標題: Three-dimensional integrated circuit
作者: Tan An-Nan
Chen Hung-Ming
公開日期: 18-十一月-2014
摘要: A three-dimensional integrated circuit, including a first adhesive bonding layer, a first chip, a second chip, and an inter-stratum thermal pad, is provided. The first adhesive bonding layer has a first surface and a second surface opposite to each other. The first chip is disposed on the first surface of the first adhesive bonding layer. The first chip includes a hot zone. The second chip is disposed on the second surface of the first adhesive bonding layer. The inter-stratum thermal pad is embedded in the first adhesive bonding layer and faces to the hot zone.
官方說明文件#: H01L023/36
H01L023/367
H01L023/48
H01L025/065
H01L023/42
URI: http://hdl.handle.net/11536/104328
專利國: USA
專利號碼: 08890303
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