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Now showing 1 - 10 of 190

A Temperature Compensated 61-W Class-E Soft-Switching GaN-Based Active Diode Rectifier for Wireless Power Transfer Applications
(2019-01-01)
Yang, Shang-Hsien
;
Chen, Ke-Horng
;
Lin, Ying-Hsi
;
Lin, Shian-Ru
;
Tsai, Tsung-Yen
The proposed 6.78-MHz Class-E receiver features a soft-switching and temperature-compensated GaN-based active diode (GAD) rectifier design. Using the temperature dependence of the relationship between the driving voltage and the on-resistance of the switch, the gate-source control voltage of GaN can be adjusted to mitigate efficiency variations based on temperature effects. Moreover, a phase shift comparator activation controller is based on the direct relationship between the phase delay on the gate drive signals and the output power. The temperature dependency voltage offset of the comparator is alleviated with auto-zeroing. GAD rectifier ensures energy transfer up to 61 W and 6.8 A, high efficiency of 92%, and low harmonic distortion of 2.1%.
Demonstration of Annealing-free Metal-Insulator-Semiconductor (MIS) Ohmic Contacts on a GaN Substrate using Low Work-function Metal Ytterbium (Yb) and Al2O3 Interfacial Layer
(2019-01-01)
Wu, Tian-Li
;
Tseng, Yang-Yan
;
Huang, Chih-Fang
;
Chen, Zih-Sin
;
Lin, Chih-Chien
In this letter, the Metal-Insulator-Semiconductor (MIS) contacts are fabricated on the GaN substrates and compared to the Metal-Semiconductor (MS) contacts. To alleviate the Fermi level pinning effect at the Metal-Semiconductor interface, an Al2O3 interfacial layer (IL) (1 similar to 3 nm) is used to form the MIS contacts. By comparing the electrical characteristics, the contact with Onm Al2O3 layer, i.e., MS contact, shows a lowest current compared to the contacts with an Al2O3 IL, i.e., MIS contact. Furthermore, the current at 0.5V in the fabricated Transmission Line Measurement (TLM) device with lnm Al2O3 IL is 10(3) times higher the one without an Al2O3 IL. This proves that inserting an Al2O3 IL could mitigate the Fermi level pinning, resulting in a low Schottky barrier height. Finally, based on the TLM analysis, the resistivity of 5.1x10(-4) Omega.cm(2) is demonstrated in the MIS contact with lnm Al2O3 IL.
High-Uniformity Planar Mini-Chip-Scale Packaged LEDs with Quantum Dot Converter for White Light Source
(2019-05-29)
Chen, Lung-Chien
;
Tien, Ching-Ho
;
Chen, De-Fu
;
Ye, Zhi-Ting
;
Kuo, Hao-Chung
This study proposes a novel direct-lit mini-chip-scale packaged light-emitting diode (mini-CSPLED) backlight unit (BLU) that used quantum dot (QD) film, diffusion plate, and two prism films to improve brightness uniformity. Three different luminous intensity units, 120 degrees mini-CSPLED, 150 degrees mini-CSPLED, and 180 degrees mini-CSPLED with different emission angle structures were fabricated using a CSP process. In terms of component characteristics, although the 180 degrees mini-CSPLED light output power is about loss 4% (at 10mA) compared with 150 degrees mini-CSPLED, it has a large emission angle that forms a planar light source that contributes to improving the BLU brightness uniformity and reduced quantity of LEDs at the same area. In terms of BLU analysis, the blue mini-CSPLEDs with different emission angles excite the different QD film thicknesses; the chromaticity coordinates conversion to the white light region. The BLU brightness increases as the QD film thickness increases from 60, 90, and 150m. This result can achieve a brightness uniformity of 86% in a 180 degrees mini-CSPLED BLU + 150-m-thick QD films as compared to the 120 degrees mini-CSPLED BLU and 150 degrees mini-CSPLED BLU.
