以二階式生產流程模式構建半導體封裝現場流程管制系統

Full metadata record

DC Field	Value	Language
dc.contributor.author	李榮貴	en_US
dc.contributor.author	LI RONG-KWEI	en_US
dc.date.accessioned	2014-12-13T10:48:17Z	-
dc.date.available	2014-12-13T10:48:17Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2213-E009-046	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/101293	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=525220&docId=95517	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	二階式生產流程模式	zh_TW
dc.subject	半導體封裝業	zh_TW
dc.subject	批量流	zh_TW
dc.subject	現場流程管制系統	zh_TW
dc.subject	Two layer manufacturing process model	en_US
dc.subject	IC packaging industry	en_US
dc.subject	Batch flow	en_US
dc.subject	Shop floor control system	en_US
dc.title	以二階式生產流程模式構建半導體封裝現場流程管制系統	zh_TW
dc.title	A Two-Layer Manufacturing Process Model for the IC Packaging Shop Floor Control System	en_US
dc.type	Plan	en_US
dc.contributor.department	交通大學工業工程與管理系	zh_TW
Appears in Collections:	Research Plans

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