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Grain Boundary Trap-Induced Current Transient in a 3-D NAND Flash Cell String
(2019-04-01)
Lin, Wei-Liang
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Tsai, Wen-Jer
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Cheng, C. C.
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Ku, S. H.
;
Liu, Lenvis
Transient cell current caused by the trapping/detrapping of grain boundary traps in the polycrystalline silicon (poly-Si) channel of a 3-D NAND cell string is comprehensively studied in this paper. This transient has a time constant of 10 mu s or longer and is strongly dependent on the bias history. It is also affected by the trap distribution as revealed by TCAD simulations. Sensing offset between program verify and read results in "pseudo" charge loss/gain that reduces the sensing margin. The posttreatment of the poly-Si channel is suggested to mitigate this effect.
Nitric Acid Oxidized ZrO2 as the Tunneling Oxide of Cobalt Silicide Nanocrystal Memory Devices
(2011-09-01)
Hu, Chih-Wei
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Chang, Ting-Chang
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Tu, Chun-Hao
;
Chen, Yang-Dong
;
Lin, Chao-Cheng
In this study, ZrO2 formed by the nitric acid oxidation method is proposed to be the tunneling oxide for nonvolatile memory device applications. The sputtered Zr thin film was oxidized by immersing in the nitric acid solution (HNO3:H2O = 1:10) for 60 s at room temperature. The quality of the formed ZrO2 was also extracted by the capacitance-voltage and current density-voltage measurements. Then, X-ray photoelectron spectroscopy has been used to confirm that the deposited Zr can be oxidized completely after the oxidation process. Moreover, a CoSi2 thin film was deposited on the nitric acid oxidized ZrO2 as the self-assembled layer of the memory device. After the device fabrication, the electrical and material characteristics of the CoSi2 nanocrystal memory devices have also been demonstrated and discussed.
Low-Power and Highly Reliable Multilevel Operation in ZrO2 1T1R RRAM
(2011-08-01)
Wu, Ming-Chi
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Lin, Yi-Wei
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Jang, Wen-Yueh
;
Lin, Chen-Hsi
;
Tseng, Tseung-Yuen
The Ti/ZrO2/Pt resistive memory devices with one transistor and one resistor (1T1R) architecture are successfully fabricated in this letter. The tested devices show low operation current (20 mu A), low switching voltage (set/reset, 0.8/-1 V), and reliable data retention for low-resistance state (LRS) with a 20-mu A set current at 80 degrees C (over ten years) via an excellent current limiter, namely, a metal-oxide-semiconductor field-effect transistor (MOSFET). In addition, multilevel storage characteristics are also demonstrated by modulating the amplitude of the MOSFET gate voltage. The various LRS levels obtained are possibly attributed to the formation of different numbers and sizes of conducting filaments consisting of oxygen vacancies caused by an external electric field. Moreover, reproducible resistive switching characteristics up to 2000 switching cycles are achieved in the same device. Our 1T1R ZrO2-based resistive switching access memory with low-power and highly reliable multilevel operation has high potential for practical applications.
Perovskite Oxides as Resistive Switching Memories: A Review
(2014-10-26)
Panda, Debashis
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Tseng, Tseung-Yuen
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
Numerous metal-insulator-metal systems demonstrate electrically induced resistive switching effects and have therefore been proposed as the basis for future nonvolatile memories. They combine the advantages of flash memories and dynamic random access memories while avoiding their drawbacks, such as operation speed, power consumption and device integration and scalable issues. The RRAM devices primarily operate at different resistance values to store the digital data and can keep the resistance state without any power supply. Recent advances in the understanding of the resistive switching mechanism are explained by a thermal or electrochemical redox reaction near the interface between the oxide and the top active metal electrode. Here we review the ongoing research and development activities on the perovskite based resistive switching memory devices. The possible switching mechanisms for the resistive switching are described. The effects of crystal structure, dopants, doping concentrations, annealing temperature, device structures and thickness of the active oxide layer on the resistive switching characteristics and consequently the memory performances are also discussed. From this insight, we take a brief look into different effect on the switching of the perovskite material systems.
Effect of top electrode material on resistive switching properties of ZrO2 film memory devices
(2007-05-01)
Lin, Chih-Yang
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Wu, Chen-Yu
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Wu, Chung-Yi
;
Lee, Tzyh-Cheang
;
Yang, Fu-Liang
The influence of top electrode material on the resistive switching properties of ZrO2 -based memory film using Pt as a bottom electrode was investigated in this letter. In comparison with Pt/ZrO2/Pt and Al/ZrO2/Pt devices, the Ti/ZrO2/Pt device exhibits different resistive switching current-voltage (I-V) curve, which can be traced and reproduced by a dc voltage more than 1000 times only showing a little decrease of resistance ratio between high and low resistance states. Furthermore, the broad dispersions of resistive switching characteristics in the Pt/ZrO2/Pt and Al/ZrO2/Pt devices are generally observed during successive resistive switching, but those dispersions are suppressed by the device using Ti as a top electrode. The reliability results, such as cycling endurance and continuous readout test, are also presented. The write-read-erase-read operations can be over 104 cycles without degradation. No data loss is found upon successive readout after performing various endurance cycles.
