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收集所有交通大學研究人員與學生個人或團體所發表之各項學術著作，涵蓋期刊論文、教師專書、學位論文等項。;;Collections of Publications of NCTU Researchers and Students Like Journal Papers and Thesis.

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Subject: search.filters.subject.LP-MOCVD

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Now showing 1 - 7 of 7
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    SILICON DELTA-DOPING OF GAINP GROWN BY LOW-PRESSURE METALORGANIC CHEMICAL-VAPOR-DEPOSITION
    (1995-09-01)
    WANG, CJ
    ;
    WU, JW
    ;
    CHAN, SH
    ;
    CHANG, CY
    ;
    SZE, SM
    Silicon delta doping in GaInP material has been demonstrated by low-pressure metalorganic chemical vapor deposition (LP-MOCVD) and characterized by Hall-effect and capacitance-voltage (C-V) measurements. The mobility enhancement of delta-doped samples over their corresponding uniformly doped samples was observed. High sheet carrier density of N-S=1.21 x 10(13) cm(-2) could be obtained. A sharp carrier distribution profile with the full width at half maximum of 25 Angstrom has been achieved.
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    THE DELTA-DOPED IN0.25GA0.75AS/GAAS PSEUDOMORPHIC HIGH ELECTRON-MOBILITY TRANSISTOR STRUCTURES PREPARED BY LOW-PRESSURE METAL ORGANIC-CHEMICAL VAPOR-DEPOSITION
    (1991-06-01)
    CHANG, CY
    ;
    LIN, W
    ;
    HSU, WC
    ;
    WU, TS
    ;
    CHANG, SZ
    The (800 angstrom)GaAs/In0.25Ga0.75As/(0.5-mu-m) GaAs strain layers with delta-doping in the GaAs cap layer were fabricated without using AlGaAs layers. Triethylgallium (TEG), trimethylindium (TMI), arsine (AsH3) and silane (SiH4) were used as the sources and dopants in these structures grown by the low-pressure metalorganic chemical vapor deposition (LP-MOCVD) technique for the first time to study these structures. The delta-doping was obtained by a stop-growth process by which a very thin and heavily doped layer (1.86 x 10(13) cm-2) can be realized. For the (delta-doped) GaAs/In0.25Ga0.75As/GaAs high electron mobility transistor (HEMT) structures, the concentration of two-dimensional electron gas (2-DEG) and the Hall mobilities were investigated. Experimental results show that a structure with (80 angstrom) In0.25Ga0.75As as the active channel and with a 70 angstroms spacer layer revealed the highest 2-DEG concentration and mobility product of 5.5 x 10(16) V-1.s-1 at a temperature of 77 K. These structures are easy to achieve by the LP-MOCVD mechod and are promising for high-performance field effect transistors (FETs).
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    TIWN SCHOTTKY CONTACTS TO N-GA(0.51)IN(0.49)P
    (1994-08-01)
    LIN, KC
    ;
    CHANG, EY
    ;
    WANG, SP
    ;
    LAI, YL
    ;
    CHANG, CY
    The study of the applicability of TiW nitrides (TiWNx) as the Schottky contact metals to the n-type Ga0.51In0.49P has been made. The Ga0.51In0.49P epitaxial layer is successfully grown on the GaAs substrate by low-pressure metalorganic chemical vapor deposition (LP-MOCVD) to form a lattice-matched heterostructure. The RF-magnetron sputtering system is utilized for nitride deposition. Thermal stability of the nitride films is studied with the aid of a rapid thermal annealing system. The material properties are characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). With sufficient nitrogen content, the Schottky contacts showed excellent electrical and physical characteristics even after a high-temperature annealing. The barrier heights, ranging from 0.81 to 1.05 eV, depend on the content of nitrogen and the rapid thermal annealing (RTA) annealing condition. The XRD and AES results indicate no interaction occurring at the TiWNx/GaInP interface of both as-deposited and annealed samples. The outstanding characteristics of the Schottky contact are attributed to the high band-gap nature of the GaInP and the incorporation of nitrogen into the TiW films.
