| 標題: | 驅動微波混成IC組裝技術至毫米波頻段(II) Moving Microwave Hybrid Integrated Circuit Assembly Technology toward Millimeter-Wave Regime (II) |
| 作者: | 莊晴光 TZUANG CHING-KUANG C 交通大學電信工程系 |
| 關鍵字: | 微波混成積體電路;組裝技術;Microwave hybrid integrated circuit;Assembly technology |
| 公開日期: | 2000 |
| 官方說明文件#: | NSC89-2213-E009-063 |
| URI: | http://hdl.handle.net/11536/101315 https://www.grb.gov.tw/search/planDetail?id=542274&docId=99630 |
| 顯示於類別： | 研究計畫 |
- 驅動微波混成IC組裝技術至毫米波頻段(I) / 莊晴光;TZUANG CHING-KUANG C
- 驅動微波混成IC組裝技術至毫米波頻段(III) / 莊晴光;TZUANG CHING-KUANG C
- Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation / Hsu, Li-Han;Kuylenstierna, Dan;Kozhuharov, Rumen;Gavell, Marcus;Karnfelt, Camilla
- Integrating passive components with active circuits using standard silicon process for millimeter-wave applications - (Invited paper) / Meng, Chinchun;Tseng, Sheng-Che
- Microwaves in the Asia-Pacific region / Yamashita, E;Bird, TS;Feng, ZH;Bhat, B;Akaike, M
- 毫米波高效率固態元件陣列研究---子計畫II：毫米波混光式固態電子矩陣波源(II) / 周復芳;JOU CHRISTINA FOH-FO
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