A simple extraction method for parasitic series resistances in GaN HEMTs considering non-quasi-static effects
(2019-05-01)
Nagarajan, Venkatesan
;
Chen, Kun-Ming
;
Wang, Huan-Chung
;
Singh, Sankalp Kumar
;
Anandan, Deepak
A simple technique for extracting the bias-dependent parasitic series resistances of the GaN-based high electron mobility transistor (HEMT) is demonstrated in this paper. With considering the non-quasi-static effect in devices, new analytical Z-parameter formulations are derived to determine parasitic resistances using the curve-fitting algorithm. More accuracy parasitic resistances can be obtained over a wide fitting frequency range compared to the conventional method which ignores the non-quasi-static effect. Here the intrinsic parameters are then calculated directly from intrinsic Y-parameters after de-embedding the parasitic elements in the small-signal equivalent circuit. An excellent agreement between the measured and simulated S-parameters from 100 MHz to 40 GHz is achieved, which validates the feasibility of our method for extracting the bias-dependent parasitic resistances.
Analysis of Quality Factor Enhancement in the Monolithic InGaN/GaN Nanorod Array
(2019-04-01)
Huang, Chia-Yen
;
Tai, Tzu-Ying
;
Hong, Kuo-Bin
;
Kuo, Hao-Chung
;
Lu, Tien-Chang
Whispering gallery mode (WGM) lasers and resonators are key building blocks for photonic integrated circuits. The quality factor and resonant wavelength are strong functions of the cavity size. Nanoscale WGM cavities suffer from a low-quality factor due to prominent scattering loss. However, the quality factor could be enhanced by forming an optically-coupled rod array or photonic molecules. Through simulations, we revealed how rod-to-rod optical coupling influenced the threshold pumping level and dominant mode selection, where the trend showed good agreement with the experimental observation. According to the simulation, the quality factor could be enhanced by up to eight times by forming a six-rod photonic molecule. The quality factor and effective mode were both superior to the single rods with the same wafer device footprint.
Investigation of Efficiency Droop for UV-LED with N-type AlGaN Layer
(2012-01-01)
Tu, Po-Min
;
Chang, Jet-Rung
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Huang, Shih-Cheng
;
Yang, Shun-Kuei
;
Lin, Ya-wen
The efficiency droop in InGaN-based 380nm UV light emitting device (LED) with n-GaN and n-AlGaN underlayer grown on sapphire substrate by metal-organic chemical vapor deposition (MOCVD) was investigated. From simulation result of high resolution x-ray diffraction (HRXRD) omega-2 theta. curve by using dynamical diffraction theory, the Al composition in the n-AlGaN layer was determined to be about 3%. The experimental results of temperature dependent photoluminescence (PL) demonstrated that the internal quantum efficiency (IQE) of n-GaN and n-AlGaN UV-LEDs are 43% and 39%, respectively, which are corresponding to an injected carrier density of 8.5 x 10(17) #/cm(3). It could be explained that the crystal quality of n-GaN is better than of n-AlGaN. In addition, the observation of pit density from atomic force microscopy (AFM) surface morphology is consistent with the interpretation. It was well-known that the pits appearing on the surface in the virtue of the threading dislocations. Thus, it means that defects induce the non-radiative centers and deteriorate the IQE of the UV-LED with n-AlGaN underlayer. Therefore, the light output power of n-GaN UV-LED is slightly higher below the forward current of 250 mA. Nevertheless, the output power was enhanced about 22% as the injection current was increased to 600 mA. Furthermore, the external quantum efficiency (EQE) of n-AlGaN UV-LED was nearly retained at the 600 mA (only 20% droop), whereas the UV-LED with n-GaN exhibits as high as 33%. We attributed this improvement to the less self-absoption by replacing n-GaN underlayer with n-AlGaN.
