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    Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding
    (2020-01-01)
    Lu, Cheng-Hsien
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    Yang, Yi-Lun
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    Chen, Chiao-Pei
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    Tsai, Bin-Ling
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    Chen, Kuan-Neng
    This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.
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    Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
    (1970-01-01)
    Wang, I-Ju
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    Ku, Ching-Shun
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    Tu-Ngoc Lam
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    Huang, E-Wen
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    Tu, K. N.
    We have examined the effect of different bath temperatures on residual stress of both the random-oriented Cu films and the highly (111)-oriented nanotwinned Cu films by synchrotron radiation x-ray measurements. The bath temperature varied from 15 degrees C to 40 degrees C. The results indicate that the average residual stress in the highly (111)-oriented nanotwinned films is higher than that in the randomly oriented Cu films. However, the stress in the highly (111)-oriented Cu decreases with increasing bath temperature. The average residual stress can be reduced from 253 MPa electroplated at 15 degrees C to 95 MPa under a bath temperature of 35 degrees C. We could successfully tune and measure residual stress of the Cu thin films. The films with low residual stress prevent warpage from occurring on the substrate and lower the processing failure in copper direct bonding and other processes that need alignment.
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    Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(IMPACT-IAAC 2016)
    (2016)
    Chang, Liang-Hsien
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    Chen, Chih
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    Hu, Dyi-Chung
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    Tain, Ray
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    Chen, Y. H.
    Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, which are thought to be mutually exclusive. According to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu using direct current with suitable additives on PCB substrates. Current density and the plating bath are variables. After copper electroplating, XRD, FIB, EBSD were used to observe the microstructure of the films. We found that the as-deposited Cu has > 30% (111)-oriented nt-Cu on the polymer substrate. The microstructures of the highly (111)-oriented nt-Cu will be presented.
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    Thermal bimetallic microactuators by Ni and Ni-diamond nanocomposite
    (2007)
    Huang, Chia-Sheng
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    Chung, Junwei
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    Cheng, Yu-Ting
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    Hsu, Wensyang
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    機械工程學系
    In previous investigation, it was found that Ni-diamond nanocomposite fabricated by adding nano-diamond particles in nickel plating could enhance coefficient of thermal expansion (CTE). Here thermal bimetallic microactuators made of Ni and Ni-diamond nanocomposite are proposed, fabricated, and tested. By controlling plating sequence of Ni and Ni-diamond nanocomposite, two types of the thermal bimetallic microactuators, including upward displacement and downward displacement types, are developed. Due to the same low process temperature in electroplating these two layers, the residual thermal stress and initial deformation of. fabricated thermal bimetallic microactuators are small. Since two materials in the bimetallic actuators are Ni-based, the bonding strength between Ni and Ni-diamond nanocomposite is found to be strong. From vibration test, after 109 cycles, the resonant frequency remains unchanged. From thermal cycling test, the fabricated thermal bimetallic microactuator shows good interfacial bonding strength with only 0.002 % deviation of resonant frequency and 13.5 % deviation of tip deflection after 1,000 continuous thermal cycles.