🏛️國立陽明交通大學機構典藏

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An experimental and analytical investigation of the photo-thermal-electro characteristics of a high power InGaN LED module
(2016-04-05)
Yang, Kai-Shing
;
Ding, Wei-Ting
;
Yeh, Chih-Ting
;
Lee, Ming-Tsang
;
Wang, Chi-Chuan
The photo-thermal-electro characteristics of a high power InGaN LED module were studied both experimentally and theoretically. Three types of heat sink substrate composed of two layers of materials were used to investigate the coupled relationships between chip temperature, thermal resistance, input electric power and light emission efficiency. The results showed that the thermal spreading resistance accounts for a significant fraction of the total substrate thermal resistance. The measured thermal resistance of the LED module increased with rising electric power input. Luminescent efficacy measurements revealed that this increase of thermal resistance was the result of increased heat dissipation from the chip due to less efficient conversion of electric power to light output. Furthermore, experimental results showed that the radiant efficiency of the LED decreases with increasing input electric power. The coupled effects of chip temperature, input power and thermal resistance of the substrate are responsible for this efficiency droop. A revised model for estimating the luminous efficacy that takes both thermal and electrical effects into consideration is proposed. It is shown that the efficiency droop of the LED module for all three types of substrates can be clearly demonstrated by using the proposed analysis. (C) 2015 Elsevier Ltd. All rights reserved.
An experimental study on the heat dissipation of LED lighting module using metal/carbon foam
(2013-11-01)
Yang, Kai-Shing
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Chung, Chi-Hung
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Lee, Ming-Tsang
;
Chiang, Song-Bor
;
Wong, Cheng-Chou
In this study, thermal performance of the cooling modules applicable for Par 38 light bulb is investigated. A total of six heat sink modules, including the basic reference design, metal foam, and carbon foam are tested and compared. Tests are performed and analyzed using the transient test method based on JESD51-1 standard. It is found that the thermal resistance from junction to die attach is quite small. By contrast, the thermal resistance of the heat sink dominates the total resistance, and it comprises 55% of the total resistance for the standard heat sink module. With some slight opening on the base plate, the thermal resistance can be improved by approximately 12%. The thermal resistance for the carbon foam having an embedded metal plate shows the least thermal resistance of 1.14 K/W, followed by the carbon foam, and then the metal foam. The lower thermal resistance of carbon foam in association with copper metal foam is due to its higher emissivity. In addition to better heat transfer performance as compared to the standard plate heat sink, the utilization of carbon foam and metal foam can also significantly reduce the weight of the heat sink. In this study, the weight of the heat sink can be reduced as much as 33%. (C) 2013 Elsevier Ltd. All rights reserved.
Enhanced cooling for LED lighting using ionic wind
(2013-01-15)
Chen, Ing Youn
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Guo, Mei-Zuo
;
Yang, Kai-Shing
;
Wang, Chi-Chuan
;
機械工程學系
This study employs ionic wind to augment heat transfer of a LED mounted on a substrate. The size of the LED chip is 0.9 mm x 0.9 mm with a nominal power of 1 W. A needle type electrode is used to generate ionic wind with the applied voltage ranging from 4 to 11 kV. The effects of aligned angle, electrode polarity, separation distance, and ground configuration on the thermal resistance of the LED substrate are examined in this study. For the same applied voltage, it appears that the thermal resistance for the negative polarity is lower than that for the positive one and the negative electrode also has a wilder operation range. The thermal resistance can be reduced as much as 50% in the test range. The thermal resistance is slightly reduced when the aligned angle is increased from 0 degrees to 20 degrees, but a further increase of aligned angle casts no further reduction on the thermal resistance. It is found that the influence of vertical separation distance between the needle and ground electrode is moderately higher than that of horizontal separation distance. Test results also indicate that the mesh ground electrode shows moderately lower thermal resistance than those of point or line electrode. (C) 2012 Elsevier Ltd. All rights reserved.
Thermal characterization of shrouded plate fin array on an LED backlight panel
(2011-10-01)
Shyu, Jin-Cherng
;
Hsu, Keng-Wei
;
Yang, Kai-Shing
;
Wang, Chi-Chuan
;
機械工程學系
This study experimentally investigates a 348 mm x 558 mm LED backlight panel consisting of 270 1-W LEDs and a plate-fin heat sink in an acrylic housing. Effects of shroud clearance, obstructions at entrance or exit on the overall performance are also examined. The results show that the heat transfer coefficient is very slightly reduced with the rise of shroud clearance from 0 mm to 5 mm, followed by a notable rise but it peaks at a shroud clearance between 10 and 20 mm. A further increase of shroud clearance leads a marginal decrease of heat transfer coefficient. It is found that the maximum temperatures within the LED panel are not necessarily located at the center region due to the edge effect. On the other hand, the temperature variation along the longitudinal direction indicates a local minimum Nusselt number occurring near the exit of LED panel. This unique phenomenon is associated with the development of velocity and temperature field, and is consistent with previous numerical examinations. On the other hand, the obstruction placed at the exit are often severe than at the entrance. (C) 2011 Elsevier Ltd. All rights reserved.

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🏛️國立陽明交通大學機構典藏

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