High Electron Mobility AlGaN/AlN/GaN HEMT Structure With a Nano-scale AlN Interlayer
(2012-01-01)
Huang, Shih-Chun
;
Chen, Wen-Ray
;
Hsu, Yu-Ting
;
Lin, Jia-Ching
;
Chang, Kuo-Jen
Epitaxies of AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with different thickness of nano-scale AlN interlayers have been realized by metalorganic chemical vapor deposition (MOCVD) technology. After epitaxy, high resolution X-ray diffraction (HRXRD), temperature-dependent Hall Effect and atomic force microscopy (AFM) measurements were used to characterize the properties of these samples. First, it was found that the Al composition of AlGaN layer increases from 21.6 to 34.2% with increasing the thickness of AlN interlayer from 0 to 5 nm under the same AlGaN growth conditions. This result may due to the influences of compressive stress and Al incorporation induced by the AlN interlayer. Then, we also found that the room-temperature (RT) electron mobility stays higher than 1500 cm(2)/Vs in the samples within AlN interlayer thickness range of 1.5 nm, on the other hand, the low-temperature (80K) electron mobility drops dramatically from 8180 to 5720 cm(2)/Vs in the samples with AlN interlayer thickness increasing from 1 to 1.5 nm. Furthermore, it was found that the two-dimensional electron gas (2DEG) density increases from 1.15x10(13) to 1.58x10(13) cm(-2) beyond the AlN interlayer thickness of 1 nm. It was also found that the temperature-independent 2DEG densities are observed in the samples with AlN interlayer thickness of 0.5 and 1 nm. The degenerated characteristics of the samples with AlN thickness thicker than 1.5 nm show the degraded crystalline quality which matched the observation of surface defects and small cracks formations from their AFM images. Finally, the 2DEG mobilities of the proposed structures can be achieved as high as 1705 and 8180 cm(2)/Vs at RT and 80K, respectively.
Abnormal PL spectrum in InGaN MQW surface emitting cavity
(2008-01-01)
Chu, J. T.
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Cheng, Y. -J.
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Kuo, H. C.
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Lu, T. C.
;
Wang, S. C.
We report the observation of an abnormal photoluminescent (PL) spectrum from a HeCd laser pumped InGaN multiple quantum well (MQW) vertical cavity. The device is fabricated using standard MOCVD deposition on a (0001)-oriented sapphire substrate. The layer structures are: 10nm nucleation layer, a 4um bulk GaN layer, InGaN MQWs, and a final 200nm GaN cap layer. The InGaN MQWs consist of 10 pairs of 5 nm GaN barrier and 3 run In0.1Ga0.9N well. The peak emission of the as-grown MQWs sample was similar to 420nm. A dielectric distributed Bragg reflectors (DBR) were then coated on the top layer, followed by a laser lift off from sapphire substrate, and subsequently another DBR coated on the bulk GaN bottom surface. The cavity has a quality factor of similar to 520 from 400-490nm. The device was pumped by a focused CW HeCd laser from the bulk GaN side. When the laser is focused onto the InGaN MQWs, a photoluminescent spectrum centered at the designed MOW wavelength was observed as expected. However, when the focused position was moved toward the bulk GaN region, an additional abnormal PL peak around 460nm was observed. This is far outside the designed MQW wavelength.
Analysis of Strain Relaxation and Emission Spectrum of A Free-Standing GaN-based Nanopillar
(2008-01-01)
Wu, Yuh-Renn
;
Yu, Peichen
;
Chiu, C. H.
;
Chang, Cheng-Yu
;
Kuo, H. C.
We have made a, GaN-based single nanopillar with a, diameter of 300nm using the focused ion beam (FB) technique. The micro-photoluminescence (mu-PL) from the embedded GaN/InGaN multi-quantum wells reveals a blue shift of 68.3 meV in energy. In order to explain the spectrum shift, we have developed a valence force field model to study the strain relaxation mechanism in a, single GaN-based nanopillar structure. The strain distribution and strain induced polarization effect inside the multiple quantum wells is added to our self-consistent Poisson, drift-diffusion, and Schrodinger solver to study the spectrum shift of mu-PL.
Light emission characteristics of nonpolar a-plane GaN-based photonic crystal defect cavities
(2015-01-01)
Kao, Tsung Sheng
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Wu, Tzeng-Tsong
;
Tsao, Che-Wei
;
Lin, Jyun-Hao
;
Lin, Da-Wei
In this paper, nonpolar a-plane GaN-based photonic crystals (PCs) with different defect cavities have been demonstrated. By using a micro-photoluminescence (mu-PL) system operated at 77 K, the dominant resonant modes of the GaN-based PC defect cavities show high quality factor (Q) values in the light emission performance which can be up to 4.3x10(3). Moreover, the degree of polarization (DOP) of the light emission from the nonpolar GaN-based PC defect cavities was measured to achieve around 64 % along the m crystalline direction.

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