完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | 陳智 | en_US |
dc.contributor.author | 張元蔚 | en_US |
dc.date.accessioned | 2014-12-16T06:12:17Z | - |
dc.date.available | 2014-12-16T06:12:17Z | - |
dc.date.issued | 2014-06-01 | en_US |
dc.identifier.govdoc | G01R027/08 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/103564 | - |
dc.language.iso | zh_TW | en_US |
dc.title | 凸塊接點之電阻測量結構及包含其之封裝基板 | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | TWN | zh_TW |
dc.citation.patentnumber | I439704 | zh_TW |
顯示於類別: | 專利資料 |