學術出版;;Publications

Permanent URI for this communityhdl:11536/1

收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

Browse

🏛️國立陽明交通大學機構典藏

Search Results

Now showing 1 - 10 of 17

Effects of isolation oxides on undercut formation and electrical characteristics for silicon selective epitaxial growth
(1997-06-01)
Tseng, HC
;
Chang, CY
;
Pan, FM
;
Chen, LP
;
電子工程學系及電子研究所
Three isolation oxide structures have been prepared to study their resistance to the undercut formation during selective epitaxial growth (SEG) processes. The N2O annealed oxide tetraethyoxysilane (TEOS) oxide stacked structure has the best resistance to the undercut formation and exhibits the best electrical characteristics compared to the other two isolation oxide structures prepared in the study, which are a wet oxide and a TEOS oxide. This is ascribed to a smaller interfacial stress between the isolation oxide and the silicon substrate for the stacked structure. The sidewall damage is the predominant factor deteriorating the current-voltage (I-V) characteristics of the N+-P SEG diodes. When treated with a quick HF dip and followed by a low temperature desorption cleaning before the SEG process, the N+-P SEG diode, which has no perceivable undercut, shows satisfactory I-V characteristics.
Low-temperature and low thermal budget fabrication of polycrystalline silicon thin-film transistors
(1996-11-01)
Lin, HY
;
Chang, CY
;
Lei, TF
;
Liu, FM
;
Yang, WL
A top-gate self-aligned n-channel polycrystalline silicon (poly-Si) thin-film transistor (TFT) has been fabricated with low temperature (less than or equal to 550 degrees C) and low thermal budget process. The ultrahigh vacuum chemical vapor deposition (UHV/CVD) grown poly-Si was served as the channel film, the chemical mechanical polishing (CMP) technique was used to polish the channel surface, plasma-enhanced chemical vapor deposited (PECVD) tetraethylorthosilicate (TEOS) oxide was used as the gate dielectric, and NH3 plasma was used to passive the device. In this process, the solid phase crystallization (SPC) step Is not needed. A field effect mobility of 46 cm(2)/V-s, ON/OFF current ratio of over 10(7), and threshold voltage of 0.8 V are obtained. The significant reduction in process temperature and thermal budget make this process advantageous for larger-area-display peripheral driver circuits on glass substrate.
Study of nickel silicide contact on Si/Si1-xGex
(2003-09-01)
Yang, TH
;
Luo, GL
;
Chang, EY
;
Yang, TY
;
Tseng, HC
The properties of nickel silicide formed by depositing nickel on Si/P+ - Si1-xGex layer are compared with that of nickel germanosilicide on P+ - Si1-xGex layer formed by depositing Ni directly on P+ - Si1-xGex layer without silicon consuming layer. After thermal annealing, nickel silicide on Si/P+ S Si1-xGex layer shows lower sheet resistance and specific contact resistivity than that of nickel germanosilicide on P+ - Si1-xGex layer. In addition, small junction leakage current is also observed for nickel silicide on Si/P+ - Si1-xGex/N - Si diode. In summary, witha Si consuming layer on top of the Si1-xGex, the nickel silicide contact formed demonstrated improved electrical and materials characteristics as compared with the nickel germanosilicide contact which was formed directly on Si1-xGex layer.
Hot-carrier effects on power characteristics of SiGeHBTs
(2004-06-01)
Huang, SY
;
Chen, KM
;
Huang, GW
;
Tseng, HC
;
Hsu, TL
This letter investigates hot-carrier (HQ effects on the power characteristics of Si-SiGe HBTs using load-pull measurements. We found that the output power, power gain, and linearity of Si-SiGe HBTs are degraded after HC stress. Under constant base-current measurement, the HC-induced power performance degradation is found to be much worse than that under constant collector-current measurement. The HC effects on the cutoff frequency, nonlinearity terms of base-current and collector-current, and third-order intermodulation (IM3) cancellation effect have been analyzed to explain the experimental observations.
Hot-carrier induced degradations on RF power characteristics of SiGe heterojunction bipolar transistors
(2004)
Huang, SY
;
Chen, KM
;
Huang, GW
;
Hsu, TL
;
Tseng, HC
Hot-carrier (HC) effects on high-frequency and RF power characteristics of Si/SiGe HBTs were investigated in this paper. We found that the small-signal current gain, output power, and power gain of Si/SiGe HBTs are suffered by the HC stress. With different bias conditions, the degradations of cutoff frequency and output power were found to be worse under constant base-current measurement than that under constant collector-current measurement. These phenomena have been explained by the change of the current gain, transconductance, and base-emitter resistance under stress.
