標題: | Design and development of a new machine vision wire bonding inspection system |
作者: | Perng, Der-Baau Chou, Cheng-Chuan Lee, Shu-Ming 工業工程與管理學系 Department of Industrial Engineering and Management |
關鍵字: | machine vision;wire bonding inspection;lighting environment |
公開日期: | 1-九月-2007 |
摘要: | In this paper, we developed a fast and robust machine vision system for wire bonding inspection. The defects caused by a bonding wire being broken, lost, shifted, shorted, or sagged in an integrated circuit (IC) chip can be inspected automatically. A new lighting environment was devised which will highlight the slope of the bonding wire and suppress the background from being extracted. First, a set of machine vision algorithms were designed to filter out the defects of broken wire, lost wire, shifted wire, and shorted-out wire. Second, the 3-D type defect of sagged wire can be detected by inspecting the change of the bonding wire slope, derived from a single 2-D image. Some illustrations are given to show the efficiency and effectiveness of the proposed novel wire bonding vision inspection system. |
URI: | http://dx.doi.org/10.1007/s00170-006-0611-6 http://hdl.handle.net/11536/10410 |
ISSN: | 0268-3768 |
DOI: | 10.1007/s00170-006-0611-6 |
期刊: | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY |
Volume: | 34 |
Issue: | 3-4 |
起始頁: | 323 |
結束頁: | 334 |
顯示於類別: | 期刊論文 |