Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 張翼 | en_US |
| dc.contributor.author | 張家達 | en_US |
| dc.contributor.author | 蕭世匡 | en_US |
| dc.date.accessioned | 2014-12-16T06:12:41Z | - |
| dc.date.available | 2014-12-16T06:12:41Z | - |
| dc.date.issued | 2010-07-01 | en_US |
| dc.identifier.govdoc | H01L021/027 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/103721 | - |
| dc.description.abstract | 本發明揭露一種以光阻熱回流處理技術於半導體基板上形成圖形的方法,藉由改善黃光微影技術,使用乾式蝕刻方法蝕刻出具有特定傾斜角度,具有平滑的蝕刻輪廓,具有均勻且具有高密度與高蝕刻深、寬之圖形化半導體基板。且以控制光阻熱回流技術之時間,可形成不同的圖形及間距,以達到半導體基板上之極小線寬的目的。 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 以光阻熱回流處理技術於半導體基板上形成圖形的方法 | zh_TW |
| dc.type | Patents | en_US |
| dc.citation.patentcountry | TWN | zh_TW |
| dc.citation.patentnumber | 201025417 | zh_TW |
| Appears in Collections: | Patents | |
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