Impact of hot carrier stress on RF power characteristics of MOSFETs
(2005)
Huang, SY
;
Chen, KM
;
Huang, GW
;
Yang, DY
;
Chang, CY
This paper investigates hot-carrier (HQ effects on the RF power and linearity characteristics of MOS transistors using load-pull measurement. We found that the RF power characteristics are affected by the HC stress, and the linearity of MOS transistors is clearly degraded after HC stress at constant gate voltage measurement. However, at high gate voltage bias, the HC-induced power degradation is much reduced compared with that under low gate voltage regimes. In addition, HC effects on linearity can be softened by biasing the transistor at constant drain currents. These experimental observations can be explained by the change of threshold voltage, transconductance, subthreshold swing, and mobility degradation coefficient under HC stress.
RF MOSFET characterization by four-port measurement
(2005-05-01)
Wu, SD
;
Huang, GW
;
Chen, KM
;
Tseng, HC
;
Hsu, TL
RF MOSFET's are usually measured in common source configuration by a 2-port network analyzer, and the common gate and commen drain S-parameters cannot be directly measured from a conventional 2-port test structure. In this work, a 4-port test structure for on-wafer measurement of RF MOSFET's is proposed. Four-port measurements for RF MOSFET's in different dimensions and the de-embedded procedures are performed up to 20 GHz. The S-parameters of the RF MOSFET in common source (CS), common gate (CG), and common drain (CD) configurations are obtained from a single DUT and one measurement procedure. The dependence of common source S-parameters of the device on substrate bias are also shown.
Extraction of substrate parameters for RF MOSFETs based on four-port measurement
(2005-06-01)
Wu, SD
;
Huang, GW
;
Chen, KM
;
Chang, CY
;
Tseng, HC
In this work, a new method for extracting substrate parameters of radio frequency (RF) metal oxide semiconductor field effect transistors (MOSFETs) based on four-port measurement is presented. A T-liked substrate resistance network is used and the values of all components in the cold MOSFETs were extracted directly from the four-port data between 250 MHz and 8.5 GHz. The output admittance Y-22 can be well modeled up to 26.5 GHZ based on the extracted substrate resistances and the other extrinsic capacitances extracted from an active device.
Hot-carrier induced degradations on RF power characteristics of SiGe heterojunction bipolar transistors
(2005-06-01)
Huang, SY
;
Chen, KM
;
Huang, GW
;
Liang, V
;
Tseng, HC
Hot-carrier (HC) effects on high-frequency and RF power characteristics of Si/SiGe HBTs are investigated in this paper. By using the two-tone load-pull measurement, we find that not only the cutoff frequency, but also the output power performances of Si/SiGe HBTs are suffered by the HC stress. In this work, S-parameters and intrinsic elements of an equivalent hybrid-pi model were used to validate the HC effects on high-frequency characteristics. With different bias conditions, the degradations of cutoff frequency, power gain, and linearity are found to be worse under constant base-current measurement than that under constant collector-current measurement. The HC-induced degradations on the current gain, transconductance, and ideality-factor of base and collector currents are analyzed to explain the experimental observations.
Linearity and power characteristics of SiGeHBTs at high temperatures for RF applications
(2005-07-01)
Chen, KM
;
Peng, AS
;
Huang, GW
;
Chen, HY
;
Huang, SY
In this paper, the power gain, power-added efficiency (PAE) and linearity of power SiGe heterojunction-bipolar transistors at various temperatures have been presented. The power characteristics were measured using a two-tone load-pull system. For transistors biased with fixed base voltage, the small-signal power gain and PAE of the devices increase with increasing temperature at low base voltages, while they decrease at high base voltages. Besides, the linearity is improved at high temperature for all voltage biases. However, for devices with fixed collector current, the small-signal power gain, PAE, and linearity are nearly unchanged with temperature. The temperature dependence of power and linearity characteristics can be understood by analyzing the cutoff frequency, the collector current, Kirk effect and nonlinearities of transconductance at different temperatures.

學術出版;;Publications

Browse

Filters

Settings

Sort By

Results per page

🏛️國立陽明交通大學機構典藏

Search Results