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dc.contributor.authorChung, S. H.en_US
dc.contributor.authorChung, I. P.en_US
dc.contributor.authorTai, Y. T.en_US
dc.contributor.authorChu, Y. M.en_US
dc.date.accessioned2014-12-08T15:02:19Z-
dc.date.available2014-12-08T15:02:19Z-
dc.date.issued2008en_US
dc.identifier.isbn978-0-7695-3322-3en_US
dc.identifier.urihttp://hdl.handle.net/11536/1007-
dc.identifier.urihttp://dx.doi.org/10.1109/NCM.2008.123en_US
dc.description.abstractWafer fabrications provide the semiconductor backend turnkey service (SBTS) that help their customers to handle the outsourcing business of the three backend processing stages including circuit probing testing, integrated circuit assembly, and final testing. When the process of wafer fabrication is completed, the SBTS provider needs to select appropriate outsourcing firms and to allocate the semi-finished orders to them. In the process of selecting suitable outsourcing firms, the SBTS providers consider the constraints of limited capacity, production cost, due dates, and the processing capabilities of each outsourcing firm. The planning problem for SBTS is very complicated because of requirement variations of orders and capability variations of outsourcing firms. In this paper, a mixed integer programming model for SBTS with the total cost minimization criterion is presented. A case is also provided to demonstrate its applicability of the IP model in real practice.en_US
dc.language.isoen_USen_US
dc.subjectSemiconductor backend turnkey service (SBTS)en_US
dc.subjectoutsourcingen_US
dc.subjectwafer fabricationen_US
dc.titleThe Design of Outsourcing Planning for Semiconductor Backend Turnkey Serviceen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/NCM.2008.123en_US
dc.identifier.journalNCM 2008: 4TH INTERNATIONAL CONFERENCE ON NETWORKED COMPUTING AND ADVANCED INFORMATION MANAGEMENT, VOL 2, PROCEEDINGSen_US
dc.citation.spage701en_US
dc.citation.epage706en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000260994400124-
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