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Status and Prospects of ZnO-Based Resistive Switching Memory Devices
(2016-08-19)
Simanjuntak, Firman Mangasa
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Panda, Debashis
;
Wei, Kung-Hwa
;
Tseng, Tseung-Yuen
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材料科學與工程學系
In the advancement of the semiconductor device technology, ZnO could be a prospective alternative than the other metal oxides for its versatility and huge applications in different aspects. In this review, a thorough overview on ZnO for the application of resistive switching memory (RRAM) devices has been conducted. Various efforts that have been made to investigate and modulate the switching characteristics of ZnO-based switching memory devices are discussed. The use of ZnO layer in different structure, the different types of filament formation, and the different types of switching including complementary switching are reported. By considering the huge interest of transparent devices, this review gives the concrete overview of the present status and prospects of transparent RRAM devices based on ZnO. ZnO-based RRAM can be used for flexible memory devices, which is also covered here. Another challenge in ZnO-based RRAM is that the realization of ultra-thin and low power devices. Nevertheless, ZnO not only offers decent memory properties but also has a unique potential to be used as multifunctional nonvolatile memory devices. The impact of electrode materials, metal doping, stack structures, transparency, and flexibility on resistive switching properties and switching parameters of ZnO-based resistive switching memory devices are briefly compared. This review also covers the different nanostructured-based emerging resistive switching memory devices for low power scalable devices. It may give a valuable insight on developing ZnO-based RRAM and also should encourage researchers to overcome the challenges.
Effect of thermal treatment on resistive switching characteristics in Pt/Ti/Al2O3/Pt devices
(2008-12-25)
Lin, Chih-Yang
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Lee, Dai-Ying
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Wang, Sheng-Yi
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Lin, Chun-Chieh
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Tseng, Tseung-Yuen
Resistive switching characteristics of Pt/Ti/Al2O3/Pt memory devices annealed at various temperatures including 400 degrees C, 500 degrees C and 600 degrees C for 1 h under ambient condition were investigated in the study. The Al2O3 thin films annealed at up to 600 degrees C for 1 h remain amorphous phase based on the X-ray diffraction (XRD) analyses. As increasing annealing temperature, the forming voltage (activating the pristine device) of the memory device decreases in contrast to the rising trend of the turn-on voltage (switching from high to low resistance state). However, the turn-off voltage (switching from low to high resistance state) is almost uninfluenced by thermal annealing. These phenomena might be attributed to the interdiffusion between Ti and Al2O3, based on the analyzed results of secondary ion mass spectroscopy (SIMS) and high resolution transmission electron microscope (HR-TEM). Moreover, the thermal annealing process eventually creates high conducting paths with a high density of oxygen vacancies between the two electrodes. (c) 2008 Elsevier B.V. All rights reserved.
Reproducible resistive switching behavior in sputtered CeO2 polycrystalline films
(2008-12-25)
Lin, Chih-Yang
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Lee, Dai-Ying
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Wang, Sheng-Yi
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Lin, Chun-Chieh
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Tseng, Tseung-Yuen
Sputter-deposited CeO2 film in the metal-insulator-metal structure exhibits repeatable resistive switching behavior under voltage sweep. Based on the X-ray diffraction patterns and the cross-sectional scanning electron microscope image, the CeO2 film is polycrystalline with columnar grains perpendicular to the bottom electrode. Moreover, due to the symmetric device structure of Pt/CeO2/Pt, the resistive switching behavior is independent of bias polarity so that both positive and negative voltages can switch the device from high conducting state (ON-state) into low conducting state (OFF-state) and then back to ON-state, which is named non-polar resistive switching. The resistance ratio between two memory states is about five orders of magnitude, which is stable over 10(4) S at 0.3 V stress. in addition, the resistance ratio decreases with increasing the current compliance during forming process. The stability of ON-state, OFF-state, and as-deposited film state (the state before performing forming process) against temperature is also investigated in this study, showing that the OFF-state is less stable. (C) 2008 Elsevier B.V. All rights reserved.
Switching Failure Mechanism in Zinc Peroxide-Based Programmable Metallization Cell
(2018-10-19)
Simanjuntak, Firman Mangasa
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Chandrasekaran, Sridhar
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Lin, Chun-Chieh
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Tseng, Tseung-Yuen
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電子工程學系及電子研究所
The impact of peroxide surface treatment on the resistive switching characteristics of zinc peroxide (ZnO2)-based programmable metallization cell (PMC) devices is investigated. The peroxide treatment results in a ZnO hexagonal to ZnO2 cubic phase transformation; however, an excessive treatment results in crystalline decomposition. The chemically synthesized ZnO2 promotes the occurrence of switching behavior in Cu/ZnO2/ZnO/ITO with much lower operation current as compared to the Cu/ZnO/ITO (control device). However, the switching stability degrades as performing the peroxide treatment for a longer time. We suggest that the microstructure of the ZnO2 is responsible for this degradation behavior and fine tuning on ZnO2 properties, which is necessary to achieve proper switching characteristics in ZnO2-based PMC devices.
