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dc.contributor.author陳智en_US
dc.contributor.author張元蔚en_US
dc.date.accessioned2014-12-16T06:12:17Z-
dc.date.available2014-12-16T06:12:17Z-
dc.date.issued2014-06-01en_US
dc.identifier.govdocG01R027/08zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/103564-
dc.language.isozh_TWen_US
dc.title凸塊接點之電阻測量結構及包含其之封裝基板zh_TW
dc.typePatentsen_US
dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI439704zh_TW
Appears in Collections:Patents


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