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Microstructural Characterization of Multilayer Metal Stack on InGaAs/InP Contact
(2020-08-01)
Hsu, Chih-Lin
;
Wu, Yewchung Sermon
;
Chen, Szu-Hung
;
Lin, Kun-Lin
;
材料科學與工程學系
Al/InGaAs, Al/Ti/InGaAs, and Al/Ni/InGaAs contacts were prepared by conducting rapid thermal annealing at different temperatures, and the interfacial reaction was characterized using x-ray diffraction, atomic force microscopy, and transmission electron microscopy. The specific contact resistivity of the metal film contacts onn-InGaAs was determined using a circular transmission line measurement. The Al/Ni/InGaAs, Al/Ti/InGaAs, and Al/InGaAs stack contacts remained stable even after the samples were subjected to annealing at 400 degrees C. When the annealing temperature increased to 600 degrees C, Al began melting and clustering due to the formation of Al(Ga) to form Al/InGaAs. An AlNi phase was formed at the interfaces of an Al/Ni/InGaAs contact when it was annealed above 400 degrees C, thus causing the specific resistance and roughness to increase dramatically. Each element of the Al/Ti/InGaAs contact began diffusing when it was annealed beyond 400 degrees C, and an Al3Ti phase was formed above 500 degrees C. The formation of Al3Ti led to the increase in the specific resistance and roughness. Moreover, the as-deposited Al/Ni/InGaAs, Al/Ti/InGaAs and Al/InGaAs samples had specific resistances of 1.11 x 10(-5) omega cm(2), 5.11 x 10(-5) omega cm(2), and 1.14 x 10(-4) omega cm(2), respectively. These results reveal that to develop the Al/Ti/InGaAs and Al/Ni/InGaAs stacks on InGaAs with a low parasitic resistance, the processing temperature should be lower than 400 degrees C.
Investigation of Inversion Charge Characteristics and Inversion Charge Loss for InGaAs Negative-Capacitance Double-Gate FinFETs Considering Quantum Capacitance
(2020-01-01)
Huang, Shih-En
;
Lin, Shih-Han
;
Su, Pin
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This paper investigates the inversion charge characteristics and quantum-capacitance induced inversion charge loss for In0.53Ga0.47As negative-capacitance FinFETs (NC-FinFETs) using theoretical calculation corroborated with numerical simulation. Our study indicates that, the boost of inversion charges due to negative capacitance increases with increasing remnant polarization P-r. In addition, the inversioncharge boosting for the In0.53Ga0.47As device is significantly larger than that of the Si (110) device due to the step-like inversion capacitance characteristic stemming from the 2D density-of-states of the In0.53Ga0.47As device. In other words, the quantum-capacitance induced inversion-charge loss for III-V channel can be mitigated in NCFETs.
Investigation of Fin-Width Sensitivity of Threshold Voltage for InGaAs and Si Negative-Capacitance FinFETs Considering Quantum-Confinement Effect
(2019-06-01)
Huang, Shih-En
;
Yu, Chien-Lin
;
Su, Pin
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
This paper investigates the fin-width (W-Fin) sensitivity of threshold voltage (V-T) for InGaAs and Si channel negative-capacitance FinFETs (NC-FinFETs) using a theoretically derived quantum subthreshold model corroborated with TCAD numerical simulation. Our study indicates that due to the action of negative capacitance, the NC-FinFET possesses smaller VT sensitivity to W-Fin than the FinFET counterpart. In addition, we point out and demonstrate that a device design with higher internal voltage amplification can be utilized to further reduce the V-T sensitivity to W-Fin for NC-FinFETs. Our study may provide insights for future scaling of FinFETs.
Novel Metamorphic HEMTs With Highly Doped InGaAs Source/Drain Regions for High Frequency Applications
(2010-10-01)
Sahoo, Kartika Chandra
;
Kuo, Chien-I
;
Li, Yiming
;
Chang, Edward Yi
;
材料科學與工程學系
In this paper, we report the first result of a strained In(0.52)Ga(0.48) As channel high-electron mobility transistor (HEMT) featuring highly doped In(0.4)Ga(0.6) As source/drain (S/D) regions. A lattice mismatch of 0.9% between In(0.52)Ga(0.48) As and In(0.4)Ga(0.6) As S/D has resulted in a lateral strain in the In(0.52)Ga(0.48) As channel region, where the series resistance is reduced with highly doped S/D regions. An experimentally validated device simulation is advanced for the proposed HEMT, and the results of this paper have shown that there are 60% drive-current and 100% transconductance improvements, compared with the conventional structure. A remarkable 150-GHz increase in the cutoff frequency has been seen for the proposed structure over the conventional one as well for the shown devices.
Improving electrical characteristics of W/HfO2/In0.53Ga0.47As gate stacks by altering deposition techniques
(2011-07-01)
Zade, D.
;
Kakushima, K.
;
Kanda, T.
;
Lin, Y. C.
;
Ahmet, P.
The effects of controlling InGaAs substrate temperature during electron beam deposition of HfO2 on electrical characteristics of W/HfO2/n-In0.53Ga0.47As capacitors are investigated. It is found that by depositing a thin HfO2 layer at the interface when substrate temperature is raised to 300 degrees C, frequency dispersion at depletion and accumulation conditions is reduced and interface state density is lowered regardless of the HfO2 thickness. Cross-sectional transmission electron microscopy images have revealed that the formation of mesoscopic voids in the InGaAs substrate near the interface is suppressed with HfO(2)deposition at 300 degrees C at the interface. A band diagram with an additional bulk trap energy level has been proposed to explain the frequency dispersion and conductance peaks at accumulation condition. (c) 2011 Elsevier B.V. All rights reserved.