Improved resistive switching properties of Ti/ZrO2/Pt memory devices for RRAM application
(2011-07-01)
Wang, Sheng-Yu
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Tsai, Chen-Han
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Lee, Dai-Ying
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Lin, Chih-Yang
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Lin, Chun-Chieh
In this study, we have investigated the effect of current compliance during forming process on resistive switching (RS) characteristics of the Ti/ZrO2/Pt device. The higher the current compliance is, the larger RS operation voltage is needed. The Ti/ZrO2/Pt device with high device yield can be operated over 10,000 RS cycles by sweeping dc voltage. and the on and off two memory states exhibit good stability under 0.3 V stress voltage. Moreover, the data retention of both memory states is over 10(5) s. As applying +6-V 10-ns and -3-V 10-ns voltage pulses on the device, there are operation errors observed during continuous write-read-erase-read cycles until increasing the pulse width to 50 ns. Nondestructive readout tests are also performed on the Ti/ZrO2/Pt device before and after 10(3) pulse cycles without any obvious degradation observed. Compared with reported ZrO2-based memory devices, our Ti/ZrO2/Pt device exhibits better RS properties and has a high potential for memory application. (C) 2011 Elsevier B.V. All rights reserved.
Resistive switching behavior of Ga doped ZnO-nanorods film conductive bridge random access memory
(2018-08-30)
Singh, Pragya
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Simanjuntak, Firman Mangasa
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Kumar, Amit
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Tseng, Tseung-Yuen
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電子工程學系及電子研究所
The influence of Ga dopant on resistive switching behavior of ZnO-nanorods film conducting bridge random access memory was investigated. Using a hydrothermal process, we grew vertically well-aligned and uniform Ga doped ZnO (GZO)-NRs films on transparent glass substrates to fabricate Cu/TiW/GZO-NRs/Indium Tin Oxide/Glass devices. The GZO-NRs film provides a diffusion path for the Cu ions to form a conducting bridge; thus, reducing the formation of a branched filament. The Ga dopant induces a significant improvement in switching distribution of high resistance states (HRS) and low resistance states (LRS). The 1.5 mol% Ga doped device exhibits good retention up to 10(4) s and high HRS/LRS ratio of 30 times. Therefore, our proposed device structure may be a good candidate for future conductive-bridge resistive random access memory application.
Forming-free bipolar resistive switching in nonstoichiometric ceria films
(2014-01-27)
Ismail, Muhammad
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Huang, Chun-Yang
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Panda, Debashis
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Hung, Chung-Jung
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Tsai, Tsung-Ling
The mechanism of forming-free bipolar resistive switching in a Zr/CeO (x) /Pt device was investigated. High-resolution transmission electron microscopy and energy-dispersive spectroscopy analysis indicated the formation of a ZrO (y) layer at the Zr/CeO (x) interface. X-ray diffraction studies of CeO (x) films revealed that they consist of nano-polycrystals embedded in a disordered lattice. The observed resistive switching was suggested to be linked with the formation and rupture of conductive filaments constituted by oxygen vacancies in the CeO (x) film and in the nonstoichiometric ZrO (y) interfacial layer. X-ray photoelectron spectroscopy study confirmed the presence of oxygen vacancies in both of the said regions. In the low-resistance ON state, the electrical conduction was found to be of ohmic nature, while the high-resistance OFF state was governed by trap-controlled space charge-limited mechanism. The stable resistive switching behavior and long retention times with an acceptable resistance ratio enable the device for its application in future nonvolatile resistive random access memory (RRAM).
Resistive switching behavior of sol-gel deposited TiO2 thin films under different heating ambience
(2013-09-01)
Lai, Chun-Hung
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Chen, Chia-Hung
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Tseng, Tseung-Yuen
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
We prepared anatase TiO2 films by sol-gel method under three thermal firing conditions to investigate the bipolar resistive switching (BRS) and unipolar resistive switching CURS) in Ag/TiO2/Pt structure. The devices are URS in an air atmosphere at 760 Torr, while those in an oxygen ambience at 1 Torr show BRS accompanying with forming-free and self-compliance. By examining the X-ray photoelectron spectroscopy (XPS) spectrum, different non-lattice oxygen content is observed. High concentration of oxygen vacancy is expected under oxygen-deficient treatment, and that would determine the electrode/oxide interface property and induce switching mode of polarity dependent or not. An improved performance of operation voltage dispersion down to 0.5 V and endurance up to 3000 cycles is obtained for those in reducing Ar. (C) 2012 Elsevier B.V. All rights reserved.

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