Resistive switching properties of SrZrO(3)-based memory films
(2007-04-01)
Lin, Chun-Chieh
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Lin, Chao-Cheng
;
Tu, Bing-Chung
;
Yu, Jung-Sheng
;
Lin, Chen-Hsi
The resistive switching properties of the sputter-deposited SrZrO(3) (SZO) memory films were investigated in this study. The resistive switching behaviors of the SZO film can be improved by doping with vanadium oxide. The conduction mechanisms of the high and low current states of the 0.3% V-doped SZO (V:SZO) film are ohmic conduction and Frenkel-Poole emission, respectively, which implies the bulk effect of the memory film. The resistive ratio of two current states of the 0.3% V:SZO film remains 1000 times after applying 100 voltage sweeping cycles. Furthermore, the 0.3% V:SZO film shows stable resistive switching properties when measurement is performed at 100 degrees C. The band modulation of the SZO/LNO interface is proposed to explain the forming process of the SZO films. The 0.3% V:SZO memory film has excellent properties, such as high stability, good endurance, and long retention time, which make it a good candidate for next-generation nonvolatile memory application.
Memory effect of RF sputtered ZrO2 thin films
(2007-12-03)
Lin, Chih-Yang
;
Wu, Chung-Yi
;
Wu, Chen-Yu
;
Lin, Chun-Chieh
;
Tseng, Tseung-Yuen
Electrical properties of RF sputtered ZrO2 Memory thin films were investigated in this study. The device with structure AI/ZrO2/Pt shows a reproducible resistive switching behavior traced over 100 times at room temperature. Moreover, by using various top electrodes, such as Pt, Cu, Ni, Ag, Ti, and even W-probe, the resistive switching phenomenon can be observed in ZrO2-based memory with Pt bottom electrode, indicating that the ZrO2 bulk dominates the resistive switching. The bias polarity dependent resistive switching behavior is demonstrated in the Ti/ZrO2/Pt device, which might be due to interface reaction between Ti and ZrO2 film. The resistance value of high conductive state in the Ti/ZrO2/Pt device decreases with increasing current compliance implying the possibility for multi-bit storage. Besides, the Ti/ZrO2/Pt device can be operated over 2000 resistive switching cycles at 85 degrees C by sweeping DC voltage, and the two memory states demonstrate good stability under read voltage stress at room temperature and 95 degrees C. The write-read-erase-read operations can be over 10(3) cycles at 85 degrees C. No data loss is found upon successive readout before and after performing 10(3) endurance cycles at 85 degrees C. According to above experimental results, the ZrO2 thin film has high potential for nonvolatile memory application. (C) 2007 Elsevier B.V. All rights reserved.
Stable resistive switching behaviors of sputter deposited V-doped SrZrO3 thin films
(2007-12-03)
Lin, Chun-Chieh
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Yu, Jung-Sheng
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Lin, Chih-Yang
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Lin, Chen-Hsi
;
Tseng, Tseung-Yuen
The influences of doping concentration and element on the resistive switching properties of SZO-based memory devices are investigated in this study. The sputter-deposited LNO bottom electrode and SZO resistive layer exhibit (100)-preferred orientation, and the LNO film annealed at 600 degrees C performs smooth surface and high conductivity. The 0.3% V:SZO memory device depicts the good switching behaviors including high resistance ratio, high endurance, long retention time, and non-destructive readout property. The turn-on voltage is slightly dependent on the SZO thickness, while the turn-off voltage is almost irrelative to the thickness. Besides, the switching properties of MoO3-, MoO2-, and Cr2O3-doped SZO devices are also studied. The results demonstrate that the resistive switching is an intrinsic property of the SZO film, but proper doping concentration and element can improve and stabilize the resistive switching behaviors. (C) 2007 Elsevier B.V. All rights reserved.
Resistive switching properties of sol-gel derived Mo-doped SrZrO3 thin films
(2007-12-15)
Lin, Chih-Yang
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Lin, Chun-Chieh
;
Huang, Chun-Hsing
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Lin, Chen-Hsi
;
Tseng, Tseung-Yuen
Hysteretic I-V characteristics of the SrZrO3 (SZO) thin films with various Mo-doping concentrations were investigated in the study. The 0.2 mol% Mo-doping SZO-based memory device showed excellent resistive switching characteristics, and the resistive switching can be operated over 300 times during successive operation. Both high and low conductive states were stable over 10(4) s. Multi-bit behavior was investigated by dc voltage sweeping with different spans of voltage scan for OFF-process and by various OFF-pulse voltages as well. The endurance test can be over 1000 times with no data loss found. The experimental results showed high potential for nonvolatile memory application. (c) 2007 Published by Elsevier B.V.

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