Study of the inversion behaviors of Al2O3/InxGa1-xAs metal-oxide-semiconductor capacitors with different In contents
(2010-01-01)
Wu, Yun-Chi
;
Chang, Edward Yi
;
Lin, Yueh-Chin
;
Kei, Chi-Chung
;
Hudait, Mantu K.
InxGa1-xAs III-V compound semiconductor metal-oxide-semiconductor field-effect transistors have become a popular topic recently due to the higher drift velocity, and lower effective mass of the InxGa1-xAs materials. The impact of In content on the accumulation and inversion behaviors of the Al2O3/InxGa1-xAs capacitors is investigated in this study. For the various InxGa1-xAs materials studied, the Al2O3/InAs MOS system showed the strongest inversion phenomena due to the shorter response time of minority carrier of InAs compared to other InxGa1-xAs materials. Also, very low gate leakage current in the 10(-8) A/cm(2) range was observed for these capacitors. These results demonstrate that Al2O3/InAs MOS system with strong inversion phenomena and low leakage gate current is potential candidate for future high-performance low power logic MOSFET applications. (C) 2009 Elsevier Ltd. All rights reserved.
RF Performance Improvement of Metamorphic High-Electron Mobility Transistor Using (InxGa1-xAs)(m)/(InAs)(n) Superlattice-Channel Structure for Millimeter-Wave Applications
(2010-07-01)
Kuo, Chien-I
;
Hsu, Heng-Tung
;
Chen, Yu-Lin
;
Wu, Chien-Ying
;
Chang, Edward Yi
High-performance metamorphic high-electron mobility transistors (MHEMTs) using an (InxGa1-xAs)(m)/(InAs)(n) superlattice structure as a channel layer have been fabricated successfully. These HEMTs with 80-nm gate length exhibited a high drain current density of 392 mA/mm and a transconductance of 991 mS/mm at 1.2-V drain bias. Compared with a regular InxGa1-xAs channel, the superlattice-channel HEMTs showed an outstanding performance due to the high electron mobility and better carrier confinement in the (InxGa1-xAs)(m)/(InAs)(n) channel layer. When biased at 1.2 V, the current gain cutoff frequency (f(T)) and the maximum oscillation frequency (f(max)) were extracted to be 304 and 162 GHz, respectively. As for noise performance, the device demonstrated a 0.75-dB minimum noise figure(NFmin) with an associated gain of 9.6 dB at 16 GHz. Such superior performance has made the devices with a superlattice channel well suitable for millimeter-wave applications.
High Perfonnance InAs-Channel HEMT for Low Voltage Milimeter Waive Applications
(2007)
Hsu, Heng-Tung
;
Chang, Chia-Yuan
;
Chang, Edward Yi
;
Ku, Chien-, I
;
Miyamoto, Yasuyuki
An 80-nm InP HEMT with InAs channel and InGaAs sub-channels has been fabricated. The high current gain cutoff frequency (ft) of 350 GHz and maximum oscillation frequency (fmax) of 360 GRz were obtained at VDS = 0.7 V due to the high electron mobility in the InAs channel. DC and RF characterizations on the device have been performed and the on-sate breakdown voltage of the device was measured to be 1.75V. A 2-stage MMIC gain block was designed using such device. A simulated gain of better than 12 dB from 54 GHz to 71 GRz with only 14mW DC power consumption was achieved. Such high performance HEMTs demonstrated in this study shows great potential for very low power millimeter wave applications.
Electrical Characteristic of InGaAs Multiple-Gate MOSFET Devices
(2015)
Huang, Cheng-Hao
;
Li, Yiming
;
交大名義發表
;
傳播研究所
;
電機學院
In this work, we study the impact of channel fin width (W-fin) and fin height (H-fin) on III-V multiple-gate metal-oxide-semiconductor field-effect transistors (MOSFETs). We numerically simulated the output and transfer characteristics and the short-channel effect (SCE) of 14-nm InGaAs triple-gate MOSFETs by using an experimentally validated simulation. The engineering findings of this study indicate that devices with W-fin = 10 nm and H-fin between 14 and 21 nm possess optimal characteristic owing to a tradeoff between the drain-induced barrier lowing and subthreshld property. The effects of channel resistance, effective width, and quantum confinement resulting from the H-fin-dependent small energy band gap channel film on device characteristic are further estimated and discussed.
Photovoltaic response for high density InGaAs coupled quantum dots
(2012)
Chuang, K. Y.
;
Tzeng, K. D.
;
Tzeng, T. E.
;
Lay, T. S.
;
Lin, Chien-chung
In order to enhance absorption at infrared range for GaAs based solar cell, we insert the nine-layer of vertically coupled quantum dots (VCQDs) into the active layer. We fine modulated the GaAs spacer thickness of coupled In0.75Ga0.25As QDs, and investigated the effects on photovoltaic response. For the open-circuit voltage (V-oc), the values decreases from 0.61 V to 0.55 V as the spacer thickness (d) decreases from d=15 nm to 5 nm for the nine-layer VCQDs solar cells. The reduction of V-oc for the VCQDs solar cells is attributed to the accumulation of compressive strain energy in the active QD region. For the sample of d=10 nm shows the best performance of current density (J(sc)similar to 24 mA/cm(2)) and efficiency (eta similar to 10.6). The J(sc) and eta, are increases by 55% and 112% more than the device without QDs, respectively.

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