學術出版;;Publications

Permanent URI for this communityhdl:11536/1

收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

Browse

🏛️國立陽明交通大學機構典藏

Search Results

Now showing 1 - 8 of 8

Effect of Field Plate on the RF Performance of AlGaN/GaN HEMT Devices
(2012-01-01)
Chiang, Che-Yang
;
Hsu, Heng-Tung
;
Chang, Edward Yi
;
材料科學與工程學系
;
Department of Materials Science and Engineering
This paper examines the effect of the field plate structure on the RF performance of AlGaN/GaN High Electron Mobility Transistor (HEMT) devices. While the field plate structure helps to increase the breakdown voltage of the device through modulating the electric field locally, it induces additional feedback capacitance from drain to gate. Such feedback capacitors may impact the overall RF performance of the device especially at high frequencies. Systematic investigations on the small signal as well as power performance as functions of the drain biases are presented. (C) 2011 Published by Elsevier B.V. Selection and/or peer-review under responsibility of Garry Lee
High Electron Mobility AlGaN/AlN/GaN HEMT Structure With a Nano-scale AlN Interlayer
(2012-01-01)
Huang, Shih-Chun
;
Chen, Wen-Ray
;
Hsu, Yu-Ting
;
Lin, Jia-Ching
;
Chang, Kuo-Jen
Epitaxies of AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with different thickness of nano-scale AlN interlayers have been realized by metalorganic chemical vapor deposition (MOCVD) technology. After epitaxy, high resolution X-ray diffraction (HRXRD), temperature-dependent Hall Effect and atomic force microscopy (AFM) measurements were used to characterize the properties of these samples. First, it was found that the Al composition of AlGaN layer increases from 21.6 to 34.2% with increasing the thickness of AlN interlayer from 0 to 5 nm under the same AlGaN growth conditions. This result may due to the influences of compressive stress and Al incorporation induced by the AlN interlayer. Then, we also found that the room-temperature (RT) electron mobility stays higher than 1500 cm(2)/Vs in the samples within AlN interlayer thickness range of 1.5 nm, on the other hand, the low-temperature (80K) electron mobility drops dramatically from 8180 to 5720 cm(2)/Vs in the samples with AlN interlayer thickness increasing from 1 to 1.5 nm. Furthermore, it was found that the two-dimensional electron gas (2DEG) density increases from 1.15x10(13) to 1.58x10(13) cm(-2) beyond the AlN interlayer thickness of 1 nm. It was also found that the temperature-independent 2DEG densities are observed in the samples with AlN interlayer thickness of 0.5 and 1 nm. The degenerated characteristics of the samples with AlN thickness thicker than 1.5 nm show the degraded crystalline quality which matched the observation of surface defects and small cracks formations from their AFM images. Finally, the 2DEG mobilities of the proposed structures can be achieved as high as 1705 and 8180 cm(2)/Vs at RT and 80K, respectively.
Novel Metamorphic HEMTs With Highly Doped InGaAs Source/Drain Regions for High Frequency Applications
(2010-10-01)
Sahoo, Kartika Chandra
;
Kuo, Chien-I
;
Li, Yiming
;
Chang, Edward Yi
;
傳播研究所
In this paper, we report the first result of a strained In(0.52)Ga(0.48) As channel high-electron mobility transistor (HEMT) featuring highly doped In(0.4)Ga(0.6) As source/drain (S/D) regions. A lattice mismatch of 0.9% between In(0.52)Ga(0.48) As and In(0.4)Ga(0.6) As S/D has resulted in a lateral strain in the In(0.52)Ga(0.48) As channel region, where the series resistance is reduced with highly doped S/D regions. An experimentally validated device simulation is advanced for the proposed HEMT, and the results of this paper have shown that there are 60% drive-current and 100% transconductance improvements, compared with the conventional structure. A remarkable 150-GHz increase in the cutoff frequency has been seen for the proposed structure over the conventional one as well for the shown devices.
Comparative DC Characteristic Analysis of AlGaN/GaN HEMTs Grown on Si(111) and Sapphire Substrates by MBE
(2014-04-01)
Mukhopadhyay, Partha
;
Bag, Ankush
;
Gomes, Umesh
;
Banerjee, Utsav
;
Ghosh, Saptarsi
A comparative assessment of AlGaN/GaN high-electron-mobility transistors (HEMTs) grown by molecular beam epitaxy on silicon and sapphire substrates has been carried out. Large-area power GaN HEMTs with identical device dimensions were fabricated on both substrates. A thicker AlN buffer layer was used for the GaN HEMT on silicon to achieve similar quality and uniformity of GaN epitaxy for rational comparison with that grown on sapphire. Direct-current analysis and physical characterization were carried out to understand the performance of the devices. Mathematical measurement of the instability of the current-voltage (I-V) characteristic at high applied drain bias was carried out to evaluate the performance of both devices. An improved two-dimensional (2D) analysis of the I-V characteristic was performed from a thermal perspective including appropriate scattering effects on the 2D electron gas mobility. The experimental and analytical studies were correlated to reveal the effects of temperature-sensitive scattering phenomena on the mobility as well as on the I-V characteristic at high drain bias in terms of lattice thermal heating. It is observed that the HEMT on Si has improved stability compared with sapphire due to its weaker scattering phenomena at high drain bias, associated with its thermal conductivity. Simulation of 2D thermal mapping was also carried out to distinguish the hot-spot regions of the devices. The comparable electrical performance of these devices illustrates the viability of AlGaN/GaN HEMTs on Si(111) to achieve low-cost stable devices with better thermal power handling for high-voltage applications.
