (super-threshold) and low-voltage (near-/sub-threshold) 6 T SRAM cells is presented. For low-voltage SRAM cells operating at low Vdd, low-Vt design shows smaller variability, while the design tradeoff between performance and leakage should be considered. For high-performance SRAM cells operating at high Vdd, ultra-thin-body SOI SRAM cells with high-Vt design show smaller variability while sacrificing performance compared with the low-Vt design. Our study indicates that hetero-channel SRAM cells enable high-Vt design and exhibit improved Read/Write stability and performance, and maintain comparable RSNM variations for the high-performance SRAM applications.
Design and Analysis of Robust Tunneling FET SRAM
(2013-03-01)
Chen, Yin-Nien
;
Fan, Ming-Long
;
Hu, Vita Pi-Ho
;
Su, Pin
;
Chuang, Ching-Te
With a steep subthreshold slope, tunneling FETs (TFETs) are promising candidates for ultralow-voltage operation compared with conventional MOSFETs. However, the delayed saturation characteristic and the broad soft transition region result in a large crossover region/current in an inverter, thus degrading the hold/read static noise margin (H/RSNM) of TFET SRAM cells. The write-ability and write static noise margin (WSNM) of TFET SRAM cells are constrained by the unidirectional conduction characteristics and large crossover contention of the write access transistor and the holding transistor. In this paper, we present a detailed analysis of TFET circuit switching/output characteristics/performance and the underlying physics. The stability/performance of several TFET SRAM cells are then analyzed/compared using atomistic technology computer-aided design mixed-mode simulations. Finally, a robust 7T driverless (DL) TFET SRAM cell is proposed. The proposed 7T DL TFET SRAM cell, with better output characteristics in single-gate mode, and decoupled read current path from cell storage node and push-pull write action with asymmetrical raised-cell-virtual-ground write-assist, provides a significant improvement in hold, read, and write stability and performance.
Variation Tolerant CLSAs for Nanoscale Bulk-CMOS and FinFET SRAM
(2012)
Tsai, Ming-Fu
;
Tsai, Jen-Huan
;
Fan, Ming-Long
;
Su, Pin
;
Chuang, Ching-Te
In this paper, we propose three Current-Latch-based Sense Amplifiers (CLSA) configurations for nanoscale Bulk-CMOS SRAM and several CLSAs using FinFET devices with independently-controlled-gate. Extensive simulations suggest the proposed structures are robust against random offset errors. The proposed CLSA structures feature significant offset suppression capabilities with sigma(offset) reduction up to 74% (76%) in 40nm Bulk-CMOS (25nm FinFET-SOI) technology compared with the conventional CLSA. Meanwhile, up to 27% (52%) shorter sensing delay, 71% (77%) shorter Time-To-Sense and 73% (76%) lower bit-line power consumption are achieved in 40nm Bulk-CMOS (25nm FinFET-SOI). Finally, the proposed CLSA structures significantly enhance the sensing yield and affordable number of cells per bit-line, thus improving the array efficiency hence overall area and performance/power as well.
A Comprehensive Comparative Analysis of FinFET and Trigate Device, SRAM and Logic Circuits
(2012)
Pao, Chia-Hao
;
Fan, Ming-Long
;
Tsai, Ming-Fu
;
Chen, Yin-Nien
;
Hu, Vita Pi-Ho
We present a comprehensive comparative analysis of FinFET and Trigate device characteristics, 6T SRAM stability and logic circuits. The impact of intrinsic random device variations, including fin Line Edge Roughness (LER), Work Function Variation (WFV) and fin width scaling on FinFET and Trigate device Subthreshold Slope (S. S.), V-T, 6T SRAM Read Static Noise Margin (RSNM) and Write Static Noise Margin (WSNM) are investigated and compared by using 3D atomistic TCAD simulation. The results indicate that Trigate device shows slightly better variability control under the same electrical width and fin width (10nm and 7nm) considering fin LER and WFV. Next, we investigate the impact of single charged trap induced Random Telegraph Noise (RTN) on FinFET and Trigate device characteristics, 6T SRAM and logic circuits. The top-gate and the lower fin height of Trigate device under the same electrical width and fin width cause the current density to concentrate close to the bottom of the fin, resulting in stronger dependence on the location of the trap, larger RTN Delta I-D/I-D amplitude and larger Delta V-T with a trap placed at the worst position under fin LER and WFV. The impact of RTN trapping/detrapping on 6T SRAM RSNM, the leakage-delay of inverter, Two-Way NAND and 2-To-1 Multiplexer (MUX) are examined. With degreasing supply voltage, the RTN degradation of Trigate SRAM RSNM and logic circuits become larger compared with the FinFET counterparts.

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