60GHZ傳送接收器之覆晶多晶片模組構裝技術與設備開發計畫第二期(III)

Full metadata record

DC Field	Value	Language
dc.contributor.author	成維華	en_US
dc.contributor.author	CHIENG WEI-HUA	en_US
dc.date.accessioned	2014-12-13T10:46:57Z	-
dc.date.available	2014-12-13T10:46:57Z	-
dc.date.issued	2009	en_US
dc.identifier.govdoc	NSC98-2623-E009-004-IT	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/100928	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=1843770&docId=305705	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	60GHZ傳送接收器之覆晶多晶片模組構裝技術與設備開發計畫第二期(III)	zh_TW
dc.type	Plan	en_US
dc.contributor.department	國立交通大學機械工程學系(所)	zh_TW
Appears in Collections:	Research Plans