Structure design criteria of dual-channel high mobility electron transistors
(2007-01-01)
Lin, Jia-Chuan
;
Chen, Yu-Chieh
;
Tsai, Wei-Chih
;
Yang, Po-Yu
;
光電工程學系
The design criteria of dual-channel high electron mobility transistor (DHEMT) are proposed in this study. 8-Doped In(0.52)Al(0.48)As/ In(0.53)Ga(0.47)As/InP material systems are concentrated in this article. The DHEMT structures are explored numerically and compared with conventional single-channel high electron mobility transistor (SHEMT) structures. Some criteria of doping concentration and layer structure design are proposed. The simulation results reveal that DHEMT has a larger voltage swing, a lower gate leakage current, a better carrier confinement, a higher density of two-dimensional electron gas (2DEG) and an excellent transconductance than SHENIT. (c) 2006 Elsevier Ltd. All rights reserved.
Impacts of gate recess and passivation on AlGaN/GaN high electron mobility transistors
(2007-02-01)
Chan, Chih-Yuan
;
Lee, Ting-Chi
;
Hsu, Shawn S. H.
;
Chen, Leaf
;
Lin, Yu-Syuan
In this study, the impacts of gate recess and passivation on AlGaN/GaN high electron mobility transistors (HEMTs) were investigated. The trap-related characteristics were studied in detail by several different measurements including dc current-voltage, cur-rent collapse, gate lag, and flicker noise characterizations. With a Cl-2/Ar-recessed gate, drain current collapse factors (Delta I-max) of similar to 37.5 and similar to 6.9% were observed before and after SiN passivation. The gate lag measurements showed that the lagging phenomena almost disappear with SiN passivation for both Cl-2- and Cl-2/Ar-recessed devices. However, the flicker noise measurements revealed distinct noise levels of devices with different processes even after passivation. As the gate voltage (VG) changed from 2 to -4V, the devices recessed by Cl-2 exhibited lower drain noise current densities (S-ID/I-D(2) ranging from 2.8 x 10(-14) to 1.7 x 10(-12) Hz(-1) at 1 kHz) than those etched by Cl-2/Ar mixture gas (S-ID/I-D(2) ranging from 6.3 x 10(-14) to 6.0 x 10(-12) Hz(-1) at 1 kHz), whereas the devices without the recess process showed the lowest noise levels (S-ID/I-D(2) ranging from 2.8 x 10(-15) to 1.3 x 10(-13) Hz(-1) at 1 kHz). It was found that S-ID/I-D(2) increased monotonically when V-G changed from 2 to -4V. A bias dependence of the 1/f(gamma) slope gamma was observed, and a relatively large variation in the range of similar to 1.1 to 1.6 was found for devices recessed by Cl-2/Ar mixture gas. The number fluctuation model was employed to explain the observed trends. The results also indicated that the surface traps play an important role in these devices.
THE DELTA-DOPED IN0.25GA0.75AS/GAAS PSEUDOMORPHIC HIGH ELECTRON-MOBILITY TRANSISTOR STRUCTURES PREPARED BY LOW-PRESSURE METAL ORGANIC-CHEMICAL VAPOR-DEPOSITION
(1991-06-01)
CHANG, CY
;
LIN, W
;
HSU, WC
;
WU, TS
;
CHANG, SZ
The (800 angstrom)GaAs/In0.25Ga0.75As/(0.5-mu-m) GaAs strain layers with delta-doping in the GaAs cap layer were fabricated without using AlGaAs layers. Triethylgallium (TEG), trimethylindium (TMI), arsine (AsH3) and silane (SiH4) were used as the sources and dopants in these structures grown by the low-pressure metalorganic chemical vapor deposition (LP-MOCVD) technique for the first time to study these structures. The delta-doping was obtained by a stop-growth process by which a very thin and heavily doped layer (1.86 x 10(13) cm-2) can be realized. For the (delta-doped) GaAs/In0.25Ga0.75As/GaAs high electron mobility transistor (HEMT) structures, the concentration of two-dimensional electron gas (2-DEG) and the Hall mobilities were investigated. Experimental results show that a structure with (80 angstrom) In0.25Ga0.75As as the active channel and with a 70 angstroms spacer layer revealed the highest 2-DEG concentration and mobility product of 5.5 x 10(16) V-1.s-1 at a temperature of 77 K. These structures are easy to achieve by the LP-MOCVD mechod and are promising for high-performance field effect transistors (FETs).
BACK-GATING EFFECTS ON THE GA0.1IN0.8P/INP/INGAAS HIGH-ELECTRON-MOBILITY TRANSISTOR
(1995-07-01)
LIN, KC
;
CHANG, CY
;
WU, CC
;
CHEN, HD
;
CHEN, PA
Pseudomorphic GaInP/InP/InGaAs high electron mobility transistors (HEMT) with improved Schottky contacts and excellent electrical characteristics are grown by low-pressure metal-organic chemical vapor deposition (LP-MOCVD) on the InP substrate. These HEMTs with 1.71 mu m gate length have an average extrinsic transconductance of 225 mS/mm. The back-gating effects of this device structure are investigated for the first time in this structure. Both positive and negative bias are applied to the ohmic and Schottky back-gate contacts of these devices. The positive back-gate bias has no effect on the drain current or the output transconductances of these devices. The effect of the negative back-gate bias is very similar to that when negative bias is applied on the gate of these HEMTs.

學術出版;;Publications

Browse

Filters

Settings

Sort By

Results per page

🏛️國立陽明交通大學機構典藏

Search Results