標題: | 60GHz傳送接收器之覆晶多晶片模組構裝技術與設備開發計畫(II) |
作者: | 成維華 CHIENG WEI-HUA 國立交通大學機械工程學系(所) |
公開日期: | 2008 |
官方說明文件#: | NSC97-2623-E009-002-IT |
URI: | http://hdl.handle.net/11536/101869 https://www.grb.gov.tw/search/planDetail?id=1653623&docId=283116 |
Appears in Collections: | Research Plans |
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