標題: 60GHz傳送接收器之覆晶多晶片模組構裝技術與設備開發計畫(II)
作者: 成維華
CHIENG WEI-HUA
國立交通大學機械工程學系(所)
公開日期: 2008
官方說明文件#: NSC97-2623-E009-002-IT
URI: http://hdl.handle.net/11536/101869
https://www.grb.gov.tw/search/planDetail?id=1653623&docId=283116
Appears in Collections:Research Plans


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