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dc.contributor.authorLin, Chih-Yangen_US
dc.contributor.authorWu, Chung-Yien_US
dc.contributor.authorWu, Chen-Yuen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.contributor.authorHu, Chenmingen_US
dc.date.accessioned2014-12-08T15:13:12Z-
dc.date.available2014-12-08T15:13:12Z-
dc.date.issued2007-11-01en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2802990en_US
dc.identifier.urihttp://hdl.handle.net/11536/10196-
dc.description.abstractThe influence of Ti top electrode material on the resistive switching properties of ZrO2-based memory film using Pt as bottom electrode was investigated in the present study. When Ti is used as top electrode, the resistive switching behavior becomes dependent on bias polarity and no current compliance is needed during switching into high conducting state. This phenomenon is attributed to the fact that a series resistance between Ti and ZrO2 film, composed of a TiOx layer, a ZrOy layer, and even the contact resistance, imposed a current compliance on the memory device. Besides, our experimental results imply that switching the device into high conducting state is a field driven process while switching back into low conducting state is a current driven process. (c) 2007 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleModified resistive switching behavior of ZrO2 memory films based on the interface layer formed by using Ti top electrodeen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2802990en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume102en_US
dc.citation.issue9en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000250983700065-
dc.citation.woscount71-
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