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    BACK-GATING EFFECTS ON THE GA0.1IN0.8P/INP/INGAAS HIGH-ELECTRON-MOBILITY TRANSISTOR
    (1995-07-01)
    LIN, KC
    ;
    CHANG, CY
    ;
    WU, CC
    ;
    CHEN, HD
    ;
    CHEN, PA
    Pseudomorphic GaInP/InP/InGaAs high electron mobility transistors (HEMT) with improved Schottky contacts and excellent electrical characteristics are grown by low-pressure metal-organic chemical vapor deposition (LP-MOCVD) on the InP substrate. These HEMTs with 1.71 mu m gate length have an average extrinsic transconductance of 225 mS/mm. The back-gating effects of this device structure are investigated for the first time in this structure. Both positive and negative bias are applied to the ohmic and Schottky back-gate contacts of these devices. The positive back-gate bias has no effect on the drain current or the output transconductances of these devices. The effect of the negative back-gate bias is very similar to that when negative bias is applied on the gate of these HEMTs.
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    Item type:Item,
    SILICON DELTA-DOPING OF GAINP GROWN BY LOW-PRESSURE METALORGANIC CHEMICAL-VAPOR-DEPOSITION
    (1995-09-01)
    WANG, CJ
    ;
    WU, JW
    ;
    CHAN, SH
    ;
    CHANG, CY
    ;
    SZE, SM
    Silicon delta doping in GaInP material has been demonstrated by low-pressure metalorganic chemical vapor deposition (LP-MOCVD) and characterized by Hall-effect and capacitance-voltage (C-V) measurements. The mobility enhancement of delta-doped samples over their corresponding uniformly doped samples was observed. High sheet carrier density of N-S=1.21 x 10(13) cm(-2) could be obtained. A sharp carrier distribution profile with the full width at half maximum of 25 Angstrom has been achieved.
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    SE-DOPED GAN FILMS GROWN BY LOW-PRESSURE METALORGANIC CHEMICAL-VAPOR-DEPOSITION
    (1995-10-01)
    GUO, JD
    ;
    FENG, MS
    ;
    PAN, FM
    ;
    材料科學與工程學系
    ;
    電子工程學系及電子研究所
    Se-doped GaN films are grown for the first time by low-pressure metalorganic chemical vapor deposition (LP-MOCVD), in which H2Se is used as the Se source sas. Effects of Se doping on electrical properties of GaN films are reported. Se atoms tend to out-diffuse to the surface of the GaN film at high tempi rature. The N atomic percentage is influenced by the incorporation of H2Se in the MOCVD process. The carrier concentration was found to be significantly affected by the surface defects which develop at high H2Se dosages. The highest free electron concentration obtained is about 1.5 x 10(18) cm(-3). Increasing the growth temperature from 1000 degrees C to 1050 degrees C reduces the maximum carrier concentration to about 7x10(17) cm(-3).
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    High-performance An/Ti/Ge/Pd ohmic contacts on n-Type In0.5Ga0.5P
    (1996-04-01)
    Chai, CY
    ;
    Wu, JW
    ;
    Guo, JD
    ;
    Huang, JA
    ;
    Lai, YL
    High-performance Au/Ti/Ge/Pd ohmic contacts on n(+)-In0.5Ga0.5P have been fabricated for the first time. Using an n(+)-In0.5Ga0.5P epitaxial layer grown by low pressure metalorganic chemical vapor deposition (LP-MOCVD) with a Si dopant concentration of about 2 x 10(18) cm(-3), the minimum specific contact resistivity is as low as 1.2 x 10(-5) Ohm . cm(2), which is much lower than that of AuGeNi contacts after rapid thermal annealing at 400 degrees C for 60 s. The thermal stability of the Au/Ti/Ge/Pd system is significantly higher than that of conventional AuGeNi due to the introduction of the Ti barrier layer. Many holes and islands are observed on the surfaces of samples annealed at high temperature. The outdiffusion of P from the decomposed In0.5Ga0.5P substrate and agglomeration of Pd and Ge are the primary causes of contact degradation.